Plasma box
Choose Plasmabox for pinhole free, high purity films and simple reactor maintenance
Test Modal
Ullenda voluptaspe natem. Ceped quam rem. Nemped que porehen ihilitatis quas endest etur alis as id quatium expelic imoluptatur repe dendere ribus, sam nonserferum nessit que vel maxim re porro od quam dolo dusaectore aperuptae qui volore, comnisquo tem incto blacepu digniet pra dit labo. Tis aspid et everfer ovidestis derro tem sedis eicabo. Optaspe rferia volesenes erro quam, sitatus solut quiatum res same atem hitiam vento is videbit velit deror autatem.
From the smallest to the biggest- get an idea how many substrates our systems can hold in a single batch
Test Modal
Ullenda voluptaspe natem. Ceped quam rem. Nemped que porehen ihilitatis quas endest etur alis as id quatium expelic imoluptatur repe dendere ribus, sam nonserferum nessit que vel maxim re porro od quam dolo dusaectore aperuptae qui volore, comnisquo tem incto blacepu digniet pra dit labo. Tis aspid et everfer ovidestis derro tem sedis eicabo. Optaspe rferia volesenes erro quam, sitatus solut quiatum res same atem hitiam vento is videbit velit deror autatem.
Test Modal
Ullenda voluptaspe natem. Ceped quam rem. Nemped que porehen ihilitatis quas endest etur alis as id quatium expelic imoluptatur repe dendere ribus, sam nonserferum nessit que vel maxim re porro od quam dolo dusaectore aperuptae qui volore, comnisquo tem incto blacepu digniet pra dit labo. Tis aspid et everfer ovidestis derro tem sedis eicabo. Optaspe rferia volesenes erro quam, sitatus solut quiatum res same atem hitiam vento is videbit velit deror autatem.
Test Modal
Ullenda voluptaspe natem. Ceped quam rem. Nemped que porehen ihilitatis quas endest etur alis as id quatium expelic imoluptatur repe dendere ribus, sam nonserferum nessit que vel maxim re porro od quam dolo dusaectore aperuptae qui volore, comnisquo tem incto blacepu digniet pra dit labo. Tis aspid et everfer ovidestis derro tem sedis eicabo. Optaspe rferia volesenes erro quam, sitatus solut quiatum res same atem hitiam vento is videbit velit deror autatem.
Welcome to the
Thin Film Powerhouse
Thin film production solutions in
- Advanced Packaging
- Semiconductor
- Optoelectronics
- Photonics
The new generation CLUSTERLINE
More process capabilities, more configuration options, more productivity
LATEST COMPANY NEWS
3D & Systems Summit
calendar_today 1st - 3rd September 2021
mic
Maurus Tschirky
Another step ahead with novel solutions for AlScN and PZT deposition
Deriving the figures of merit for your specific function of the piezo-layer is key to creating a successful product. Stress and thickness uniformities are certainly part of it, but how you seed and nucleate, deciding what level of doping is required and understanding what trade-offs you face in production is just as important as film crystallinity. Evatec uses its know how by providing more than just “one size fits all” solutions and supports your full integration needs letting you concentrate on your entire device, rather than parts of it.
Mems World Summit EU
calendar_today 7th - 8th September 2021
mic
Maurus Tschirky
Combine and integrate – Solutions for Heterogeneous Integration
Sensing or creating physical stimuli requires mastering specific advanced functional materials beyond electronics and logic. Interference coatings for various wavelengths, minimised coercivity in magnetics, sensing, emitting or filtering sound or RF-waves using piezoelectrics are just some examples. Such solutions require know how in a full range of technologies such as PVD, PECVD and PEALD.
Evatec is able to use its 70 years of experience and long-standing partnerships with industrial and research institutions to support the development of tailored solutions for each customer. This approach will be illustrated through advances in PVD solutions for piezoelectrics.
CIOE
calendar_today 16th - 18th September 2021
I would like to book an appointment at the show CIOE
Sensors Coverage Expo
calendar_today 21st - 23rd September 2021
I would like to book an appointment at the show Sensors Coverage Expo
W3 + Fair
calendar_today 22nd - 23rd September 2021
mic
Silvio Nigg
Biometric Sensing – How does my smart phone recognises me?
For Biometric sensing and access control, high end optical thin films are key enablers for tomorrows technology that controls who can access your smart phone. In this world of “Smart Devices” where “Optics” and “Semiconductor” increasingly converge, in there is Evatec AG a leading solution provider that delivers precision thin film coating systems for such demanding products with outstanding accuracy at highest throughput. In this presentation we like you to find out how the next generation smart phones even more securely know “Ahh, it’s you”.
Semi Packaging Technology Seminar
calendar_today 28th - 29th September 2021
mic
Roland Rettenmeier
Are you ready for degassing, etching and sputtering seed layers on organic substrates?
Processing substrates with high organic load requires distinct process capabilities and well aligned process steps. Learn about the most important do’s and don'ts for vacuum processing of organic substrates and their impact on the final devices. Find out also how the challenges of transferring this know-how and technology from Wafer Level Packaging to Panel Level Packaging were solved.
V2021 Vakuum & Plasma
calendar_today 12th - 14th October 2021
mic
Edmund Schuengel
Going Digital- A leap forward for thin film coating
Going digital brings a whole array of opportunities for advances in development and operation of vacuum coating tools – from concept stage of a new tool design through to managing day to day process optimization and even reducing the risk of tool breakdown. The thin film production tools available from Evatec are becoming more and more powerful thanks to new opportunities enabled by digital data analysis. We demonstrate such improvements based on specific examples, such as the “digital twin”, machine network by IoT, and the “Holo-Lens” for service in an AR environment.
Optifab
calendar_today 18th - 21st October 2021
I would like to book an appointment at the show Optifab
Mems World Summit
calendar_today 19th - 20th October 2021
mic
Yuan Lu
Combine and integrate – Evatec is your partner
Take wearables as an example: sensing or creating physical stimuli requires dealing with energy and transducing it to various forms. Evatec offers all you need in terms of PVD, PECVD and PEALD for light processing within BU Photonics, for manufacturing micro-LEDs in BU Optoelectronics, for wirelessly connecting sensors and power devices within BU Semiconductors, and then how to integrate all this within BU Advanced Packaging. Evatec – your partner for the more than Moore industry.
CS International
calendar_today 9th - 10th November 2021
mic
Stefan Seifried
Highly uniform thin films and tool stability - key drivers for future LED display production
In mature LED production factors like costs of ownership plus technical drivers like LOP (light output) and forward voltage (Vf) have been dominant. For emerging technologies like Micro LED however, the focus is on other challenges right now at this relatively early stage: The much thinner structures make thickness uniformity across the wafer and repeatability from wafer to wafer and batch to batch critical. Structures typically two orders of magnitude smaller also necessitate even better control of any film defects to achieve the device yields that will be required. Production solutions addressing these challenges will be presented.
Semicon Europa
calendar_today 16th - 19th November 2021
mic
Fiodar Kurdzesau
Reducing cost of ownership – new high throughput “cluster” evaporation tools
Evaporation remains a powerful, flexible production technology for metallization and “lift off” process in wireless communication applications. However, manual wafer loading and the long conditioning, pumping/venting time characteristic of classical evaporation tools can make it difficult to achieve the increasingly demanding throughput and cost of ownership targets for emerging high-volume production businesses. Evatec’s innovative cluster design raises the performance bar allowing manufacturers to overcome that challenge. It combines automatic atmosphere loading with fast pumping/venting in loadlock, where a single robot for substrate handling serving up to four process chambers each equipped with its own loadlock module. The presentation will demonstrate the operation of a first BAK cluster evaporation production tool, discuss its performance, throughput and relative cost of ownership.
