LAYERS 8 – Power ICs: New Cu Frontside processes on 300mm

Learn why Evatec’s CLUSTERLINE® 300 is the ideal platform to satisfy the growing demand for 300mm processing and how Evatec process know-how is delivering high performance thick copper layers.

LAYERS 8 – Frontside Processes – Trench/Via filling & Planarization

Discover the latest trends and solutions in frontside contact formation for new power device technologies on Si or SiC, as shared by Evatec’s experts.

LAYERS 8 – Dynamic Dragons: Powering Through Asia with Our Prowess

Discover how Evatec's growth in Asia is driven by cutting-edge solutions and collaborative partnerships in LAYERS 8.

LAYERS 8 – Multi BAK – Pushing boundaries in evaporation technology

Learn in LAYERS 8 how the Multi BAK concept is enhancing process repeatability and throughput for high volume applications in wireless, power, and optoelectronics.

LAYERS 8 – CLUSTERLINE® 600 & next generation IC-substrates

LAYERS 8 – "Ship and Merge" Enhancing flexibility to meet customer demand

Find out more about our innovative manufacturing initiative at Evatec, how it works and why it means our customers will benefit.

LAYERS 8 – A powerhouse in III-V solar cells manufacturing

Discover the latest trends and solutions in frontside contact formation for new power device technologies on Si or SiC, as shared by Evatec’s experts.

LAYERS 8 - Navigating innovation: A conversation with our CTO

Our CTO, Dr. Carlo Tosi, shares insights into the innovation process at Evatec, how we help our customers, and why he's excited for the future. 

LAYERS 8 – Slowly but surely, Quantum Computing will transform industry and society

Explore the market potential and supply chain challenges for the successful launch of Quantum Computing Services in the next decade.

LAYERS 8 – PCB / IC-Substrate – Reducing the environmental impact

Discover in LAYERS 8 how AT&S and Evatec experts are reducing the CO2 footprint of PCB manufacturing through innovative material and process optimizations.

LAYERS 8 – A message from Andy Waelti

CEO Andy Waelti introduces our anniversary edition of LAYERS reflecting on the last 20 years and anticipating the next 20.

SAL collaboration on PEALD technology brings next generation Radio Frequency Front End (RFFE) components one step closer

Silicon Austria Labs (SAL) is announcing a collaboration with leading supplier Qualcomm Technologies, Inc., through their subsidiary RF360 Europe GmbH, and thin film technology partner Evatec Europe on development of PEALD and PVD technology for the manufacture of next generation RFFE components.

Evatec CLUSTERLINE® 200 & PEALD

Check out the partnership between CLUSTERLINE® 200 and Evatec PEALD! See in our new video how PEALD technology brings better conformality, precise thickness control, and repeatability at a great cost.

Release of LAYERS 8 - Celebrating two decades of innovation

Celebrate with us! Dive into LAYERS 8 for  interviews, stories about Evatec’s development, and the latest thin film technology in Semiconductor & Advanced Packaging and Compound & Photonics. 

Silicon Austria Labs enhances thin film technology with new PEALD module

Silicon Austria Labs (SAL) and Evatec collaborate to enhance thin film technology capabilities with the addition of a PEALD module at SAL’s Villach facility.

Evatec Collaborates with Onto Innovation in Panel Level Packaging Applications Center of Excellence

Read more about Evatec’s collaboration with Onto Innovation in the newly opened Packaging Applications Center of Excellence (PACE) here.

Breakthrough in Optical coatings: Magnetron Sputter Deposition of Amorphous Silicon–SiO2 Quantized Nanolaminates

Discover the quantum leap in optical materials with Evatec’s Principal Scientists Dr Silvia Schwyn Thoeny and Dr Stephan Waldner’s latest research on aSi-SiO2 Quantized Nanolaminates.

Evatec Partners with Silicon Austria Labs (SAL) for Innovative MEMS microspeakers

We are excited to announce a strategic collaboration with Silicon Austria Labs (SAL) and other industry partners. This joint effort aims to develop cutting-edge solutions for MEMS-based microspeakers.

Evatec Thin film technology is enabling global megatrends

Watch our latest video about global megatrends and discover how Evatec’s thin film production solutions support a changing world.

Relocation of the Evatec China Customer Service

Read about Evatec China's customer service relocation.

New Import EU Regulations

Read here our confirmation to the new Import EU Regulation for iron and steel imports.

