HEXAGON
You advantage in Advanced Packaging
Leadership in UBM, RDL and Fanout on 300mm
Panel Level Packaging
- Leadership in Degas, Etch and PVD technologies
- Best CoO in Fanout with low contact resistance (Rc)
Lowest Contact Resistance
- Lowest Rc (<2.0mOhm) without compromise on wafer throughput
- Unique handling enables up to 80 wafer per hours
Production proven
- Longest kit lives >20'000 wafers
- Lowest consumable costs
HEXAGON
System design for the lowest Rc in the industry
HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering atmospheric pressure degas, etch and metal deposition.
- Processing of highly outgassing organic passivated wafers
- Atmospheric frontend handling with a high-performance dual end effector robot for the shortest wafer swap times
- Wafer transfer by synchronous indexer enables high speed wafer processing
- Etch shield kit lifetimes of > 20000 wafers with enhanced uptime and reduced maintenance
- Footprint less than 11 square metres (without control racks)
- System design for lowest Rc in the industry and best wafer to wafer repeatability
Interactive Element
Click on the individual sections in the circle to read all the details.
VIN
- Central transfer module connecting all process chambers
- Enables synchronized wafer handling under high vacuum
- Designed for maximum throughput and system stability
AFEM
Atmospheric Front End Module
- Clean mini-environment with up to three FOUP load ports
- Supports SEMI E84 communication
- Includes wafer centering and substrate reconciliation
- Eliminates the need for re-mapping
Atm. Batch Deg.
Atmospheric Batch Degasser
- Performs low-temperature atmospheric degassing
- Suitable for organic or molded wafers
- Uses hot dry purge gas
- Optional 28-slot or 44-slot cassette configurations
PVE
- Provides pre-cleaning and surface activation
- Achieves < 2 % uniformity
- Long kit lifetime of more than 20,000 wafers
- In-situ pasting for ultra-low contact resistance (Rc)
PVD
- Planar magnetron for Ti/Cu seed layer deposition
- High-power sputtering for thicker metal stacks and high-rate applications
- Excellent film uniformity and extended target lifetime
- Optional RF bias chuck and shadow-mask operation
- Optimized for low cost of ownership
Air Lock
- Transfer chamber between atmospheric and vacuum environments
- Maintains pressure integrity
- Enables fast pump-down and vent cycles
Chucks
- Multiple configurable Arctic, water, and rotating water‑cooled chuck technologies available
- Provides precise temperature control
- Optimizes film uniformity across different wafer sizes and materials
Pedestal
- Available with solid or perforated pedestal designs
- Improves airflow and service accessibility
- Houses media routing and mechanical base components
Vacuum Pumps
- Integrated cryo, turbo, fore, and diaphragm pumps
- Ensures stable high-vacuum conditions
- Enables rapid system recovery times
Media
- Closed-loop thermal control system
- Delivers high cooling efficiency
- Reduces water and power consumption
HMI
Human Machine Interface
- Touch-screen control station
- Runs XPERIENCE software
- Provides process visualization and data logging
- Supports SEMI host connectivity
Racks
- Electrical and service racks for system infrastructure
- Contains main power distribution and safety systems
- Optional arc-flash protection panel available
Configuration - It's all about throughput
Wafer transfer by synchronous indexer enables high speed wafer processing. Wafer handling enables full face etch and deposition processes with in chamber wafer sensing for accurate, repeatable positioning time after time in 24/7 production. Reducing maintenance time is at the heart of HEXAGON’s design with a reliable transport system and powered source handling for rapid, easy access by a single operator.
- Install up to five process chambers for etch, cool or deposition
- Atmospheric batch degasser
- Bridge capability with simple conversion between 200mm and 300mm.
Process Chambers
- Arctic Cooling Module for precise process temperature control
- Arctic ICP soft etch module with highest kit life
- Optional Insitu pasting
- ARQ310 DC or pulsed DC sputter source with uniformity compensation over target life
- Long life targets with best utilization
- Dedicated degasser options for all wafer level packaging (WLP) processes
- Chuck RF Bias with auto matching option
- Controlled chuck temperature
- Chuck options for mechanical clamping, clampless chuck with shadow mask
Process Know-How
Proven process capabilities come as standard when you choose HEXAGON.
To read more about typical application examples and Evatec know-how in Advanced Packaging download the HEXAGON brochure, view Evatec's LAYERS magazine or visit the news section of our web site.
Read more about HEXAGON in our LAYERS magazine
Productivity Boost and Optimum Rc Control in Wafer-Level Packaging
Evatec’s HEXAGON platform combines hardware innovations with optimized process flows to achieve ultra-low contact resistance (<2 mΩ) and high throughput up to 80 wafers per hour—meeting the demands of advanced UBM and RDL technologies for next-generation packaging.
HEXAGON Throwing a double in power device applications
Evatec’s HEXAGON platform brings a new approach to power device manufacturing with ultra-fast wafer transfer, rapid pump-down, and precise temperature control achieving throughputs up to 80 wafers per hour for SiC processes while driving down cost of ownership.
Towards perfection in Advanced Packaging with the new HEXAGON
Evatec’s next-generation HEXAGON platform sets new standards in Advanced Packaging with best-in-class Rc, enhanced wafer safety, and throughputs exceeding 100 wafers per hour, combining improved process flexibility, uptime, and CoO for future-proof production.
Buying a new Evatec tool is just the first step in a long term partnership. From initial ramp up support to ongoing maintenance or retrofits adding new capabilities, maximise both uptime and tool working life together with Evatec’s local customer service teams.
- We can help you plan and manage your stocks
- Use our exchange programmes to minimize downtimes
- Our local Field Service Engineers on hand when you need us
- Maximizing output - From Continuous Improvement Programmes (CIP) to new process installations
- Add new capabilities to support your technology roadmaps
- Helping you extend tool working life
- Helping you to help yourself
- Tailored just for you - At Evatec or in your own fab