SOLARIS® S151
Inline architecture for 200mm
SOLARIS® S151
The "inline" SOLARIS® S151 offers easy tool configuration and scope for future expansion for multiple processes and substrate sizes up to 8 inch diagonal. Proven manufacturing performance combined with easy size conversion provides excellent utilization and CoO.
Choose SOLARIS® S151 for selected processes in Power Devices, Optoelectronics and Photonics.
System Concept and Architecture
The SOLARIS® S151 offers a modular inline design for continuous carrier-based processing with high uptime and throughput. Its compact footprint makes it ideal for cost-efficient mass production in Power Devices, Photonics and Optoelectronics.
- Inline substrate transport with synchronized carrier indexer
- Up to six process stations and a total of seven chamber modules (incl. load / unload)
- Independent process modules for PVD, Etch or RTP
- Integrated carrier loading and unloading within the tool design
- Quick substrate-size conversion via carrier exchange
- Compact footprint and low utilities for reduced cost of ownership
- Factory interface via GEM / SECS II
Process and Coating Technologies
Each module operates independently, ensuring repeatable results in 24 / 7 production.
- PVD: DC, DC reactive or RF sputtering with optional cooling
- Etch / Activation: surface pre-clean or plasma treatment
- RTP: inline annealing up to 400 °C
- Multisource sputtering: up to 4 cathodes per chamber
- Substrate rotation for < ± 2..3 % uniformity (depending on the process)
- Typical materials: SiN, SiO₂, Al₂O₃, ITO, TiO₂, Al, NiV, Ag, AuGe, Zn:AlO and alloys via MSQ multisource
3D Coating Capability with Rotary Sources (RSQ 250)
SOLARIS® S151 process chambers can be equipped with RSQ 250 Rotating Cylindrical Magnetron sources.
Each sputtering module features two rotary cathodes, enabling uniform 3D film deposition on structured or stepped substrates.
Continuous rotation of the cylindrical targets ensures excellent thickness uniformity, superior target utilization (> 85 %), and minimal particle generation or arcing.
Together with rotating substrate lift and precise gas-flow control, the system achieves high-quality coatings even on complex 3D geometries.
Maintenance is simplified by quick-access cathode assemblies that can be pulled back and tilted by 90° for fast target exchange.
An optional ARG 151 + RSQ 250 chamber adds in-situ glow-discharge pre-cleaning for improved adhesion and process stability.
Modularity and Upgradeability
- Exchange or add cathodes (PVD / Etch / RTP) at any time
- Handle substrates up to 200 mm or mini-batch carriers
- Target and shield change ≤ 30 min
- Independent chamber operation for multilayer flexibility
System Features and Compliance
- CE / EN 60204-1 compliant
- Noise < 70 dB(A) during normal operation
- Operating environment 18 – 30 °C, 40 – 60 % r.h. (non-condensing)
- Service-friendly access and low maintenance
Performance Highlights
|
Substrate / Carrier Size |
up to 8 in diagonal |
|
Throughput (typ.) |
≤ 1200 pcs / h |
|
Process Stations |
up to 6 |
|
Total Chambers |
7 (incl. load / unload) |
|
Max. Process Temp. |
400 °C |
|
Coated Area |
Ø 200 mm |
|
Uniformity* |
<= ± 2..3 % |
*depending on material
Typical Applications
- Power Devices – metallization and annealing
- Optoelectronics & Photonics – dielectric and reflective coatings
- Touch Panels – ITO, metal and TCO layers
- Photovoltaics – back-side and transparent conductive coatings
- Thermoelectrics – multilayer metal and oxide stacks
- 3D Components – uniform coatings on stepped or structured surfaces using RSQ 250 rotary sources