Semicon West
calendar_today 7th - 9th December 2021
I would like to book an appointment at the show Semicon West
Semicon Japan
calendar_today 15th - 17th December 2021
I would like to book an appointment at the show Semicon Japan
ASTC Advanced Semiconductor Technology Conference
calendar_today 13th - 14th January 2022
mic
Dr. Suresh
Optimized Solutions for FOWLP and FOPLP
In the last few years rapid advancement in both semiconductor process nodes as well as innovations in advanced packaging (in the form of chiplets and heterogenous integration) has been fuelled by increased demands in key areas like 5G, increased semiconductor content in vehicles through electrification and autonomous control, and also high performance computing. Here in Evatec, we are constantly working to provide optimized solutions to meet our customers/market roadmaps.
This paper outlines the key platforms and requirements/challenges for seed layer deposition on organic substrates. The panel or wafer with reconstituted dies have a multitude of different materials on them ranging from ABF, PI, epoxy mold compound, copper etc. Proper treatment of these material is key to ensuring excellent contact resistance and adhesion.
This paper outlines the key platforms and requirements/challenges for seed layer deposition on organic substrates. The panel or wafer with reconstituted dies have a multitude of different materials on them ranging from ABF, PI, epoxy mold compound, copper etc. Proper treatment of these material is key to ensuring excellent contact resistance and adhesion.
SPIE Photonics West
calendar_today 25th - 27th January 2022
I would like to book an appointment at the show SPIE Photonics West
IPC APEX EXPO 2022
calendar_today 25th - 27th January 2022
Sputtered Seed Layer on Substrates with High Organic Load
Advanced Packaging is a growing segment with strong technology advantages, supporting industry roadmaps. Sputtered seed layers (as a replacement for chemical seed layers) are opening a range of possibilities; thus OEM and manufacturers of next generation IC Substrate and Substrate-like PCBs are implementing sputtered seed layer as an enabling technology for smaller/more precise structures and improved reliability. Integrating new materials into packages – such as glass core with Through Glass Via (TGV) – and developing the next generation of Chiplet-Packages are interesting challenges that lay ahead. Processing substrates with high organic load requires distinct process capabilities. This presentation explains the important do’s and don'ts for vacuum processing of organic substrates and its impact on the final devices.
Semicon Korea 2022
calendar_today 9th - 11th February 2022
I would like to book an appointment at the show Semicon Korea 2022
Wafer-Level Packaging Symposium
calendar_today 15th - 17th February 2022
mic
Kenton Read
PVD Applications to Enable Heterogenous Integration
Advanced packaging has become a vital part of a device makers competitive advantage in the market. As IDM’s and fabless companies continue to develop new packaging designs, they are often running into unforeseen challenges in the back-end. PVD is a critical enabling technology for many integration schemes, and equipment suppliers like Evatec are responding to the challenges. Device designers can take advantage of this experience as they must find solutions for issues such as Resistance Budget from FET to Pad, Heat Dissipation of Thermal Loads and Cross Talk, Thin Die Roadmaps as well as Multi Die Packaging or Chiplet integration. This presentation is an overview of ENABLING technologies Evatec is developing to address technical and cost concerns.
IMAPS 18th International Conference and Exhibition on Device Packaging (DPC 2022)
calendar_today 7th - 10th March 2022
I would like to book an appointment at the show IMAPS 18th International Conference and Exhibition on Device Packaging (DPC 2022)
GOMACTech Conference
calendar_today 21st - 24th March 2022
I would like to book an appointment at the show GOMACTech Conference
SPIE Defense + Commercial Sensing 2022
calendar_today 3rd - 7th April 2022
I would like to book an appointment at the show SPIE Defense + Commercial Sensing 2022
OCLA 2022 Symposium
calendar_today 13th April 2022
Efficient process development based on the simulation of broadband and monochromatic optical monitor
Advanced optical monitoring systems offer the combination of broadband and monochromatic monitoring in one system. The question arises, which of a selection of strategies leads to the most error tolerant coating process. The simulation software “magnisSIMo” allows to compare the error tolerance of various monitoring strategies and to select the most stable strategy for production. Since the software mimics all the monitoring features of Evatec’s GSM optical monitoring system very closely, the software can also be used to assess the effect of various system settings such as measurement interval or signal noise by performing virtual coating runs including error propagation. This saves time and resources and is demonstrated by selected examples.
LASER World of PHOTONICS
calendar_today 26th - 29th April 2022
I would like to book an appointment at the show LASER World of PHOTONICS
CS Mantech
calendar_today 9th - 12th May 2022
mic
Andrea Mazzalai
Reducing cost of ownership for wireless - new cluster evaporation production tools
ECTC 2022
calendar_today 31st May - 3rd June 2022
I would like to book an appointment at the show ECTC 2022
Hilton Head Workshop 2022
calendar_today 5th - 9th June 2022
I would like to book an appointment at the show Hilton Head Workshop 2022
3D & Systems Summit
calendar_today 14th - 15th June 2022
I would like to book an appointment at the show 3D & Systems Summit
OIC Optical Interference Conference
calendar_today 19th - 24th June 2022
I would like to book an appointment at the show OIC Optical Interference Conference
Semicon SEA 2022
calendar_today 21st - 23rd June 2022
PVD Applications to Enable Heterogenous Integration
Advanced packaging has become a vital part of a device makers competitive advantage in the market. As IDM’s and fabless companies continue to develop new packaging designs, they are often running into unforeseen challenges in the back-end. PVD is a critical enabling technology for many integration schemes, and equipment suppliers like Evatec are responding to the challenges. Device designers can take advantage of this experience as they must find solutions for issues such as Resistance Budget from FET to Pad, Heat Dissipation of Thermal Loads and Cross Talk, Thin Die Roadmaps as well as Multi Die Packaging or Chiplet integration. This presentation is an overview of latest technologies enhancements to meet roadmap requirements.
CS International
calendar_today 28th - 29th June 2022
A novel GaN sputter solution for wide band gap (WBG) applications
Equipment manufacturers need to deliver new generations of thin film deposition systems with flexibility to address future requirements of GaN HEMT manufacturing process and reduce overall production costs.
Having a solid understanding of the material performance requirements, whether intended as a diffusion barrier, an ohmic contact or a Schottky barrier, is essential. This then provides the basis to configure production solutions delivering the specific electrical, mechanical, and structural properties needed for each particular layer in the GaN HEMT manufacturing process. Suitable combinations of process technologies can then be integrated into a single cluster platform for best production efficiency. Processes already characterized and tested thoroughly by the equipment manufacturer before final delivery ensures rapid start up and entry into production.
Having a solid understanding of the material performance requirements, whether intended as a diffusion barrier, an ohmic contact or a Schottky barrier, is essential. This then provides the basis to configure production solutions delivering the specific electrical, mechanical, and structural properties needed for each particular layer in the GaN HEMT manufacturing process. Suitable combinations of process technologies can then be integrated into a single cluster platform for best production efficiency. Processes already characterized and tested thoroughly by the equipment manufacturer before final delivery ensures rapid start up and entry into production.