LAYERS 7 – Edge Emitting Lasers – manufacturing challenges for new markets

Read about production solutions for the antireflection and high reflectivity coatings. 

New BAK Family brochure available

Read about the latest generation of BAK evaporators in our BAK Family brochure.

Great interest in Future Day 2023

20 young people visited Evatec at the future day 2023 to learn more about the company and our apprenticeships.

LAYERS 7 – Low temperature PVD deposition of low stress SiN and SiCN films for Hybrid Bonding applications

Intel’s and Evatec’s experts investigate the feasibility of high quality low stress SiN and SiCN film deposition on Evatec’s CLUSTERLINE®.

CLUSTERLINE® 200 BPM – Dynamic Sputter System

From Micro LED to Edge Emitting Lasers and RF filters, CLUSTERLINE® 200 BPM gives you gold medal winning performance in thin film deposition

LAYERS 7 – SiC – Powering ahead in Power Devices

Evatec’s experts remind us why Wide Band Gap (WBG) materials like SiC have an exciting role to play in emerging power device applications.

LAYERS 7 – Optoelectronics Insights

Jakob Bollhalder, Head of BU optoelectronics answers questions on the role of the industry going forward, the challenges it faces and how Evatec can contribute.

LAYERS 7 – Seeing the world in a new way – Welcome to Augmented Reality

Evatec’s experts introduce different Smart Glasses technologies and the cost effective thin film coating solutions on 200 or 300mm required for mass market application.

LAYERS 7- Towards perfection with the new HEXAGON

The new HEXAGON maintains the existing strengths of proven and reliable processes, high throughput and then offers significant improvements and innovations in the areas of process capabilities, throughput, uptime, accessibility and serviceability.

An interview with Evatec

Read the Interview with Kevin Chen, Head of Asia, and Henfy Su, Head of Sales, about the market development of China Compound Semiconductor and the Advanced Packaging Industry.

LAYERS 7 – Welcome to the world of ITO

Evatec’s experts talk us through some of the film ITO properties which can be influenced through deposition conditions.  

LAYERS 7 - Challenges In 3D IC and Heterogeneous Integration

Evatec’s experts illustrate just one example of the production solutions helping lead the way in  advanced CMOS fabs.

LAYERS 7 - Chiplets and the new era of Advanced Packaging

E. Jan Vardaman, President and Founder, TechSearch International Inc. reviews the state of play and the challenges ahead.

LAYERS 7 - a message from Andy Waelti

CEO Andy Waelti tells us actions taken by Evatec to be ready for whatever our customers demand in 2023 and introduces the new LAYERS magazine.

Helping you to help yourself

Training at your site, at our headquarters or remote online learning using “HOLOLENS” technology – the choice is yours  

LAYERS 7 - REACH OUT AND GET YOUR COPY NOW

The 7th edition of our thin film technology magazine “LAYERS” has just been released. Get a taste of what’s inside and order your copy now.

Evatec expands ISO accreditation

Evatec has just completed the reaccreditation process for both ISO 9001 and ISO 14001 until 2026. We are also proud to have gained ISO 45001 accreditation.

BAK 911 - a step up in output

Easier loading, better vacuum conditions and even higher repeatability – what’s not to like! Find out more.

ANDY WAELTI WINS AWARD

XPERIENCE SOFTWARE - Your Evatec tool on your desktop

XPERIENCE Simulator – Bring your Evatec tool to your desktop.  Using our XPERIENCE  simulator train your personnel, develop  and test process recipes  and familiarise yourself with new software updates before you work with them live.

"MADMAX" - the search for dark matter

Evatec’s CLUSTERLINE is supporting the search for dark matter in the European MADMAX project

THE MULTI BAK - LET THE REVOLUTION BEGIN

The MULTI BAK - Up to 4 process modules with all the load lock and handling you need for fully automated production.  Access the video now to find out more.

THE SKY’S THE LIMIT WITH CLUSTERLINE® 300

Kai Wenz, Senior Manager Development Projects for BU Semiconductor at Evatec, reveals the thinking behind the release of a new high performance front-end sputtering module on the latest variant of CLUSTERLINE® 300.

THE NEW HEXAGON IS HERE

The new HEXAGON is here.  Our new HEXAGON is the perfect choice for FOWLP, delivering the lowest Rc values at the best cost of ownership.

