PLASMA-ENHANCED ATOMIC LAYER DEPOSITION (PEALD)
Overview
Thin films produced by sputter deposition can address various functionalities such as high optical transparency, defined electrical conductivity, and specific electromechanical properties like piezoelectric performance. These properties are easily achieved on flat and planar substrates. However, for non-planar surfaces, such as structured wafers and surfaces with small curvature radii, chemistry-based techniques provide solutions beyond line-of-sight.
Evatec’s new PEALD module integrated within the CLUSTERLINE® 200 family enables the deposition of thin dielectric film and opens up new possibilities for developing process flows using etch, PVD and PECVD on one single platform without breaking vacuum.
This enables the seamless creation of layer stacks of various thin film materials, such as piezo-active systems with an oxide or nitride capping layer.
Are such combinations of various techniques missing in your tool portfolio? Does this versatile module fit into your existing CLUSTERLINE® 200 unit, or are you considering a cluster just with PEALD modules? We would be happy to discuss the various options with you!
Why Evatec PEALD
Conformality, repeatability and high film thickness uniformity come as standard, but a microwave plasma source also reduces deposition temperatures, allowing the preparation of Al₂O₃ films at near room temperature. Microwave plasmas have very low sheath voltages, which is crucial for protecting ion radiation-sensitive materials.
Flexible Operating Modes and Material Customization
The PEALD module can be operated with a radiofrequency bias to control the energy of impinging ions. This allows tuning of material parameters such as density, refractive index, and microstructure. An arrangement of high-strength permanent magnets enables electron cyclotron resonance (ECR) conditions, leading to high plasma densities at low temperatures.
Advanced Features and Applications
The PEALD module is equipped with a heatable substrate chuck, allowing temperatures up to 500°C. This opens new possibilities for post-deposition annealing without compromising the PEALD process. The system can use two different metal precursors, allowing the deposition of ternary films such as SrTiO3 , Ta-C-N, etc. with varying elemental ratios. Ternary oxides, e.g. ITO, as well as AX/BY type multilayer structures (where X and Y are non-metals) can also be produced.
Efficiency and Cost Reduction
The design of the module and processes has been optimized to achieve minimal precursor consumption, reducing the cost of ownership. A special carrier configuration allows for double-sided deposition of substrates in a single run, maintaining the same layer thickness on both sides.
PEALD Platforms
PEALD technology is available on Evatec's production proven CLUSTERLINE® 200 platform.
Our experts are on hand to help you so please just contact us if you have questions. Alternatively, click on the photo link to read more.
CLUSTERLINE® 200
Semiconductor industry standard cluster platform for 200mm single substrate processing integrating modules for ICP etch, PVD and PEAVD.