Semicon West 2022
calendar_today 12th - 14th July 2022
I would like to book an appointment at the show Semicon West 2022
MEMS & Imaging Sensors Summit
calendar_today 6th - 7th September 2022
I would like to book an appointment at the show MEMS & Imaging Sensors Summit
ESTC 2022
calendar_today 13th - 16th September 2022
I would like to book an appointment at the show ESTC 2022
SEMICON Taiwan 2022
calendar_today 14th - 16th September 2022
I would like to book an appointment at the show SEMICON Taiwan 2022
Taiwan International Semiconductor Executive Summit TISES
calendar_today 11th - 12th October 2022
Advanced Ti+Cu Seed Sputter Technologies for Glass Substrates with Through Glass Via and Through G
With increased bandwidth requirements for commercial, high performance computing and artificial intelligence applications, there is a need to increase the IO density of fine line features, small microvias and low-K dielectrics in future IC-Substrates and interposers. While BEOL processing has enabled achieving very high-density interconnects in Silicon-based integration systems on wafer level - like Intel’s EMIB technology with BEOL techniques has accomplished 225 IOs/mm/layer with < 2 mm L/S., panel scale packaging using m-SAP and SAP RDL, could only accommodate <50 IOs/mm/layer. The near-future needs of the advanced technologies should be able to overcome the shortcomings of the current interposer technologies that include: 1) low-K materials with dielectric constants much lower than that of SiO2, 2) ability to support data rates greater than 10 Gbps with low resistance and capacitance, 3) low cost panel scale processes with potential to increase fine line features and scale up substrates sizes. Evatec has carried out extensive research together with Institutes and Cooperation partner on new materials and process developments along with their optimization on glass substrates as a viable low cost technology for next generation IC-Substrates and large interposers. This work presents a review of the current Ti+Cu Seed Sputter technologies with their capabilities and limits. As well as strategies that have the potential to enable future design rules and ideas.
Optatec
Semicon Europa 2022
calendar_today 15th - 18th November 2022
I would like to book an appointment at the show Semicon Europa 2022
W3+ Fair
calendar_today 30th November - 1st December 2022
I would like to book an appointment at the show W3+ Fair
SEMICON Japan 2022
calendar_today 14th - 16th December 2022
I would like to book an appointment at the show SEMICON Japan 2022
SPIE Photonics West 2023
calendar_today 28th January - 2nd February 2023
I would like to book an appointment at the show SPIE Photonics West 2023
Semicon Korea 2023
calendar_today 1st - 3rd February 2023
I would like to book an appointment at the show Semicon Korea 2023
IMAPS 19th International Conference and Exhibition on Device Packaging (DPC 2023)
calendar_today 13th - 16th March 2023
I would like to book an appointment at the show IMAPS 19th International Conference and Exhibition on Device Packaging (DPC 2023)
GOMACTech 2023
calendar_today 20th - 23rd March 2023
I would like to book an appointment at the show GOMACTech 2023
CS International Brussels
calendar_today 18th - 19th April 2023
Thin film layers for the upcoming micro-LED displays – the race never stops!
A lot has changed since Evatec first presented potential production solutions for the upcoming Micro LED technology two years ago. With a much greater understanding of the practical manufacturing challenges we are just a short step away from seeing the first mass production applications of micro LED displays. Working together with technology leaders has helped us optimize new approaches in thin film production technology. Solutions will be presented offering increased automation with less human intervention. Full substrate tracking, a stable process environment and improved sputter and evaporation process performance are all part of the essential recipe for success. Performance is the key to make micro LED competitive against the current solutions mostly covered by OLED and mini LED.
SPIE. Defense + Commercial Sensing
SVC TechCon 2023
calendar_today 8th - 11th May 2023
Highly Ionized Pulse Sputter Deposition for Through Silicon Vias filling by Dominic Jaeger
Step Up Thin Film Coating Productivity Using Smart Control and High-Level Automation by Edmund Schuengel
Taiwan International Semiconductor Executive Summit TISES
calendar_today 9th - 10th May 2023
Thinfilm technology for heat dissipation layers in HPC applications by Ralph Zoberbier
Intermag
calendar_today 15th - 19th May 2023
mic
Claudiu V. Falub
Scaling the manufacturing of soft magnetic inductor cores for power conversion applications from 8-inch to 12-inch wafers
CS Mantech - International Conference on Compound Semiconductor Manufacturing Technology
calendar_today 15th - 18th May 2023
I would like to book an appointment at the show CS Mantech - International Conference on Compound Semiconductor Manufacturing Technology
ICMCTF 2023
calendar_today 21st - 26th May 2023
Clemens Nyffeler: Mon. 22.5. 11:20 Session F5
Jürgen Weichart: Thu. 25.5. 11:00 Session B8
Jörg Patscheider: Tue. 23.5. 19:00 Special Interest session II
IEEE Glass Packaging Workshop
calendar_today 23rd - 24th May 2023
mic
Roland Rettenmeier
Advanced Sputter Technologies for Glass Substrates with Through Glass Via and Through Glass Cavities as well as Low-K Polymer Laminated Glass Substrates
Semicon SEA 2023
calendar_today 23rd - 25th May 2023
mic
Dr. Suresh Kumar Singaram
ECTC 2023
calendar_today 30th May - 2nd June 2023
mic
Carl Drechsel
Optimum Rc Control and Productivity Boost in Wafer-Level Packaging Enabled by High-Throughput UBM/RDL Technology
MEMS World Summit EU
calendar_today 13th - 14th June 2023
mic
Maurus Tschirky
EVATEC – Mastering Deposition Technologies from Core to Package
3D & Systems Summit 2023
calendar_today 26th - 28th June 2023
mic
Roland Rettenmeier
Thin film technology for Heat Dissipation layers in high performance computing applications
LASER World of PHOTONICS
calendar_today 27th - 30th June 2023
I would like to book an appointment at the show LASER World of PHOTONICS
SEMICON China 2023
calendar_today 29th June - 1st July 2023
I would like to book an appointment at the show SEMICON China 2023
Semicon West 2023
calendar_today 11th - 13th July 2023
I would like to book an appointment at the show Semicon West 2023
CIOE 2023
calendar_today 6th - 8th September 2023
I would like to book an appointment at the show CIOE 2023
Semicon Taiwan 2023
calendar_today 6th - 8th September 2023
I would like to book an appointment at the show Semicon Taiwan 2023
EU Power Semiconductor Executive Summit (EU PSES)
calendar_today 14th - 15th September 2023
mic
Vinoth Sundaramoorthy
Thin film solutions for wide bangap device processing
SPIE Laser Damage
calendar_today 17th - 20th September 2023
mic
Dr. Silvia Schwyn Thoeny
Quantized nanolaminates of Ta2O5-SiO2 and amorphous silicon-SiO2 manufactured by magnetron sputter d
V2023 - Vacuum & Plasma
calendar_today 19th - 21st September 2023
mic
Dr. Edmund Schüngel
How digitalization changes our coating systems and the way we use them
PwrSoc (Power Supply on Chip)
calendar_today 27th - 29th September 2023
mic
Claudiu V. Falub
Manufacturing Soft Magnetic Multilayers on 300 mm Wafers for PwrSoC Applications
SPIE Optifab 2023
calendar_today 16th - 19th October 2023
I would like to book an appointment at the show SPIE Optifab 2023
ISMP 2023
calendar_today 25th - 27th October 2023
mic
Stanley Low
Backside Metal Films for Heat Dissipation in HPC Packages
Semicon Europa 2023
calendar_today 14th - 17th November 2023
I would like to book an appointment at the show Semicon Europa 2023
MEMS World Summit China
calendar_today 1st December 2023
mic
Yuan Lu
EVATEC – Mastering Deposition Technologies from CORE to PACKAGE
Hear us speak and join us at the Panel Discussion - China Collaboration in MEMS Solutions Opportunities and Challenges
Evatec's contribution to the Panel Discussion will focus on Heterogeneous Integration which requires knowledge in functional layers within the dies, along with expertise in Advanced Packaging. Whereas the first part is genuinely core competence of Evatec for piezoelectric sensing or actuating elements, we also have a strong footprint in the AP court. The interdisciplinary approach is of the essence there, for instance in heat dissipation, magnetic shielding, or stress compensation. Mastering the 3rd dimension is also common for both MEMS and AP, where TSVs are elementary.
