HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering high speed degas, etch and metal deposition.
It's all about throughput
Parallel wafer transfer by synchronous indexer enables high speed wafer processing. Wafer carriers enable full face etch or deposition processes with in chamber wafer sensing for accurate, repeatable positioning time after time in 24/7 production. Reducing maintenance time is at the heart of HEXAGON’s design with simple carrier designs and powered source handling for rapid, easy access by a single operator.
Process Modules
Proven process capabilities come as standard when you choose HEXAGON
To read more about typical application examples and Evatec know-how in Advanced Packaging download the HEXAGON brochure or visit the news section of our web site.
HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering high speed degas, etch and metal deposition.
It's all about throughput
Parallel wafer transfer by synchronous indexer enables high speed wafer processing. Wafer carriers enable full face etch or deposition processes with in chamber wafer sensing for accurate, repeatable positioning time after time in 24/7 production. Reducing maintenance time is at the heart of HEXAGON’s design with simple carrier designs and powered source handling for rapid, easy access by a single operator.
Process Modules
Proven process capabilities come as standard when you choose HEXAGON
To read more about typical application examples and Evatec know-how in Advanced Packaging download the HEXAGON brochure or visit the news section of our web site.