Overview 

Fan-Out Panel-Level Packaging and Advanced IC Substrates

New types of Neural Networks, such as ChatGPT and other text generators, along with various Artificial Intelligence (AI) applications, are driving the demand for High-Performance Computing (HPC) to unprecedented levels. Innovations like Chiplet-Packages, novel Heat Dissipation methods, Miniaturization, new Material Integration, and Power Optimization showcase the vital role of Advanced Packaging for these advances. 

With high adoption rates and significant technological advantages, Advanced Packaging is a rapidly growing segment providing a pathway to support industry roadmaps. Sputtered seed layers, which are replacing chemical seed layers, enable a range of new possibilities. Both OEMs and manufacturers of next-generation IC Substrates and Substrate-like PCBs are adopting sputtered seed layers as an enabling technology for smaller, more precise structures, improved reliability and reduced carbon footprint for their manufacturing processes integrating new materials into packages, such as glass core with Through Glass Via (TGV), and developing next-generation Chiplet-Packages present exciting opportunities ahead. 

The integration of ever more Chips into a single package increases the size of these packages. As package sizes grow, material and equipment utilization on round wafers becomes inefficient. Therefore, the industry is shifting towards panel-sized semiconductor-grade process equipment, which handles and processes rectangular substrates with dimensions ranging from 510x515mm to 600x600mm. 

Evatec is a market leader in panel-sized semiconductor-grade process equipment for Fan-Out Panel-Level Packaging and Advanced IC Substrates, utilizing a variety of materials. Evatec's market-leading CLUSTERLINE® 600 platform processes substrate sizes up to 650x650mm, delivering top performance in outgassing, seed layer adhesion, and stack uniformity.

You can read more about some of these technology and market developments in LAYERS 8.