WIRELESS COMMUNICATION
Thin film production platforms and processes for wireless technologies
From high-performance RF switches to the latest 5G wireless devices, Evatec's evaporation and sputter platforms support a range of thin film processes for wireless communication applications. Our sputter processes and platforms cater to gap filling and planarization needs for temperature compensation of IDT structures. Additionally, our evaporation process specialists provide platforms and processes for "lift off" metallization in HBT and p-HEMT manufacturing. Furthermore, our piezoelectric specialists offer sputter deposition of high-performance piezoelectrics like AlScN for RF filter technology.
We ensure best-in-class thickness and stress uniformities for high production yields on wafer sizes up to 200mm.
You can read more about our thin film production solutions for Wireless applications in LAYERS (link to LAYERS 6).
THE EVATEC TOOL PORTFOLIO FOR WIRELESS
Choose from Evatec's platforms based on your process requirements, throughput, and factory integration needs.
Our experts are available to assist you in finding the right platforms tailored to your specifications. Alternatively, click on the photo links to explore each platform in detail.
BAW & SAW:
Our thin film processes using evaporation or sputter support the manufacture of low-loss RF filters for wireless communication applications. Our BAKs can be custom configured as split chamber extended throw systems for "lift off" or "Autoload" cassette-to-cassette handling whilst dedicated cathode technology on our CLUSTERLINE® 200 platform enables the deposition of piezoelectric materials such as AlN and AlScN with a highest degree of crystal orientation and controlled stress for resonators, reflectors and electrodes.
METALLIZATION PROCESSES
Evatec's evaporation platforms, optimized for mass production with high-quality process performance, deliver reduced precious metals consumption using proprietary software like Unicalc. Systems with extended throw are ideal for "lift off" process geometries, ensuring zero side wall coverage during subsequent film patterning steps.
Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.
From high-performance RF switches to the latest 5G wireless devices, Evatec's evaporation and sputter platforms support a range of thin film processes for wireless communication applications. Our sputter processes and platforms cater to gap filling and planarization needs for temperature compensation of IDT structures. Additionally, our evaporation process specialists provide platforms and processes for "lift off" metallization in HBT and p-HEMT manufacturing. Furthermore, our piezoelectric specialists offer sputter deposition of high-performance piezoelectrics like AlScN for RF filter technology.
We ensure best-in-class thickness and stress uniformities for high production yields on wafer sizes up to 200mm.
You can read more about our thin film production solutions for Wireless applications in LAYERS (link to LAYERS 6).
THE EVATEC TOOL PORTFOLIO FOR WIRELESS
Choose from Evatec's platforms based on your process requirements, throughput, and factory integration needs.
Our experts are available to assist you in finding the right platforms tailored to your specifications. Alternatively, click on the photo links to explore each platform in detail.
BAW & SAW:
Our thin film processes using evaporation or sputter support the manufacture of low-loss RF filters for wireless communication applications. Our BAKs can be custom configured as split chamber extended throw systems for "lift off" or "Autoload" cassette-to-cassette handling whilst dedicated cathode technology on our CLUSTERLINE® 200 platform enables the deposition of piezoelectric materials such as AlN and AlScN with a highest degree of crystal orientation and controlled stress for resonators, reflectors and electrodes.
METALLIZATION PROCESSES
Evatec's evaporation platforms, optimized for mass production with high-quality process performance, deliver reduced precious metals consumption using proprietary software like Unicalc. Systems with extended throw are ideal for "lift off" process geometries, ensuring zero side wall coverage during subsequent film patterning steps.
Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.