A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.
A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.
EPTC 2023 IEEE
calendar_today 5th - 8th December 2023
mic
Suresh Singaram
Backside Metallization for LogicApplications
HPC (High Performance Computing) is a powerful tool that can be applied to solve intricate problems and overcome obstacles in diverse areas such as life science, environmental sciences, industrial and finance. To achieve high computing power, cutting-edge system-onchips (SOCs) or next generation advanced packaging technologies are utilized to integrate processors, memory, and storage either on die or at the package level. However, a critical hurdle in these technologies is to effectively manage the heat generated in order to preserve computing performance and power efficiency. In this context, we will discuss the challenges and present latest progress in thin film deposition of a solderable layer stack deposition on the wafer backside to allow a perfect, reliable connection to the thermal interface material (TIM) . This back side metal (BSM) stack has not only to meet excellent adhesion and solderability, but also minimum film stress requirements and compatibility to limited process temperature budgets imposed by increasingly popular Electronic Mold Compound or EMC substrates applications.
Semicon Japan 2023
calendar_today 14th - 16th December 2023
I would like to book an appointment at the show Semicon Japan 2023
Photonics West 2024
calendar_today 27th January - 1st February 2024
I would like to book an appointment at the show Photonics West 2024
Semicon Korea 2024
calendar_today 31st January - 2nd February 2024
I would like to book an appointment at the show Semicon Korea 2024
ISPEC 2024 (Indian Semiconductor and Packaging Ecosystem Conference)
calendar_today 29th February - 2nd March 2024
I would like to book an appointment at the show ISPEC 2024 (Indian Semiconductor and Packaging Ecosystem Conference)
Asia Photonics Expo 2024
calendar_today 6th - 8th March 2024
I would like to book an appointment at the show Asia Photonics Expo 2024
IMAPS 2024 - Device Packaging
calendar_today 18th - 21st March 2024
mic
Roland Rettenmeier
Back Side Metalization for High Performance Computing
PiezoMems 2024
calendar_today 19th - 20th March 2024
mic
Volker Roebisch
Beyond 30 at.% Sc doping for manufacturing-ready, highly uniform, stress neutral Al1-xScxN layers
Semicon China 2024
calendar_today 20th - 22nd March 2024
I would like to book an appointment at the show Semicon China 2024
OCLA Symposium 2024
calendar_today 16th April 2024
I would like to book an appointment at the show OCLA Symposium 2024
SPIE Defense + Commercial Sensing 2024
calendar_today 23rd - 25th April 2024
I would like to book an appointment at the show SPIE Defense + Commercial Sensing 2024
MSTC 2024 (MEMS & Sensors Technical Congress)
calendar_today 1st - 2nd May 2024
I would like to book an appointment at the show MSTC 2024 (MEMS & Sensors Technical Congress)
Optatec 2024
calendar_today 14th - 16th May 2024
I would like to book an appointment at the show Optatec 2024
CS Mantech 2024
calendar_today 20th - 23rd May 2024
mic
Oguz Yildirim
Beyond 30 at.% Sc doping for manufacturing-ready highly uniform, stress neutral Al1-xScxN layers on
Semicon SEA 2024
calendar_today 28th - 30th May 2024
I would like to book an appointment at the show Semicon SEA 2024
Upcoming Events
1st - 3rd September 2021
add
7th - 8th September 2021
add
16th - 18th September 2021
Shenzhen
add
21st - 23rd September 2021
San Jose
add
22nd - 23rd September 2021
Dornbirn
add
28th - 29th September 2021
Berg
add
12th - 14th October 2021
Dresden
add
18th - 21st October 2021
Rochester New York
add
19th - 20th October 2021
Shanghai
add
9th - 10th November 2021
Brussels
add
16th - 19th November 2021
Munich
add
7th - 9th December 2021
San Francisco
add
15th - 17th December 2021
Tokyo
add
13th - 14th January 2022
Singapore
add
ASTC Advanced Semiconductor Technology Conference
Hear us speak
add
25th - 27th January 2022
San Francisco
add
25th - 27th January 2022
San Diego
add
9th - 11th February 2022
Seoul
add
15th - 17th February 2022
San Jose
add
7th - 10th March 2022
Fountain Hills
add
IMAPS 18th International Conference and Exhibition on Device Packaging (DPC 2022)
Visit us at booth #
add
21st - 24th March 2022
Miami
add
3rd - 7th April 2022
Orlando
add
SPIE Defense + Commercial Sensing 2022
Visit us at booth #1222
add
13th April 2022
Buchs
add
26th - 29th April 2022
Munich
add
9th - 12th May 2022
Monterey
add
31st May - 3rd June 2022
San Diego
add
5th - 9th June 2022
Hilton Head
add
14th - 15th June 2022
Dresden
add
19th - 24th June 2022
Whistler
add
21st - 23rd June 2022
Penang
add
28th - 29th June 2022
Brussels
add
12th - 14th July 2022
San Francisco
add
6th - 7th September 2022
Grenoble
add
13th - 16th September 2022
add
14th - 16th September 2022
Taipei
add
11th - 12th October 2022
Taipei
add
Taiwan International Semiconductor Executive Summit TISES
Hear us speak
add
15th - 18th November 2022
Munich
add
30th November - 1st December 2022
Dornbirn
add
14th - 16th December 2022
Tokyo
add
28th January - 2nd February 2023
San Francisco
add
1st - 3rd February 2023
Seoul
add
13th - 16th March 2023
Fountain Hills
add
IMAPS 19th International Conference and Exhibition on Device Packaging (DPC 2023)
Visit us at booth #35
add
20th - 23rd March 2023
San Diego
add
18th - 19th April 2023
Brussels
add
30th April - 4th May 2023
Orlando
add
8th - 11th May 2023
Washington
add
9th - 10th May 2023
Taipei
add
Taiwan International Semiconductor Executive Summit TISES
Hear us speak
add
15th - 19th May 2023
Sendai
add
15th - 18th May 2023
Orlando
add
CS Mantech - International Conference on Compound Semiconductor Manufacturing Technology
Visit us at booth #305
add
21st - 26th May 2023
San Diego
add
23rd - 24th May 2023
Atlanta
add
23rd - 25th May 2023
Penang
add
30th May - 2nd June 2023
Orlando
add
13th - 14th June 2023
Porto
add
26th - 28th June 2023
Dresden
add
27th - 30th June 2023
Munich
add
29th June - 1st July 2023
Shanghai
add
11th - 13th July 2023
San Fransico
add
Semicon West 2023
Visit us at booth #1060 in the South Hall
add
6th - 8th September 2023
Shenzhen
add
6th - 8th September 2023
Taipei
add
14th - 15th September 2023
Lake Maggiore
add
EU Power Semiconductor Executive Summit (EU PSES)
Hear us speak
add
17th - 20th September 2023
Livermore, CA
add
19th - 21st September 2023
Dresden
add
27th - 29th September 2023
Hannover
add
16th - 19th October 2023
Rochester
add
25th - 27th October 2023
Busan
add
14th - 17th November 2023
Munich
add
1st December 2023
Shanghai
add
5th - 8th December 2023
Singapore
add
14th - 16th December 2023
Tokyo
add
27th January - 1st February 2024
San Fransisco
add
31st January - 2nd February 2024
Seoul
add
29th February - 2nd March 2024
Mohali, Punjab
add
ISPEC 2024 (Indian Semiconductor and Packaging Ecosystem Conference)
Visit us at booth #3
add
6th - 8th March 2024
Marina Bay Sands
add
18th - 21st March 2024
Fountain Hills, AZ
add
19th - 20th March 2024
Aachen
add
20th - 22nd March 2024
Shanghai
add
16th April 2024
Buchs
add
23rd - 25th April 2024
Maryland
add
SPIE Defense + Commercial Sensing 2024
Visit us at booth #727
add
1st - 2nd May 2024
Los Angeles
add
MSTC 2024 (MEMS & Sensors Technical Congress)
Visit us at booth #
add
14th - 16th May 2024
Frankfurt
add
20th - 23rd May 2024
Tucson, AZ
add
28th - 30th May 2024
Singapore
add
LATEST COMPANY NEWS
3D & Systems Summit
calendar_today 1st - 3rd September 2021
mic
Maurus Tschirky
Another step ahead with novel solutions for AlScN and PZT deposition
Deriving the figures of merit for your specific function of the piezo-layer is key to creating a successful product. Stress and thickness uniformities are certainly part of it, but how you seed and nucleate, deciding what level of doping is required and understanding what trade-offs you face in production is just as important as film crystallinity. Evatec uses its know how by providing more than just “one size fits all” solutions and supports your full integration needs letting you concentrate on your entire device, rather than parts of it.
