27th January 2025
LAYERS 8 – CLUSTERLINE® 600 & next generation IC-substrates
The potential benefits of moving from wafer to panel processing, including much higher material and process utilization, are already well documented. Recent developments on the well-established CLUSTERLINE® 600 platform make it the perfect choice for customers when setting up manufacturing capability for emerging markets like advanced IC-substrates for applications such as Artificial Intelligence and other High Performance Computing applications.
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