PECVD Technology
PLASMABOX® technology for high quality coatings at low temperature
Overview
The production proven PLASMABOX® concept means we can improve film properties for special applications and reduce cross contamination due to differential pumping and in-situ cleaning. With the pressure difference and the colder outer chamber wall we keep away outgassing impurities from the process chamber, which improves the film quality. Our PECVD processes run at lower temperatures compared with other PECVD or CVD systems which brings some great opportunities:
- Flexible concept, open for customization
- Modular chuck design for fast size conversion
- Very high film purity, better than standard parallel plate design
- Outstanding thickness uniformity (1.5% (1sigma) on 8”) and layer properties
- In-situ cleaning with SF6 or other gases
- Dual pressure gauge (process / cleaning)
- Stress tuning capability (tensile / compressive)
- Tunable refractive index
- Pinhole free films with high breakdown voltages
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PLASMABOX®
Evatec PLASMABOX® process knows how to deliver deposition processes for layers including SiO2, SiN, SiOxNy, SiOF, α-Si using process gases including NH3, SiH4, H2, Ar, He, N2O, N2, SF6, O2, N2, and SiF4.
Click here to see a cross section of PLASMABOX®
PECVD Platforms
PECVD technology using PLASMABOX® is available on Evatec's production proven CLUSTERLINE® 200 platform.
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CLUSTERLINE® 200
Semiconductor industry standard cluster platform for 200mm single substrate processing integrating modules for ICP etch, PVD and PECVD.