LAYERS 7 - Chiplets and the new era of Advanced Packaging
What is a Chiplet and what are the advantages?
As the industry enters the new era of heterogeneous integration, advanced packaging in the form of chiplets is becoming increasingly important. An increasing number of companies are turning to chiplets to achieve the economic advantages lost with expensive monolithic scaling, ushering in a new era of smart packaging. A chiplet is not a package, but it is a new approach to system, package, and chip design. There are many package options that can be adopted and careful consideration is required to select the most appropriate options for the application. Options include the emerging 3DIC format with mircobumps or hybrid bonding, laminate substrate package, fan-out on substrate, and silicon interposer. Challenges include design, test, assembly and thermal management.