LAYERS 8 – Cross-Contamination in Multi-Chamber PVD Systems

Modern WLP application require PVD systems that can deliver low and stable contact resistance (R_c) at high throughput. HEXAGON is an excellent candidate to fulfill this role. This study demonstrates that chamber-to-chamber cross-talk during continuous run is negligible compared to the residual outgassing of the etched wafer itself as explained by Fraunhofer and Evatec.

Higher interconnect density in WLP applications increases the importance of interconnect quality, measured by contact resistance (R_c). UBM and RDL metallization are key steps. HEXAGON shows 50% lower R_c and 40% higher throughput than the CLUSTERLINE®. Cross-contamination mainly comes from residual outgassing of etched PBO wafers.

Read the article here

Why not order your copy of the full magazine as a PDF or hardcopy? Simply write an e-mail to communications@evatecnet.com. Don't forget to include your chosen delivery address.