Frontend
Thin film solutions for semiconductor devices with advanced nodes
Overview
The demand to build smaller/faster/more efficient devices has driven the semiconductor industry over the last decades. As progress in 2D scaling slows other approaches are needed to boost device performance.
Innovations in new materials, architectures (e.g. transistor designs) or innovations by introducing the 3rd dimension are required to further increase logic density.
Evatec sputter equipment like CLUSTERLINE® 300 for processing of 300mm wafers is available in a dedicated CMOS configuration for improved vacuum, defects and contamination performance.
Here are just some of the areas where we can support you so why not reach out to us in case of any queries.
Production Tools
The Evatec Tool Portfolio for Frontend:
Choose from Evatec's platforms based on your substrate, process requirements, throughput, and factory integration needs.
Our experts are available to assist you in finding the right platform tailored to your specifications. Alternatively, click on the button to explore each platform in detail.
CLUSTERLINE® 300
Cluster platform architecture with single wafer processing and completely automated handling for front and back metals on 300mm wafers in volume production.
Warpage Compensation
Warpage Compensation in Semiconductor Manufacturing
As semiconductor devices become more complex, vertically stacked wafers are increasingly used to achieve higher functional and storage density. However, this approach can lead to wafer deformation and substrate warpage. To address these challenges, manufacturers employ a technique called backside wafer Warpage Correction (WPC). By depositing a dielectric PVD layer on the wafer’s backside, stress films can be tuned to mitigate warping. The process occurs at low temperatures, preserving the wafer’s integrity.
Key specifications for successful WPC include stress range, layer thickness, substrate temperature, edge roll-off, and chemical properties. These factors ensure optimal performance and yield.
Hard masks
Hard Masks in Semiconductor Manufacturing
Hard masks play a crucial role in the manufacturing process of devices, including memories. These masks serve two primary purposes:
- Pattern Definition: Hard masks define patterns, acting as etch masks or defining implantation regions. They guide subsequent processing steps with precision.
- Etch Selectivity and Efficiency: Hard masks must exhibit high etch selectivity. This property ensures that during plasma etching, the mask material remains intact while the underlying layers are selectively removed. This enables use of thinner layers and higher process throughput.
However, achieving an effective hard mask involves considering additional factors:
- check Mechanical Properties: Hard masks should withstand various stresses during fabrication, ensuring their stability and durability.
- check Deposition Technology: Chemical vapor deposition (CVD) is widely used for hard mask deposition. It provides uniform and conformal film coverage but in some cases has limitations.
- check High Hydrogen (H) Content PVD: If thermal budgets pose challenges, consider using physical vapor deposition (PVD) with high hydrogen content. This approach can address specific material requirements.
- check Material Options: Various compositions, such as MoO2, SiC(N), Ta2O5, and SiN, are available. Each material can be demonstrated for suitability in specific applications.
For further information or inquiries, please feel free to contact us.
Multilevel metallization for ICs:
Interconnect metallization within integrated circuits facilitates signal transfer between devices. Aluminum was common in earlier generations, while Cu (with Ta/TaN barrier layers) was introduced subsequently for tighter design rules due to lower resistivity. Evatec offers a dedicated CMOS-compatible CLUSTERLINE® 300 system for customer needs. Different hardware configurations, including superior temperature control, ensure high repeatability. Titanium-Aluminum process solutions for higher-level metallization or for metal pads for HBM (high bandwidth memory) applications are available. Our process team is ready to work with you on Ta/TaN barrier and Cu seed processes to support your upcoming needs.
Read more about Frontend
Beyond Moore's Law
Chip makers face challenges in 3D IC and heterogeneous integration, needing to manage thermal budgets and wafer flatness. Evatec offers solutions for advanced CMOS fabs.