HEXAGON
You advantage in Advanced Packaging
Leadership in UBM, RDL and Fanout on 300mm
Panel Level Packaging
- Leadership in Degas, Etch and PVD technologies
- Best CoO in Fanout with low contact resistance (Rc)
Lowest Contact Resistance
- Lowest Rc (<2.0mOhm) without compromise on wafer throughput
- Unique handling enables up to 80 wafer per hours
Production proven
- Longest kit lives >20'000 wafers
- Lowest consumable costs
HEXAGON
System design for the lowest Rc in the industry
HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering atmospheric pressure degas, etch and metal deposition.
- Processing of highly outgassing organic passivated wafers
- Atmospheric frontend handling with a high-performance dual end effector robot for the shortest wafer swap times
- Wafer transfer by synchronous indexer enables high speed wafer processing
- Etch shield kit lifetimes of > 20000 wafers with enhanced uptime and reduced maintenance
- Footprint less than 11 square metres (without control racks)
- System design for lowest Rc in the industry and best wafer to wafer repeatability
The HEXAGON brochure is available in English or Chinese language.
Configuration - It's all about throughput
Wafer transfer by synchronous indexer enables high speed wafer processing. Wafer handling enables full face etch and deposition processes with in chamber wafer sensing for accurate, repeatable positioning time after time in 24/7 production. Reducing maintenance time is at the heart of HEXAGON’s design with a reliable transport system and powered source handling for rapid, easy access by a single operator.
- Install up to five process chambers for etch, cool or deposition
- Atmospheric batch degasser
- Bridge capability with simple conversion between 200mm and 300mm.
Process Chambers
- Arctic Cooling Module for precise process temperature control
- Arctic ICP soft etch module with highest kit life
- Optional Insitu pasting
- ARQ310 DC or pulsed DC sputter source with uniformity compensation over target life
- Long life targets with best utilization
- Dedicated degasser options for all wafer level packaging (WLP) processes
- Chuck RF Bias with auto matching option
- Controlled chuck temperature
- Chuck options for mechanical clamping, clampless chuck with shadow mask
Process Know-How
Proven process capabilities come as standard when you choose HEXAGON.
To read more about typical application examples and Evatec know-how in Advanced Packaging download the HEXAGON brochure, view Evatec's LAYERS magazine or visit the news section of our web site.