Power Devices
Metallization and thin wafer processing
Benefit from Evatec's long experience in Power Device applications to increase your productivity, process stability and yield and drive down your production costs. We provide high rate sputtering or evaporation tools for volume production of MOSFETs, IGBTs IGCTs, LDMOS, SiC and GaN Power Devices.
Within sputter technology, 200mm and 300mm tools in the CLUSTERLINE® family provide high throughput applications for thick front metals deposition. Single wafer processing in dedicated PVD process modules equipped with high rate sputtering sources and clampless heater chucks (conventional or electrostatic chuck – ESC) for advanced temperature management ensure stringent process control and optimum particle performance. In combination with the parallel processing capability of the cluster tool architecture CLUSTERLINE® provides optimum process stability and highest productivity for most demanding applications.
Our evaporation solutions are built on Evatec's industry standard BAK family. Planetary handling and flip systems are state of the art for deposition of thick front side aluminium or rear side contact stacks in single or double sided processes.
You can read more about our thin film production solutions for Power Device applications in LAYERS
THE EVATEC TOOL PORTFOLIO FOR
POWER DEVICES
We offer evaporation and sputter technologies on a range of batch, cluster or fully automated inline platforms.
Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.
Thin wafer Processing
For applications like BSM on thin wafers or SiC & GaN WBG Technology proven handling capabilities on CLUSTERLINE® enable secure, direct thin wafer processing for 200mm wafers down to 70 microns and 200 / 300mm Taiko wafers down to 60 microns for defect free metallization processes.
CLUSTERLINE® 200 & 300 offer backside processes for in- situ pre- etch with Ar/ H2, in- situ anneal as well as control of stress and temperature management and high quality ohmic contact formation with lowest wafer bow or warp.
SiC and GaN WBG technology
For SiC and GaN on Si applications, Evatec's tool portfolio offers a large variety of process technologies to enable high end deposition processes for the development as well as volume production of demanding new device types. Contact us to find out more.
Benefit from Evatec's long experience in Power Device applications to increase your productivity, process stability and yield and drive down your production costs. We provide high rate sputtering or evaporation tools for volume production of MOSFETs, IGBTs IGCTs, LDMOS, SiC and GaN Power Devices.
Within sputter technology, 200mm and 300mm tools in the CLUSTERLINE® family provide high throughput applications for thick front metals deposition. Single wafer processing in dedicated PVD process modules equipped with high rate sputtering sources and clampless heater chucks (conventional or electrostatic chuck – ESC) for advanced temperature management ensure stringent process control and optimum particle performance. In combination with the parallel processing capability of the cluster tool architecture CLUSTERLINE® provides optimum process stability and highest productivity for most demanding applications.
Our evaporation solutions are built on Evatec's industry standard BAK family. Planetary handling and flip systems are state of the art for deposition of thick front side aluminium or rear side contact stacks in single or double sided processes.
You can read more about our thin film production solutions for Power Device applications in LAYERS
THE EVATEC TOOL PORTFOLIO FOR
POWER DEVICES
We offer evaporation and sputter technologies on a range of batch, cluster or fully automated inline platforms.
Our experts are on hand to help you find the right platforms according to your process requirements, throughput and factory integration requirements. Alternatively, click on the photo links to read more about each platform.
Thin wafer Processing
For applications like BSM on thin wafers or SiC & GaN WBG Technology proven handling capabilities on CLUSTERLINE® enable secure, direct thin wafer processing for 200mm wafers down to 70 microns and 200 / 300mm Taiko wafers down to 60 microns for defect free metallization processes.
CLUSTERLINE® 200 & 300 offer backside processes for in- situ pre- etch with Ar/ H2, in- situ anneal as well as control of stress and temperature management and high quality ohmic contact formation with lowest wafer bow or warp.
SiC and GaN WBG technology
For SiC and GaN on Si applications, Evatec's tool portfolio offers a large variety of process technologies to enable high end deposition processes for the development as well as volume production of demanding new device types. Contact us to find out more.