Ullenda voluptaspe natem. Ceped quam rem. Nemped que porehen ihilitatis quas endest etur alis as id quatium expelic imoluptatur repe dendere ribus, sam nonserferum nessit que vel maxim re porro od quam dolo dusaectore aperuptae qui volore, comnisquo tem incto blacepu digniet pra dit labo. Tis aspid et everfer ovidestis derro tem sedis eicabo. Optaspe rferia volesenes erro quam, sitatus solut quiatum res same atem hitiam vento is videbit velit deror autatem.
Ullenda voluptaspe natem. Ceped quam rem. Nemped que porehen ihilitatis quas endest etur alis as id quatium expelic imoluptatur repe dendere ribus, sam nonserferum nessit que vel maxim re porro od quam dolo dusaectore aperuptae qui volore, comnisquo tem incto blacepu digniet pra dit labo. Tis aspid et everfer ovidestis derro tem sedis eicabo. Optaspe rferia volesenes erro quam, sitatus solut quiatum res same atem hitiam vento is videbit velit deror autatem.
Ullenda voluptaspe natem. Ceped quam rem. Nemped que porehen ihilitatis quas endest etur alis as id quatium expelic imoluptatur repe dendere ribus, sam nonserferum nessit que vel maxim re porro od quam dolo dusaectore aperuptae qui volore, comnisquo tem incto blacepu digniet pra dit labo. Tis aspid et everfer ovidestis derro tem sedis eicabo. Optaspe rferia volesenes erro quam, sitatus solut quiatum res same atem hitiam vento is videbit velit deror autatem.
From cost effective process and production solutions for deposition of TCOs, metals and different types of DBR solutions, to AlN buffer layer deposition with highly sophisticated process control, Evatec offers a broad range of standard and customized systems. Evatec addresses the requirements for downsized future LED dimensions including passivation / protection processes (SiOX based) by optimized film uniformities,reduced particle levels and further improved process and tool stability for form factors up to 12 inch (e.g. with CLUSTERLINE® 300) and has been qualified by a number of fabs for the next generation micro LED / display technology.
THE EVATEC TOOL PORTFOLIO FOR
OPTOELECTRONICS
We offer evaporation, sputter and PECVD technologies on a range of batch, cluster or fully automated inline platforms.
Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.
BAK FAMILY
Industry standard evaporator platforms for metals deposition and "lift off" processes. "Autoload" option for fully automated cassette to cassette production on 6 or 8 inch.
CLUSTERLINE® 200
An optoelectronics workhorse at leading LED and Micro LED Display manufacturers. Production proven for deposition processes including metals, TCOs and DBRs.
CLUSTERLINE® 300
Semiconductor industry standard cluster tool offering high uniformity deposition and etch capability on 300mm substrates and know-how for applications including OLED on CMOS.
LLS EVO II
Vertical batch sputter platform with long market pedigree the guaranteeing lowest cost of ownership especially for metal deposition.
LED and Micro Display
Here is a taste of what Evatec can deliver
Current Spreading, Reflectors and Metal Contacts
We deliver proven processes for the deposition of TCOs, dielectrics and metals, tailoring our process packages for maximum light extraction according to each individual customers LED package design. Choose the BAK Evaporator with Autoload cassette-to-cassette handling for 6 and 8 inch. Alternatively the CLUSTERLINE® cluster platform equipped with batch process module technology offers plasma damage free low temperature sputter processing on GaN. To view the brochure click here. These same technologies also make "on chip" optical layer processing possible too.
AlN on Si or Sapphire
PVD growth of AlN buffer layers on Si or patterned Sapphire (PSS) on CLUSTERLINE® 200 enables subsequent defect free growth of GaN multi quantum wells (MQW) for manufacture of high brightness LEDs (HBLEDs) at reduced cost per lumen.
SiOx / SiN Passivation Layers and High Aspect Ratio
Addressing future needs for passivation of thin structures, Evatec offers PVD and PECVD based processes as well as solutions for high-aspect ratio coverage.
From cost effective process and production solutions for deposition of TCOs, metals and different types of DBR solutions, to AlN buffer layer deposition with highly sophisticated process control, Evatec offers a broad range of standard and customized systems. Evatec addresses the requirements for downsized future LED dimensions including passivation / protection processes (SiOX based) by optimized film uniformities,reduced particle levels and further improved process and tool stability for form factors up to 12 inch (e.g. with CLUSTERLINE® 300) and has been qualified by a number of fabs for the next generation micro LED / display technology.
THE EVATEC TOOL PORTFOLIO FOR
OPTOELECTRONICS
We offer evaporation, sputter and PECVD technologies on a range of batch, cluster or fully automated inline platforms.
Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.
LED and Micro Display
Here is a taste of what Evatec can deliver
Current Spreading, Reflectors and Metal Contacts
We deliver proven processes for the deposition of TCOs, dielectrics and metals, tailoring our process packages for maximum light extraction according to each individual customers LED package design. Choose the BAK Evaporator with Autoload cassette-to-cassette handling for 6 and 8 inch. Alternatively the CLUSTERLINE® cluster platform equipped with batch process module technology offers plasma damage free low temperature sputter processing on GaN. To view the brochure click here. These same technologies also make "on chip" optical layer processing possible too.
AlN on Si or Sapphire
PVD growth of AlN buffer layers on Si or patterned Sapphire (PSS) on CLUSTERLINE® 200 enables subsequent defect free growth of GaN multi quantum wells (MQW) for manufacture of high brightness LEDs (HBLEDs) at reduced cost per lumen.
SiOx / SiN Passivation Layers and High Aspect Ratio
Addressing future needs for passivation of thin structures, Evatec offers PVD and PECVD based processes as well as solutions for high-aspect ratio coverage.