Bumping, a crucial technique for establishing connections between chips, substrates, and PCBs, involves the creation of raised metal regions known as "bumps" over bonding pads. Evatec offers a comprehensive range of bumping solutions tailored to various applications and specifications. Our advanced bumping processes are available in multiple levels, catering to different pitch requirements, from coarse broad (500um and above) to ultra-fine (less than 50um). By reducing bump size and pitch while ensuring high yield rates, Evatec enhances data transfer speeds and minimizes power consumption, meeting the demands of modern electronic devices.
One of the primary performance indicators for such interconnects is the contact resistance (Rc). Evatec's state-of-the-art process systems and innovative concepts deliver the industry's lowest contact resistance, ensuring optimal performance and reliability for bonding interconnects. With our cutting-edge technologies and expertise, we enable seamless connectivity and robust functionality in advanced semiconductor packaging applications.