SOLARIS® sputter platforms combine the know-how from delivering over 5000 high speed optical disk systems with experience gained from over 3000 semiconductor PVD tools to deliver a new approach in thin film mass production. With their "inline" architecture, SOLARIS® platforms are designed for "fully automated fabs" increasing throughput and eliminating manual handling. From Touch Panels to EMI Shielding, Thermoelectric Generators, Power Devices and Photovoltaics, the S151 and S380 platforms offer flexible high speed manufacturing solutions for rigid and flexible substrates.
Click on the individual sections in the circle to read the details.
Vacuum pumps of the tool are mainly turbo molecular pumps in conjunction with dry rotary pumps. Ultimate pressure will be in the low E-7mbar range. Every chamber is equipped with it’s individual pump, while separating vacuum during process completely. Cross over is minimal during substrate transport from chamber to chamber.
Available DC / DC reactive / 13.56MHz RF sources of up 6 chambers. Single target sources with a standard target diameter of ø300mm. Individual chamber venting for target change while other chambers remain under vacuum.
Ideal to create new materials by simultaneous sputtering of different materials. Available DC / DC reactive / 13.56MHz RF sources. Any combination of 4 sources with targets with standard target diameter of ø100mm. is allowed. Individual chamber venting for target change while other chambers remain under vacuum.
3D deposition of DC / DC reactive processes by using 2 rotary sources per chamber of any substrate with a max. size of 95x190mm rectangular size on up to 6 different chambers.
Etching of metal and/or oxides in substrates up to 200mm diameter. (Hard etch). Alternatively, also a Glow discharge cleaning station is available in order to remove organic residues on substrate surfaces. Adhesion improvement by surface activation.
Rapid cool down of hot substrates in a individual chamber in order not to exceed a certain temperature of a substrate.
Rapid heating of substrates in a individual chamber up to 400°C in order prepare a substrate prior coating.
Each substrate rotates in each process chamber to get perfect angular uniformity of a substrate as a default function.
Highly flexible substrate sizes by using a dedicated substrate carrier for a given substrate. Substrate might have any shape up to a max diameter of 220mm and 4mm thickness. Every size that is within this range can be transported and coated.
up to 1200 pcs (depending on process) and up to 6 process chambers running in parallel.
The S151 is a work horse for cost efficient high volume production for selected applications in Power Devices, Photovoltaics and Photonics using PVD, PVE and RTP technologies. Its proven carrier system guarantees secure high speed handling for substrates up to 8 inch diagonal.
The S380 is optimized for high volume production of larger flexible or rigid substrates by PVD, PVE and RTP technologies. It's proven carrier system guarantees secure high speed handling for substrates up to 15 inch diagonal.
Today's smart devices offer us more capability than ever, but we expect them to be more robust than ever too. Learn about the new hard coating solutions available to protect them as they taking a pounding in our pockets or lying in the sand.