22nd July 2020
FOPLP - GET THE BROCHURE
CLUSTERLINE® 600 is qualified at the major OSATS and IDMs for Panel Level Packaging. It enables the latest technologies on panel sizes up to 650 x 650 mm
Find out how our degas, etch and deposition technologies combined with Evatec's panel handling capabilities provide low contact resistance (Rc) , excellent adhesion and low particle generation in production of seed layers for IC Substrates and FOPLP.