Mems World Summit EU
calendar_today 7th - 8th September 2021
mic
Maurus Tschirky
Combine and integrate – Solutions for Heterogeneous Integration
Sensing or creating physical stimuli requires mastering specific advanced functional materials beyond electronics and logic. Interference coatings for various wavelengths, minimised coercivity in magnetics, sensing, emitting or filtering sound or RF-waves using piezoelectrics are just some examples. Such solutions require know how in a full range of technologies such as PVD, PECVD and PEALD.
Evatec is able to use its 70 years of experience and long-standing partnerships with industrial and research institutions to support the development of tailored solutions for each customer. This approach will be illustrated through advances in PVD solutions for piezoelectrics.
CIOE
calendar_today 16th - 18th September 2021
I would like to book an appointment at the show CIOE
Sensors Coverage Expo
calendar_today 21st - 23rd September 2021
I would like to book an appointment at the show Sensors Coverage Expo
W3 + Fair
calendar_today 22nd - 23rd September 2021
mic
Silvio Nigg
Biometric Sensing – How does my smart phone recognises me?
For Biometric sensing and access control, high end optical thin films are key enablers for tomorrows technology that controls who can access your smart phone. In this world of “Smart Devices” where “Optics” and “Semiconductor” increasingly converge, in there is Evatec AG a leading solution provider that delivers precision thin film coating systems for such demanding products with outstanding accuracy at highest throughput. In this presentation we like you to find out how the next generation smart phones even more securely know “Ahh, it’s you”.
Semi Packaging Technology Seminar
calendar_today 28th - 29th September 2021
mic
Roland Rettenmeier
Are you ready for degassing, etching and sputtering seed layers on organic substrates?
Processing substrates with high organic load requires distinct process capabilities and well aligned process steps. Learn about the most important do’s and don'ts for vacuum processing of organic substrates and their impact on the final devices. Find out also how the challenges of transferring this know-how and technology from Wafer Level Packaging to Panel Level Packaging were solved.
V2021 Vakuum & Plasma
calendar_today 12th - 14th October 2021
mic
Edmund Schuengel
Going Digital- A leap forward for thin film coating
Going digital brings a whole array of opportunities for advances in development and operation of vacuum coating tools – from concept stage of a new tool design through to managing day to day process optimization and even reducing the risk of tool breakdown. The thin film production tools available from Evatec are becoming more and more powerful thanks to new opportunities enabled by digital data analysis. We demonstrate such improvements based on specific examples, such as the “digital twin”, machine network by IoT, and the “Holo-Lens” for service in an AR environment.
Optifab
calendar_today 18th - 21st October 2021
I would like to book an appointment at the show Optifab
Mems World Summit
calendar_today 19th - 20th October 2021
mic
Yuan Lu
Combine and integrate – Evatec is your partner
Take wearables as an example: sensing or creating physical stimuli requires dealing with energy and transducing it to various forms. Evatec offers all you need in terms of PVD, PECVD and PEALD for light processing within BU Photonics, for manufacturing micro-LEDs in BU Optoelectronics, for wirelessly connecting sensors and power devices within BU Semiconductors, and then how to integrate all this within BU Advanced Packaging. Evatec – your partner for the more than Moore industry.
CS International
calendar_today 9th - 10th November 2021
mic
Stefan Seifried
Highly uniform thin films and tool stability - key drivers for future LED display production
In mature LED production factors like costs of ownership plus technical drivers like LOP (light output) and forward voltage (Vf) have been dominant. For emerging technologies like Micro LED however, the focus is on other challenges right now at this relatively early stage: The much thinner structures make thickness uniformity across the wafer and repeatability from wafer to wafer and batch to batch critical. Structures typically two orders of magnitude smaller also necessitate even better control of any film defects to achieve the device yields that will be required. Production solutions addressing these challenges will be presented.
Semicon Europa
calendar_today 16th - 19th November 2021
mic
Fiodar Kurdzesau
Reducing cost of ownership – new high throughput “cluster” evaporation tools
Evaporation remains a powerful, flexible production technology for metallization and “lift off” process in wireless communication applications. However, manual wafer loading and the long conditioning, pumping/venting time characteristic of classical evaporation tools can make it difficult to achieve the increasingly demanding throughput and cost of ownership targets for emerging high-volume production businesses. Evatec’s innovative cluster design raises the performance bar allowing manufacturers to overcome that challenge. It combines automatic atmosphere loading with fast pumping/venting in loadlock, where a single robot for substrate handling serving up to four process chambers each equipped with its own loadlock module. The presentation will demonstrate the operation of a first BAK cluster evaporation production tool, discuss its performance, throughput and relative cost of ownership.
Semicon West
calendar_today 7th - 9th December 2021
I would like to book an appointment at the show Semicon West
Semicon Japan
calendar_today 15th - 17th December 2021
I would like to book an appointment at the show Semicon Japan
ASTC Advanced Semiconductor Technology Conference
calendar_today 13th - 14th January 2022
mic
Dr. Suresh
Optimized Solutions for FOWLP and FOPLP
In the last few years rapid advancement in both semiconductor process nodes as well as innovations in advanced packaging (in the form of chiplets and heterogenous integration) has been fuelled by increased demands in key areas like 5G, increased semiconductor content in vehicles through electrification and autonomous control, and also high performance computing. Here in Evatec, we are constantly working to provide optimized solutions to meet our customers/market roadmaps.
This paper outlines the key platforms and requirements/challenges for seed layer deposition on organic substrates. The panel or wafer with reconstituted dies have a multitude of different materials on them ranging from ABF, PI, epoxy mold compound, copper etc. Proper treatment of these material is key to ensuring excellent contact resistance and adhesion.
