Wireless Communication
Thin film production platforms and processes for wireless technologies
Overview
From high-performance RF filters ranging from lower frequencies towards 6G wireless devices, Evatec's evaporation and sputter platforms support a range of thin film processes for wireless communication applications. Our sputter processes and platforms cater for the gap filling and planarization processes used in temperature compensation of SAW devices. Our evaporation process specialists can advise the best platforms and processes for "lift off" for IDTs, metallization in HBT and p-HEMT manufacturing. Evatec experts in piezoelectrics can help you configure sputter deposition solutions for high-performance layers such as Al(1-x)ScxN (x > 36 at.%) for RF filter technology.
We ensure best-in-class thickness and stress uniformities for high production yields on wafer sizes up to 200mm.
You can read more about our thin film production solutions for Wireless applications in LAYERS (link to LAYERS 6).
Production Tools
The Evatec Tool Portfolio for Wireless:
Choose from Evatec's platforms based on your substrate, process requirements, throughput, and factory integration needs.
Our experts are available to assist you in finding the right platform tailored to your specifications. Alternatively, click on the photo links to explore each platform in detail.
CLUSTERLINE 200®
From single substrate processing for electrodes and piezoelectric deposition to dynamic batch processing for gap filling and planarization processes on up to 8-inch wafers.
SAW and BAW
Our thin film processes using evaporation or sputter support the manufacture of low-loss RF filters for wireless communication applications. Our BAKs can be custom configured as split chamber extended throw systems for "lift off" with manual, semi automated or fully-automated loading handling, whilst dedicated cathode technology on our CLUSTERLINE® 200 platform eliminates manual handling through cassette to cassette operation and enables the deposition of piezoelectric materials such as AlN and AlScN with highest degree of crystal orientation and controlled stress non-uniformity for resonators, reflectors and electrodes. Our state-of-the epitaxial seed layer solution bring the electrode as well as piezoelectric layers performance to the next level by dramatically improving the crystal structure, roughness and conductivity of the electrodes.
Metallization Processes
Evatec's evaporation platforms, optimized for mass production with high-quality process performance, deliver reduced precious metals consumption using proprietary software like Unicalc. Systems with extended throw are ideal for "lift off" process geometries, ensuring zero side wall coverage for subsequent film patterning steps. From manual to semi-automatized and finally to fully-automatized wafer handling, we offer range of solutions from maximum flexibility to the highest throughput and lowest cost of ownership and highest energy efficiency.
Configuration options for CLUSTERLINE® 200 include classical single substrate or batch processing for simultaneous handling of different substrate sizes and recipes maximizing tool utilization.