Panel Consortium 2 Kick Off

More than 50 international guests gathered at Fraunhofer IZM for the first kickoff meeting in mid of february to mark the great news: After the international Panel Level Consortium 1.0 achieved its ambitious goals for the project in 2019 with significant technical progress in the field of large-area Fan- Out Panel Level Packaging, a new consortium – consequently called PLC 2.0 – has been formed to continue on that trajectory, with special focus on ultra-fineline routing, including an exploration of migration effects as well as warpage and die shift on large-area panels.

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