Evatec Collaborates with Onto Innovation in Panel Level Packaging Applications Center of Excellence

Evatec is proud to announce its collaboration with Onto Innovation in the newly opened Packaging Applications Center of Excellence (PACE) located at Onto’s Wilmington, Massachusetts, headquarters. This first-of-its-kind facility in the U.S. and its global industry collaboration network is dedicated to accelerating research and development in panel-level packaging (PLP), enabling 2.5D and 3D chiplet architectures, and AI packages. New chiplet designs and packaging approaches require intense alignment and collaboration among the manufacturing supply chain to enable the industry in this exciting endeavor. 

Together, we will leverage our collective expertise in lithography, plating, thin film deposition, laser processes for through glass via (TGV) formation, and new material developments in photoresist, dielectric and plating chemistry to tackle actual and future integration challenges. 

Evatec is excited to be part of this innovative initiative that aims to solve complex challenges posed by the adoption of glass core substrates for the next generation computing architectures and fine line RDL interconnects. We look forward to contributing with our market leading CLUSTERLINE®600  panel level PVD technology and thin film process excellence. Stay tuned for more updates on our journey with PACE and Onto Innovation. 

To learn more about PACE, please click here