Evatec has delivered in excess of 2000 BAK evaporators to the market, the majority of which are "standard throw", configured for conventional high precision coating processes on 2D and 2.5D substrates.
From the compact 0.5 metre BAK 501, optimized for university R&D to the giant BAV2000 handling 65 8inch substrates in a single batch our systems can all be equipped with Evatec's own source and process control technologies to ensure high precision processes across in semiconductor, optoelectronics and photonics.
Choosing an Evatec evaporator means you can be confident
To read more about the BAK Family click the Download icon in the picture or visit the news section of our web site.
Evatec 'lift off' systems have extended throw for process geometries where subsequent film patterning steps call for zero side wall coverage.
Extended throw system benefits
Evatec 'lift off' systems use all the proven source and process control components of our standard throw platforms such as our EBS E gun technology and our Khan system and process controller but have lowered source chambers according to calotte geometry and substrate size to achieve the correct working distances required during evaporation. They are available in a wide range of platform sizes.
Just like standard throw systems however, "Lift Off" systems can also be specified in Split Chamber format or to incorporate one of a number of Assisted Loading options.
Looking for even more flexibility?
Ask about Evatec’s custom engineering solutions with interchangeable or motor driven tooling enabling both standard and "lift off" processes to be run easily in the same chamber as well as chamber extensions to run "in-situ" high uniformity etch prior to dep.
To read more about the BAK Family download the brochure or visit the news section of our web site.
Evatec "Split Chamber" systems integrate a valve between source and substrate chamber, allowing the sources to be kept 'ready' under vacuum during main chamber vent and substrate load/unload.
Split chamber benefits in a n nutshell
"Split Chamber" systems are already a well proven Evatec part of the BAK family. They use proven EBS E Gun technology and our Khan system and process controller. Taking the best from our 'Samson' platform, our new generation systems make life even easier with slide out source chambers for rapid refill and maintenance, a wider range of source technologies like extended capacity e guns or effusion cells, and the most accurate quartz and GSM optical monitoring control techniques ever with 'on line re-optimization' mid process for the most demanding thin film stack designs.
To read more about the BAK Family download the brochure or visit the news section of our web site.
Evatec has delivered in excess of 2000 BAK evaporators to the market, the majority of which are "standard throw", configured for conventional high precision coating processes on 2D and 2.5D substrates.
From the compact 0.5 metre BAK 501, optimized for university R&D to the giant BAV2000 handling 65 8inch substrates in a single batch our systems can all be equipped with Evatec's own source and process control technologies to ensure high precision processes across in semiconductor, optoelectronics and photonics.
Choosing an Evatec evaporator means you can be confident
To read more about the BAK Family click the Download icon in the picture or visit the news section of our web site.
Evatec 'lift off' systems have extended throw for process geometries where subsequent film patterning steps call for zero side wall coverage.
Extended throw system benefits
Evatec 'lift off' systems use all the proven source and process control components of our standard throw platforms such as our EBS E gun technology and our Khan system and process controller but have lowered source chambers according to calotte geometry and substrate size to achieve the correct working distances required during evaporation. They are available in a wide range of platform sizes.
Just like standard throw systems however, "Lift Off" systems can also be specified in Split Chamber format or to incorporate one of a number of Assisted Loading options.
Looking for even more flexibility?
Ask about Evatec’s custom engineering solutions with interchangeable or motor driven tooling enabling both standard and "lift off" processes to be run easily in the same chamber as well as chamber extensions to run "in-situ" high uniformity etch prior to dep.
To read more about the BAK Family download the brochure or visit the news section of our web site.
Evatec "Split Chamber" systems integrate a valve between source and substrate chamber, allowing the sources to be kept 'ready' under vacuum during main chamber vent and substrate load/unload.
Split chamber benefits in a n nutshell
"Split Chamber" systems are already a well proven Evatec part of the BAK family. They use proven EBS E Gun technology and our Khan system and process controller. Taking the best from our 'Samson' platform, our new generation systems make life even easier with slide out source chambers for rapid refill and maintenance, a wider range of source technologies like extended capacity e guns or effusion cells, and the most accurate quartz and GSM optical monitoring control techniques ever with 'on line re-optimization' mid process for the most demanding thin film stack designs.
To read more about the BAK Family download the brochure or visit the news section of our web site.