This paper outlines the key platforms and requirements/challenges for seed layer deposition on organic substrates. The panel or wafer with reconstituted dies have a multitude of different materials on them ranging from ABF, PI, epoxy mold compound, copper etc. Proper treatment of these material is key to ensuring excellent contact resistance and adhesion.
SPIE Photonics West
calendar_today 25th - 27th January 2022
I would like to book an appointment at the show SPIE Photonics West
IPC APEX EXPO 2022
calendar_today 25th - 27th January 2022
Sputtered Seed Layer on Substrates with High Organic Load
Advanced Packaging is a growing segment with strong technology advantages, supporting industry roadmaps. Sputtered seed layers (as a replacement for chemical seed layers) are opening a range of possibilities; thus OEM and manufacturers of next generation IC Substrate and Substrate-like PCBs are implementing sputtered seed layer as an enabling technology for smaller/more precise structures and improved reliability. Integrating new materials into packages – such as glass core with Through Glass Via (TGV) – and developing the next generation of Chiplet-Packages are interesting challenges that lay ahead. Processing substrates with high organic load requires distinct process capabilities. This presentation explains the important do’s and don'ts for vacuum processing of organic substrates and its impact on the final devices.
Semicon Korea 2022
calendar_today 9th - 11th February 2022
I would like to book an appointment at the show Semicon Korea 2022
Wafer-Level Packaging Symposium
calendar_today 15th - 17th February 2022
mic
Kenton Read
PVD Applications to Enable Heterogenous Integration
Advanced packaging has become a vital part of a device makers competitive advantage in the market. As IDM’s and fabless companies continue to develop new packaging designs, they are often running into unforeseen challenges in the back-end. PVD is a critical enabling technology for many integration schemes, and equipment suppliers like Evatec are responding to the challenges. Device designers can take advantage of this experience as they must find solutions for issues such as Resistance Budget from FET to Pad, Heat Dissipation of Thermal Loads and Cross Talk, Thin Die Roadmaps as well as Multi Die Packaging or Chiplet integration. This presentation is an overview of ENABLING technologies Evatec is developing to address technical and cost concerns.
IMAPS 18th International Conference and Exhibition on Device Packaging (DPC 2022)
calendar_today 7th - 10th March 2022
I would like to book an appointment at the show IMAPS 18th International Conference and Exhibition on Device Packaging (DPC 2022)
GOMACTech Conference
calendar_today 21st - 24th March 2022
I would like to book an appointment at the show GOMACTech Conference
SPIE Defense + Commercial Sensing 2022
calendar_today 3rd - 7th April 2022
I would like to book an appointment at the show SPIE Defense + Commercial Sensing 2022
OCLA 2022 Symposium
calendar_today 13th April 2022
Efficient process development based on the simulation of broadband and monochromatic optical monitor
Advanced optical monitoring systems offer the combination of broadband and monochromatic monitoring in one system. The question arises, which of a selection of strategies leads to the most error tolerant coating process. The simulation software “magnisSIMo” allows to compare the error tolerance of various monitoring strategies and to select the most stable strategy for production. Since the software mimics all the monitoring features of Evatec’s GSM optical monitoring system very closely, the software can also be used to assess the effect of various system settings such as measurement interval or signal noise by performing virtual coating runs including error propagation. This saves time and resources and is demonstrated by selected examples.
LASER World of PHOTONICS
calendar_today 26th - 29th April 2022
I would like to book an appointment at the show LASER World of PHOTONICS
CS Mantech
calendar_today 9th - 12th May 2022
mic
Andrea Mazzalai
Reducing cost of ownership for wireless - new cluster evaporation production tools
ECTC 2022
calendar_today 31st May - 3rd June 2022
I would like to book an appointment at the show ECTC 2022
Hilton Head Workshop 2022
calendar_today 5th - 9th June 2022
I would like to book an appointment at the show Hilton Head Workshop 2022
3D & Systems Summit
calendar_today 14th - 15th June 2022
I would like to book an appointment at the show 3D & Systems Summit
OIC Optical Interference Conference
calendar_today 19th - 24th June 2022
I would like to book an appointment at the show OIC Optical Interference Conference
Semicon SEA 2022
calendar_today 21st - 23rd June 2022
PVD Applications to Enable Heterogenous Integration
Advanced packaging has become a vital part of a device makers competitive advantage in the market. As IDM’s and fabless companies continue to develop new packaging designs, they are often running into unforeseen challenges in the back-end. PVD is a critical enabling technology for many integration schemes, and equipment suppliers like Evatec are responding to the challenges. Device designers can take advantage of this experience as they must find solutions for issues such as Resistance Budget from FET to Pad, Heat Dissipation of Thermal Loads and Cross Talk, Thin Die Roadmaps as well as Multi Die Packaging or Chiplet integration. This presentation is an overview of latest technologies enhancements to meet roadmap requirements.
CS International
calendar_today 28th - 29th June 2022
A novel GaN sputter solution for wide band gap (WBG) applications
Equipment manufacturers need to deliver new generations of thin film deposition systems with flexibility to address future requirements of GaN HEMT manufacturing process and reduce overall production costs.
Having a solid understanding of the material performance requirements, whether intended as a diffusion barrier, an ohmic contact or a Schottky barrier, is essential. This then provides the basis to configure production solutions delivering the specific electrical, mechanical, and structural properties needed for each particular layer in the GaN HEMT manufacturing process. Suitable combinations of process technologies can then be integrated into a single cluster platform for best production efficiency. Processes already characterized and tested thoroughly by the equipment manufacturer before final delivery ensures rapid start up and entry into production.
Having a solid understanding of the material performance requirements, whether intended as a diffusion barrier, an ohmic contact or a Schottky barrier, is essential. This then provides the basis to configure production solutions delivering the specific electrical, mechanical, and structural properties needed for each particular layer in the GaN HEMT manufacturing process. Suitable combinations of process technologies can then be integrated into a single cluster platform for best production efficiency. Processes already characterized and tested thoroughly by the equipment manufacturer before final delivery ensures rapid start up and entry into production.
Semicon West 2022
calendar_today 12th - 14th July 2022
I would like to book an appointment at the show Semicon West 2022
MEMS & Imaging Sensors Summit
calendar_today 6th - 7th September 2022
I would like to book an appointment at the show MEMS & Imaging Sensors Summit
ESTC 2022
calendar_today 13th - 16th September 2022
I would like to book an appointment at the show ESTC 2022
SEMICON Taiwan 2022
calendar_today 14th - 16th September 2022
I would like to book an appointment at the show SEMICON Taiwan 2022
Taiwan International Semiconductor Executive Summit TISES
calendar_today 11th - 12th October 2022
Advanced Ti+Cu Seed Sputter Technologies for Glass Substrates with Through Glass Via and Through G
With increased bandwidth requirements for commercial, high performance computing and artificial intelligence applications, there is a need to increase the IO density of fine line features, small microvias and low-K dielectrics in future IC-Substrates and interposers. While BEOL processing has enabled achieving very high-density interconnects in Silicon-based integration systems on wafer level - like Intel’s EMIB technology with BEOL techniques has accomplished 225 IOs/mm/layer with < 2 mm L/S., panel scale packaging using m-SAP and SAP RDL, could only accommodate <50 IOs/mm/layer. The near-future needs of the advanced technologies should be able to overcome the shortcomings of the current interposer technologies that include: 1) low-K materials with dielectric constants much lower than that of SiO2, 2) ability to support data rates greater than 10 Gbps with low resistance and capacitance, 3) low cost panel scale processes with potential to increase fine line features and scale up substrates sizes. Evatec has carried out extensive research together with Institutes and Cooperation partner on new materials and process developments along with their optimization on glass substrates as a viable low cost technology for next generation IC-Substrates and large interposers. This work presents a review of the current Ti+Cu Seed Sputter technologies with their capabilities and limits. As well as strategies that have the potential to enable future design rules and ideas.
