A choice of architectures
The CLUSTERLINE® 200 can be configured as a tool for single substrate or batch processing using Single Process Modules (SPM) or a Batch Process Module (BPM) respectively. However you configure the tool, you can rely on fully automated cassette-to-cassette processing using Evatec's proven safe handling. For custom applications please also enquire configurations combining both single and batch process modules.
SPM configuration highlights
Platform variant with strong pedigree in Power Devices, Advanced Packaging, MEMS and Wireless markets allowing easy tool configuration and future expansion for PVD, highly ionized PVD, Soft Etch, PECVD and PEALD for wafer sizes up to 200mm.
BPM configuration highlights
Platform variant combining the benefits of sputter batch processing with completely automated handling for selected applications in MEMS and Wireless. A true work horse LED / Micro Display and Photonics industries. Integration of additional plasma sources opens up process possibilities for enhanced deposition processes e.g coating modification including gap filling and planarization.
Main elements include
Platform
Process Modules / Components
Download the brochure
To download the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with single process module (SPM) technology click here
Platform Overview
Advanced Process Control (APC) comes as standard
Here are just some of the “in-situ” techniques available according to the application and process
Download the brochure
To download the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with batch process module (BPM) technology click here
Proven production capabilities come as standard when you choose CLUSTERLINE® 200. Evatec process and know-how covers materials including high performance piezo electrics, magnetics, metals and dielectrics.
From plasma damage free deposition of TCOs, DBRS and contacts on GaN in LED production to the highly repeatable deposition of single double sided coatings for 3D imaging and Gesture Recognition for the next generation smart phones, CLUSTERLINE® 200 platforms come with proven capability in deposition of thin film stacks with precise control over parameters such as stress, stoichiometry, refractive index.
To read more about typical application examples download the brochure(s) or visit the news section of our web site.
A choice of architectures
The CLUSTERLINE® 200 can be configured as a tool for single substrate or batch processing using Single Process Modules (SPM) or a Batch Process Module (BPM) respectively. However you configure the tool, you can rely on fully automated cassette-to-cassette processing using Evatec's proven safe handling. For custom applications please also enquire configurations combining both single and batch process modules.
SPM configuration highlights
Platform variant with strong pedigree in Power Devices, Advanced Packaging, MEMS and Wireless markets allowing easy tool configuration and future expansion for PVD, highly ionized PVD, Soft Etch, PECVD and PEALD for wafer sizes up to 200mm.
BPM configuration highlights
Platform variant combining the benefits of sputter batch processing with completely automated handling for selected applications in MEMS and Wireless. A true work horse LED / Micro Display and Photonics industries. Integration of additional plasma sources opens up process possibilities for enhanced deposition processes e.g coating modification including gap filling and planarization.
Main elements include
Platform
Process Modules / Components
Download the brochure
To download the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with single process module (SPM) technology click here
Platform Overview
Advanced Process Control (APC) comes as standard
Here are just some of the “in-situ” techniques available according to the application and process
Download the brochure
To download the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with batch process module (BPM) technology click here
Proven production capabilities come as standard when you choose CLUSTERLINE® 200. Evatec process and know-how covers materials including high performance piezo electrics, magnetics, metals and dielectrics.
From plasma damage free deposition of TCOs, DBRS and contacts on GaN in LED production to the highly repeatable deposition of single double sided coatings for 3D imaging and Gesture Recognition for the next generation smart phones, CLUSTERLINE® 200 platforms come with proven capability in deposition of thin film stacks with precise control over parameters such as stress, stoichiometry, refractive index.
To read more about typical application examples download the brochure(s) or visit the news section of our web site.