HEXAGON
You advantage in Advanced Packaging
Leadership in UBM, RDL and Fanout on 300mm
Panel Level Packaging
- Leadership in Degas, Etch and PVD technologies
- Best CoO in Fanout with low contact resistance (Rc)
Lowest Contact Resistance
- Lowest Rc (<2.0mOhm) without compromise on wafer throughput
- Unique handling enables up to 80 wafer per hours
Production proven
- Longest kit lives >20'000 wafers
- Lowest consumable costs
HEXAGON
System design for the lowest Rc in the industry
HEXAGON is a dedicated wafer level packaging platform for volume production in applications like FOWLP at the lowest cost of ownership offering atmospheric pressure degas, etch and metal deposition.
- Processing of highly outgassing organic passivated wafers
- Atmospheric frontend handling with a high-performance dual end effector robot for the shortest wafer swap times
- Wafer transfer by synchronous indexer enables high speed wafer processing
- Etch shield kit lifetimes of > 20000 wafers with enhanced uptime and reduced maintenance
- Footprint less than 11 square metres (without control racks)
- System design for lowest Rc in the industry and best wafer to wafer repeatability
Configuration - It's all about throughput
Wafer transfer by synchronous indexer enables high speed wafer processing. Wafer handling enables full face etch and deposition processes with in chamber wafer sensing for accurate, repeatable positioning time after time in 24/7 production. Reducing maintenance time is at the heart of HEXAGON’s design with a reliable transport system and powered source handling for rapid, easy access by a single operator.
- Install up to five process chambers for etch, cool or deposition
- Atmospheric batch degasser
- Bridge capability with simple conversion between 200mm and 300mm.
Process Chambers
- Arctic Cooling Module for precise process temperature control
- Arctic ICP soft etch module with highest kit life
- Optional Insitu pasting
- ARQ310 DC or pulsed DC sputter source with uniformity compensation over target life
- Long life targets with best utilization
- Dedicated degasser options for all wafer level packaging (WLP) processes
- Chuck RF Bias with auto matching option
- Controlled chuck temperature
- Chuck options for mechanical clamping, clampless chuck with shadow mask
Process Know-How
Proven process capabilities come as standard when you choose HEXAGON.
To read more about typical application examples and Evatec know-how in Advanced Packaging download the HEXAGON brochure, view Evatec's LAYERS magazine or visit the news section of our web site.
Interactive Element
Click on the individual sections in the circle to read all the details.
VIN
The Vacuum Indexer is the central transfer module connecting all process chambers. Provides synchronized wafer handling under high vacuum for maximum throughput and stability.
AFEM
The Atmospheric Front End Module is a clean mini-environment with up to 3 FOUP load ports. Supports SEMI E84 communication, wafer centering, and substrate reconciliation without re-mapping.
Batch Deg.
Low-temperature atmospheric degassing of organic or molded wafers using hot dry purge gas. Optional 28- or 44-slot cassettes.
PVE
Arctic ICP Soft Etch
Pre-clean and surface activation module with < 2 % uniformity. Long kit lifetime > 20 000 wafers and in-situ pasting for ultra-low Rc.
PVD
Planar magnetron for Ti/Cu seed layer deposition. Excellent uniformity and extended target life for lowest cost of ownership.
High-power sputter source for thicker metal stacks or high-rate applications. Optional RF bias chuck and shadow-mask operation.
Air Lock
Transfer chamber maintaining pressure integrity between atmosphere and vacuum. Enables fast pump-down and vent cycles.
Chucks
(Arctic / Water / Rotating Water cooled)
Configurable chuck technologies for precise temperature control and optimal film uniformity across wafer sizes and materials.
Pedestal
Choice of solid or perforated pedestal design for improved airflow and service access. Houses media routing and mechanical base.
Vacuum
Integrated cryo, turbo, fore- and diaphragm pumps ensure stable high-vacuum conditions and rapid recovery times.
Media
(Arctic Chiller / Heat Exchanger)
Closed-loop thermal control delivering high cooling efficiency with reduced water and power consumption.
HMI
Human Machine Interface
Touch-screen control station running XPERIENCE software. Offers process visualization, data logging, and SEMI host connectivity.
Racks
Electrical and service racks containing main power distribution, safety systems, and optional arc-flash protection panel.
Read more about HEXAGON in our LAYERS magazine
Productivity Boost and Optimum Rc Control in Wafer-Level Packaging
HEXAGON Throwing a double in power device applications
Towards perfection in Advanced Packaging with the new HEXAGON
Buying a new Evatec tool is just the first step in a long term partnership. From initial ramp up support to ongoing maintenance or retrofits adding new capabilities, maximise both uptime and tool working life together with Evatec’s local customer service teams.
- We can help you plan and manage your stocks
- Use our exchange programmes to minimize downtimes
- Our local Field Service Engineers on hand when you need us
- Maximizing output - From Continuous Improvement Programmes (CIP) to new process installations
- Add new capabilities to support your technology roadmaps
- Helping you extend tool working life
- Helping you to help yourself
- Tailored just for you - At Evatec or in your own fab