Optatec
Semicon Europa 2022
calendar_today 15th - 18th November 2022
I would like to book an appointment at the show Semicon Europa 2022
W3+ Fair
calendar_today 30th November - 1st December 2022
I would like to book an appointment at the show W3+ Fair
SEMICON Japan 2022
calendar_today 14th - 16th December 2022
I would like to book an appointment at the show SEMICON Japan 2022
SPIE Photonics West 2023
calendar_today 28th January - 2nd February 2023
I would like to book an appointment at the show SPIE Photonics West 2023
Semicon Korea 2023
calendar_today 1st - 3rd February 2023
I would like to book an appointment at the show Semicon Korea 2023
IMAPS 19th International Conference and Exhibition on Device Packaging (DPC 2023)
calendar_today 13th - 16th March 2023
I would like to book an appointment at the show IMAPS 19th International Conference and Exhibition on Device Packaging (DPC 2023)
GOMACTech 2023
calendar_today 20th - 23rd March 2023
I would like to book an appointment at the show GOMACTech 2023
CS International Brussels
calendar_today 18th - 19th April 2023
Thin film layers for the upcoming micro-LED displays – the race never stops!
A lot has changed since Evatec first presented potential production solutions for the upcoming Micro LED technology two years ago. With a much greater understanding of the practical manufacturing challenges we are just a short step away from seeing the first mass production applications of micro LED displays. Working together with technology leaders has helped us optimize new approaches in thin film production technology. Solutions will be presented offering increased automation with less human intervention. Full substrate tracking, a stable process environment and improved sputter and evaporation process performance are all part of the essential recipe for success. Performance is the key to make micro LED competitive against the current solutions mostly covered by OLED and mini LED.
SPIE. Defense + Commercial Sensing
SVC TechCon 2023
calendar_today 8th - 11th May 2023
Highly Ionized Pulse Sputter Deposition for Through Silicon Vias filling by Dominic Jaeger
Step Up Thin Film Coating Productivity Using Smart Control and High-Level Automation by Edmund Schuengel
Taiwan International Semiconductor Executive Summit TISES
calendar_today 9th - 10th May 2023
Thinfilm technology for heat dissipation layers in HPC applications by Ralph Zoberbier
Intermag
calendar_today 15th - 19th May 2023
mic
Claudiu V. Falub
Scaling the manufacturing of soft magnetic inductor cores for power conversion applications from 8-inch to 12-inch wafers
CS Mantech - International Conference on Compound Semiconductor Manufacturing Technology
calendar_today 15th - 18th May 2023
I would like to book an appointment at the show CS Mantech - International Conference on Compound Semiconductor Manufacturing Technology
ICMCTF 2023
calendar_today 21st - 26th May 2023
Clemens Nyffeler: Mon. 22.5. 11:20 Session F5
Jürgen Weichart: Thu. 25.5. 11:00 Session B8
Jörg Patscheider: Tue. 23.5. 19:00 Special Interest session II
IEEE Glass Packaging Workshop
calendar_today 23rd - 24th May 2023
mic
Roland Rettenmeier
Advanced Sputter Technologies for Glass Substrates with Through Glass Via and Through Glass Cavities as well as Low-K Polymer Laminated Glass Substrates
Semicon SEA 2023
calendar_today 23rd - 25th May 2023
mic
Dr. Suresh Kumar Singaram
ECTC 2023
calendar_today 30th May - 2nd June 2023
mic
Carl Drechsel
Optimum Rc Control and Productivity Boost in Wafer-Level Packaging Enabled by High-Throughput UBM/RDL Technology
MEMS World Summit EU
calendar_today 13th - 14th June 2023
mic
Maurus Tschirky
EVATEC – Mastering Deposition Technologies from Core to Package
3D & Systems Summit 2023
calendar_today 26th - 28th June 2023
mic
Roland Rettenmeier
Thin film technology for Heat Dissipation layers in high performance computing applications
LASER World of PHOTONICS
calendar_today 27th - 30th June 2023
I would like to book an appointment at the show LASER World of PHOTONICS
SEMICON China 2023
calendar_today 29th June - 1st July 2023
I would like to book an appointment at the show SEMICON China 2023
Semicon West 2023
calendar_today 11th - 13th July 2023
I would like to book an appointment at the show Semicon West 2023
CIOE 2023
calendar_today 6th - 8th September 2023
I would like to book an appointment at the show CIOE 2023
Semicon Taiwan 2023
calendar_today 6th - 8th September 2023
I would like to book an appointment at the show Semicon Taiwan 2023
EU Power Semiconductor Executive Summit (EU PSES)
calendar_today 14th - 15th September 2023
mic
Vinoth Sundaramoorthy
Thin film solutions for wide bangap device processing
SPIE Laser Damage
calendar_today 17th - 20th September 2023
mic
Dr. Silvia Schwyn Thoeny
Quantized nanolaminates of Ta2O5-SiO2 and amorphous silicon-SiO2 manufactured by magnetron sputter d
V2023 - Vacuum & Plasma
calendar_today 19th - 21st September 2023
mic
Dr. Edmund Schüngel
How digitalization changes our coating systems and the way we use them
PwrSoc (Power Supply on Chip)
calendar_today 27th - 29th September 2023
mic
Claudiu V. Falub
Manufacturing Soft Magnetic Multilayers on 300 mm Wafers for PwrSoC Applications
SPIE Optifab 2023
calendar_today 16th - 19th October 2023
I would like to book an appointment at the show SPIE Optifab 2023
ISMP 2023
calendar_today 25th - 27th October 2023
mic
Stanley Low
Backside Metal Films for Heat Dissipation in HPC Packages
Semicon Europa 2023
calendar_today 14th - 17th November 2023
I would like to book an appointment at the show Semicon Europa 2023
MEMS World Summit China
calendar_today 1st December 2023
mic
Yuan Lu
EVATEC – Mastering Deposition Technologies from CORE to PACKAGE
Hear us speak and join us at the Panel Discussion - China Collaboration in MEMS Solutions Opportunities and Challenges
Evatec's contribution to the Panel Discussion will focus on Heterogeneous Integration which requires knowledge in functional layers within the dies, along with expertise in Advanced Packaging. Whereas the first part is genuinely core competence of Evatec for piezoelectric sensing or actuating elements, we also have a strong footprint in the AP court. The interdisciplinary approach is of the essence there, for instance in heat dissipation, magnetic shielding, or stress compensation. Mastering the 3rd dimension is also common for both MEMS and AP, where TSVs are elementary.
A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.
A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.
EPTC 2023 IEEE
calendar_today 5th - 8th December 2023
mic
Suresh Singaram
Backside Metallization for LogicApplications
HPC (High Performance Computing) is a powerful tool that can be applied to solve intricate problems and overcome obstacles in diverse areas such as life science, environmental sciences, industrial and finance. To achieve high computing power, cutting-edge system-onchips (SOCs) or next generation advanced packaging technologies are utilized to integrate processors, memory, and storage either on die or at the package level. However, a critical hurdle in these technologies is to effectively manage the heat generated in order to preserve computing performance and power efficiency. In this context, we will discuss the challenges and present latest progress in thin film deposition of a solderable layer stack deposition on the wafer backside to allow a perfect, reliable connection to the thermal interface material (TIM) . This back side metal (BSM) stack has not only to meet excellent adhesion and solderability, but also minimum film stress requirements and compatibility to limited process temperature budgets imposed by increasingly popular Electronic Mold Compound or EMC substrates applications.
