Evatec SOLARIS S380

SOLARIS® S380

Inline architecture for 15inch diagonal

 

SOLARIS® S380

The "inline" SOLARIS® S380 offers easy tool configuration and scope for future expansion for multiple processes and substrate sizes. It handles carriers up to 15 inch diagonal. Proven manufacturing performance combined with easy size conversion provides excellent utilization and CoO.

Choose SOLARIS® S380 for selected high volume processes like chip scale EMI shielding or touch panel.

System Concept and Architecture

The SOLARIS® S380 is optimized for high-volume production of larger substrates up to 15 inches.
It provides high throughput and excellent uniformity, making it ideal for EMI shielding, display applications and large-area conductive coatings.

  • Inline substrate transport with synchronized carrier indexer
  • Up to five process stations and a total of six chamber modules (incl. load / unload)
  • Independent process modules for PVD, Etch or RTP
  • Integrated carrier loading and unloading within the tool design
  • Quick size conversion for flexible substrate formats via carrier exchange
  • Each process module runs independently for maximum uptime and repeatability.
  • PVD: DC, DC reactive or RF sputtering with chamber & shield cooling
  • Etch / Activation: pre-clean or plasma surface treatment
  • RTP: inline annealing up to 400 °C
  • Multisource sputtering: up to 4 cathodes per chamber
  • Substrate rotation for < ± 2..3 % uniformity (depending on material / process)
  • Typical materials: SiN, SiO₂, Al₂O₃, ITO, TiO₂, Al, NiV, Ag, AuGe, Zn:AlO and alloys via MSQ multisource
  • Penta Plus cathode technology for excellent step coverage and reduced target change time in EMI shielding applications

Modularity and Upgradeability

  • Add or exchange process modules for PVD, Etch or RTP
  • Handle substrates or carriers up to 380 mm diagonal
  • Target and shield change ≤ 60 min
  • Independent chamber operation for multilayer flexibility

System Features and Compliance

  • CE / EN 60204-1 compliant
  • Noise < 70 dB(A) during normal operation
  • Operating environment 18 – 30 °C, 40 – 60 % r.h. (non-condensing)
  • Easy maintenance and fast service access

Performance Highlights

Substrate / Carrier Size

up to 15 in diagonal

Throughput (typ.)

≤ 720 pcs / h

Process Stations

up to 5

Total Chambers

6 (incl. load / unload)

Max. Process Temp.

400 °C

Coated Area

Ø 380 mm

Uniformity*

<= ± 2..3 %

*depending on material

Typical Applications

  • EMI Shielding – wafer- and panel-level coatings using Evatec’s Penta Plus cathode technology for superior step coverage and film uniformity
  • Touch Panels & Displays – large-area transparent conductive films (TCO / ITO)
  • Photovoltaics – transparent and metal coatings for high-efficiency cells
  • Optoelectronics – multilayer dielectric coatings
  • Power Devices – thick metal deposition and contact formation