WHY OPTICAL MONITORING - THE NEW GSM

Optical monitoring technology is the perfect way to improve accuracy and process yields for production of high precision optical layers. Find out more

A NEW APPROACH IN VCSEL

Product Marketing Manager Dr. Chongqi Yu reviews the benefits of VCSEL technology for 3D sensing and other growing markets, and how Evatec's know-how can support VCSEL makers with the right thin film production solution.

ON SITE SUPPORT - HERE TO HELP

Having Evatec technicians to support you at your site is a great way to maintain and improve overall system performance and uptime. Find out more

COMING SOON - THE NEW HEXAGON

Evatec China - Expanding & relocating

To accommodate our growing business, we are pleased and excited to inform you that we are expanding our office area and relocating to a larger office with more facilities. Click here for more.

BIOMETRIC SENSING - DO I KNOW YOU?

Silvio Nigg, Product Marketing Manager at Evatec, talks about how our smartphones recognize us and what optical coatings are required.

CUSTOMER SERVICE - HOW CAN WE HELP YOU?

Evatec’s Head of Customer Service Thomas Germann runs through some examples of the latest new Customer Service solutions available in the Evatec tool box and gives us a taste of the future. 

GOING TO JAPAN

Evatec's Head of Strategic Sales & Marketing, Dr Reinhard Benz explains Evatec's approach to building the right organisation to support a growing business in Japan.

INDUSTRY GURU STEFFEN KROEHNERT TALKS

Industry guru, Steffen Kroehnert, shares his thoughts on the Advanced Packaging Industry and the emerging opportunities for Foundaries, IDMs and Suppliers. 

“Tuning” Perpendicular Magnetic Anisotropy

Find out how Facing Target Sputter technology delivers magnetic multilayers with optimum Perpendicular Magnetic Anisotropy without the need for post deposition anneal

BAK 941- MAKING THE GREAT EVEN BETTER

EVATEC- THE POWER UNSEEN

Meet some of the people behind the scenes at Evatec that help put the "power" in the "thin film powerhouse" 

Silicon Austria Labs pushes boundaries in PZT

Silicon Austria Labs ( SAL)  and Evatec push the boundaries in Lead Zirconium Titanate (PZT) technology.  Find out more. 

INSIGHTS - ADVANCED PACKAGING

Ralph Zoberbier, Head of BU Advanced Packaging, answers questions on the role of the industry going forwards, the challenges it faces and how Evatec can contribute.

HAMR - EXPANDING DATA STORAGE

Seagate’s Dr. Xiaoyue P. Huang and Dr. Michael C. Kautzky explain how thin film technology has helped pioneer the introduction of new drive technology  to provide a commercially viable path beyond the density limits of today’s perpendicular magnetic recording. 

Panel Level Packaging Consortium - The first Year

Despite the COVID-19 crisis Fraunhofer IZM and the 17 partners of the PLC 2.0 consortium including Evatec have achieved excellent results within the first year.  Click here to find out more about what they have been doing. 

TOOL RELOCATION - AT YOUR SERVICE

Need to move an existing Evatec tool ? Find out how we can help you relocate your Evatec tools in the most efficient way possible. 

HEALTH CHECK - FIND OUT HOW WE CAN HELP

Learn more about our health check services for your existing Evatec tool

Enabling next generation FOPLP

Fraunhofer IZM and Evatec co-operate on next generation  FO-PLP and IC-Substrate processing

SMART Center "fast-tracks" piezoelectrics

The Northeastern University SMART Center has added an Evatec CLUSTERLINE^® 200  to its nanofabrication capability

Evatec wins the Prix SVC Ostschweiz Award

Evatec is the winner of the Prix SVC Ostschweiz award

FOPLP - GET THE BROCHURE

SilTerra selects Evatec

SilTerra deploys Evatec’s CLUSTERLINE^® 200 for manufacturing high performance Piezo-MEMS devices.

Evatec wins SJ Semi award

Evatec Advanced Packaging group wins supplier award at SJ SEMICONDUCTOR CORPORATION.

SILICON NITRIDE PHOTONICS

Prix SVC Finalist News

Evatec is one of the 6 finalist for the Prix SVC (Swiss Venture Club) entrepreneur award.

Evatec & Disco Hi-Tec

Evatec and Disco Hi-Tec announce a partnership based around development of processes on Evatec’s CLUSTERLINE® 300 II.

SkyWater chooses Evatec

SkyWater has chosen CLUSTERLINE® 300 equipped with high performance evaporation technology for new process developments.