Semicon Japan 2023
calendar_today 14th - 16th December 2023
I would like to book an appointment at the show Semicon Japan 2023
Photonics West 2024
calendar_today 27th January - 1st February 2024
I would like to book an appointment at the show Photonics West 2024
Semicon Korea 2024
calendar_today 31st January - 2nd February 2024
I would like to book an appointment at the show Semicon Korea 2024
ISPEC 2024 (Indian Semiconductor and Packaging Ecosystem Conference)
calendar_today 29th February - 2nd March 2024
I would like to book an appointment at the show ISPEC 2024 (Indian Semiconductor and Packaging Ecosystem Conference)
Asia Photonics Expo 2024
calendar_today 6th - 8th March 2024
I would like to book an appointment at the show Asia Photonics Expo 2024
IMAPS 2024 - Device Packaging
calendar_today 18th - 21st March 2024
mic
Roland Rettenmeier
Back Side Metalization for High Performance Computing
PiezoMems 2024
calendar_today 19th - 20th March 2024
mic
Volker Roebisch
Beyond 30 at.% Sc doping for manufacturing-ready, highly uniform, stress neutral Al1-xScxN layers
Semicon China 2024
calendar_today 20th - 22nd March 2024
I would like to book an appointment at the show Semicon China 2024
OCLA Symposium 2024
calendar_today 16th April 2024
I would like to book an appointment at the show OCLA Symposium 2024
SPIE Defense + Commercial Sensing 2024
calendar_today 23rd - 25th April 2024
I would like to book an appointment at the show SPIE Defense + Commercial Sensing 2024
MSTC 2024 (MEMS & Sensors Technical Congress)
calendar_today 1st - 2nd May 2024
I would like to book an appointment at the show MSTC 2024 (MEMS & Sensors Technical Congress)
Optatec 2024
calendar_today 14th - 16th May 2024
I would like to book an appointment at the show Optatec 2024
CS Mantech 2024
calendar_today 20th - 23rd May 2024
mic
Oguz Yildirim
Beyond 30 at.% Sc doping for manufacturing-ready highly uniform, stress neutral Al1-xScxN layers on
Semicon SEA 2024
calendar_today 28th - 30th May 2024
I would like to book an appointment at the show Semicon SEA 2024
Upcoming Events
1st - 3rd September 2021
add
7th - 8th September 2021
add
16th - 18th September 2021
Shenzhen
add
21st - 23rd September 2021
San Jose
add
22nd - 23rd September 2021
Dornbirn
add
28th - 29th September 2021
Berg
add
12th - 14th October 2021
Dresden
add
18th - 21st October 2021
Rochester New York
add
19th - 20th October 2021
Shanghai
add
9th - 10th November 2021
Brussels
add
16th - 19th November 2021
Munich
add
7th - 9th December 2021
San Francisco
add
15th - 17th December 2021
Tokyo
add
13th - 14th January 2022
Singapore
add
ASTC Advanced Semiconductor Technology Conference
Hear us speak
add
25th - 27th January 2022
San Francisco
add
25th - 27th January 2022
San Diego
add
9th - 11th February 2022
Seoul
add
15th - 17th February 2022
San Jose
add
7th - 10th March 2022
Fountain Hills
add
IMAPS 18th International Conference and Exhibition on Device Packaging (DPC 2022)
Visit us at booth #
add
21st - 24th March 2022
Miami
add
3rd - 7th April 2022
Orlando
add
SPIE Defense + Commercial Sensing 2022
Visit us at booth #1222
add
13th April 2022
Buchs
add
26th - 29th April 2022
Munich
add
9th - 12th May 2022
Monterey
add
31st May - 3rd June 2022
San Diego
add
5th - 9th June 2022
Hilton Head
add
14th - 15th June 2022
Dresden
add
19th - 24th June 2022
Whistler
add
21st - 23rd June 2022
Penang
add
28th - 29th June 2022
Brussels
add
12th - 14th July 2022
San Francisco
add
6th - 7th September 2022
Grenoble
add
13th - 16th September 2022
add
14th - 16th September 2022
Taipei
add
11th - 12th October 2022
Taipei
add
Taiwan International Semiconductor Executive Summit TISES
Hear us speak
add
15th - 18th November 2022
Munich
add
30th November - 1st December 2022
Dornbirn
add
14th - 16th December 2022
Tokyo
add
28th January - 2nd February 2023
San Francisco
add
1st - 3rd February 2023
Seoul
add
13th - 16th March 2023
Fountain Hills
add
IMAPS 19th International Conference and Exhibition on Device Packaging (DPC 2023)
Visit us at booth #35
add
20th - 23rd March 2023
San Diego
add
18th - 19th April 2023
Brussels
add
30th April - 4th May 2023
Orlando
add
8th - 11th May 2023
Washington
add
9th - 10th May 2023
Taipei
add
Taiwan International Semiconductor Executive Summit TISES
Hear us speak
add
15th - 19th May 2023
Sendai
add
15th - 18th May 2023
Orlando
add
CS Mantech - International Conference on Compound Semiconductor Manufacturing Technology
Visit us at booth #305
add
21st - 26th May 2023
San Diego
add
23rd - 24th May 2023
Atlanta
add
23rd - 25th May 2023
Penang
add
30th May - 2nd June 2023
Orlando
add
13th - 14th June 2023
Porto
add
26th - 28th June 2023
Dresden
add
27th - 30th June 2023
Munich
add
29th June - 1st July 2023
Shanghai
add
11th - 13th July 2023
San Fransico
add
Semicon West 2023
Visit us at booth #1060 in the South Hall
add
6th - 8th September 2023
Shenzhen
add
6th - 8th September 2023
Taipei
add
14th - 15th September 2023
Lake Maggiore
add
EU Power Semiconductor Executive Summit (EU PSES)
Hear us speak
add
17th - 20th September 2023
Livermore, CA
add
19th - 21st September 2023
Dresden
add
27th - 29th September 2023
Hannover
add
16th - 19th October 2023
Rochester
add
25th - 27th October 2023
Busan
add
14th - 17th November 2023
Munich
add
1st December 2023
Shanghai
add
5th - 8th December 2023
Singapore
add
14th - 16th December 2023
Tokyo
add
27th January - 1st February 2024
San Fransisco
add
31st January - 2nd February 2024
Seoul
add
29th February - 2nd March 2024
Mohali, Punjab
add
ISPEC 2024 (Indian Semiconductor and Packaging Ecosystem Conference)
Visit us at booth #3
add
6th - 8th March 2024
Marina Bay Sands
add
18th - 21st March 2024
Fountain Hills, AZ
add
19th - 20th March 2024
Aachen
add
20th - 22nd March 2024
Shanghai
add
16th April 2024
Buchs
add
23rd - 25th April 2024
Maryland
add
SPIE Defense + Commercial Sensing 2024
Visit us at booth #727
add
1st - 2nd May 2024
Los Angeles
add
MSTC 2024 (MEMS & Sensors Technical Congress)
Visit us at booth #
add
14th - 16th May 2024
Frankfurt
add
20th - 23rd May 2024
Tucson, AZ
add
28th - 30th May 2024
Singapore
add