CLUSTERLINE® 200
Cluster architecture for 200mm
From Etch and PVD to PECVD & PEALD – Single process module flexibility on a single 200mm platform
Wireless
- SAW & BAW technology including High Sc content AlScN for RF Filters
- Optimisation of stress, crystallinity and resistivity in electode processes
Power Devices
- Front and backside processes with over 50 years production process know how on Si
- Leading the way for new WBG processes including GaN and SiC
MEMS
- New levels of performance for piezoelectrics including PZT and AlScN
- Full process solutions across metals, oxides, TCOs and soft magnetics
A platform built for performance and flexibility
CLUSTERLINE® 200 is a Swiss-engineered modular cluster platform built for high performance, durability, and scalability. Designed to meet the demands of high-mix, high-yield fabs, it supports both single wafer and batch processing through configurable Single Process Modules (SPM) and Batch Process Modules (BPM).
At the center of the system are the Vacuum Transfer Modules (VTM1E, VTM5E and VTM8E) enabling:
- Up to 6 treatment units for substrate conditioning, ID reading, and more
- 1 to 6 process module ports for SPM or BPM integration
- SMIF-compatible load ports with automatic load lock doors
- Up to 4 process gases, including UHP capability
The architecture supports integration of PVD, PVE, PECVD, and PEALD — all within a single vacuum environment. Its modular design ensures fast upgrades, isolated maintenance, and long-term cost efficiency.
SPM configuration highlights
Optimized for Power Devices, Advanced Packaging, MEMS, and Wireless, the SPM configuration delivers:
- Wafer handling from 4" to 8" (SEMI standard and customization)
- Thin wafer processing
- Up to 4 process gases per module
Each SPME is tailored to specific process needs, with modular chucks enabling fast wafer size changeovers and maximum tool utilization.
BPM configuration highlights
Purpose-built for high-throughput production in MEMS, Wireless, LED, Micro Display, and Photonics, the BPM configuration supports:
- Wafer handling from 4" to 8" (SEMI standard and customization)
- Batch processing of up to 20+1 (6") or 15+1 (8") wafers
- Rotating substrate table with optional individual chuck rotation
- Up to 4 sputter sources and 1 plasma source or 5 sputter sources
- Co-Sputter of up to 3 sputter sources
- Support for heavy substrates (up to 1200g with 1-arm robot, up to 700g with 2-arm robot) and a wide range of carriers
The BPME delivers exceptional layer uniformity through synchronized rotation of target, table, and chuck. Optional in-situ process control tools like GSM and PEM ensure consistent, high-quality results.
SPM configuration
Main elements include
- High vacuum chamber: Upstream and downstream pressure control
- PVD: High-uniformity planar magnetron sources (RF, DC, RFDC, HIS, Power Modulation), rotating magnet systems, Flexicath™ for target life compensation
- Advanced Directional PVD: For TSVs and high aspect ratio structures
- PVE Soft Etch: ICP RF etch with low bias and reactive gas support (H₂, N₂, O₂)
- Thermal Management: Arctic chuck and Ice Dome cooling to -30 °C; heating up to 800 °C
- Chuck Options: ESC, clamped, clampless, recessed, RF bias, and gas conduction
- Multisource Modules: Up to 4 PVD sources per SPM and rotating chuck
- PEALD: High-density ECR plasma for conformal coatings with minimal ion damage and no vacuum break
- PECVD: PLASMABOX® for ultra-clean, high-purity films
BPM configuration
Platform Overview
- Batch Efficiency: Simultaneous processing of up to 21 × 6" or 15 × 8" wafers for high-volume throughput
- Thermal Control: Integrated heating and cooling capabilities up to 350 °C for optimal process stability
- Substrate Handling: Supports direct wafer or carrier transfer, including flip system for double-sided coating without vacuum break
- Deposition Flexibility: BPM with rotating table, adjustable source distance, and custom chuck/clamp designs for tailored process control
- Uniformity Performance: Rotating target technology ensures high-rate deposition with excellent layer uniformity
- Compact Scalability: Space-efficient footprint with modular design for future expansion and fab integration
- “in-situ” - Advanced Process Control (APC)
- PEM: Plasma Emission Monitoring for real-time stoichiometry control
- GSM: Broadband optical monitoring with in-situ reoptimization for precise layer termination
XPERIENCE™ Software
Smart Control for Smart Manufacturing
- Factory Automation Ready: SEMI-standard host interface with customizable integration options
- Role-Based Access: Ensures safe operation and compliance with fab protocols
- Real-Time Monitoring: Live and historical data logging with graphical analysis tools
- Substrate Tracking: SEMI-compliant tracking with dedicated dashboards
- System Performance Insights: Uptime, MTBF, and usage metrics at a glance
Vacuum Transfer Modules
At the center of the system, there are the Vacuum Transfer Modules (VTM1E, VTM5E and VTM8E) enabling:
- Integration of up to 6 process modules (SPM or BPM)
- Support for up to 6 treatment units for substrate conditioning, ID reading, and more
- SMIF-compatible load ports with automatic load lock doors
- Up to 4 process gases, including UHP capability
Single Process Modules
Optimized for Power Devices, Advanced Packaging, MEMS, and Wireless - offers unmatched flexibility for diverse semiconductor applications. The SPM configuration delivers
- Wafer handling from 4" to 8" (SEMI standard and customized), including thin wafers
- Modular chucks for fast wafer size changeovers and high tool utilization.
- High-vacuum chambers with optional upstream or downstream pressure control
- PVD with high-uniformity planar magnetron sources (DC, DC pulsed, RF, DCRF, DC pulsed RF, HIS, Power Modulation, Primary Secondary configuration), rotating magnet systems, and Flexicath™ for target life compensation
- Advanced directional PVD for TSVs and high aspect ratio structures
- PVE Soft Etch with ICP RF etch and reactive gas support
- Multisource modules with up to 4 PVD sources (DC, RF, DCRF) and 500°C rotating chuck, combined with Target & Substrate Shutter
- Up to four process gases in Standard Gasbox (Ar, N2, O2, Air, He, Kr, Xe), one process gas in Gasbox Hazardous Gases (H2 or NH3 or CH4)
Chuck Options
There is a wide range of chuck configurations to meet both substrate-specific and process-driven requirements. Each chuck is selected based on wafer size, backside contact needs, and mechanical constraints such as thin wafer handling.
- Substrate Interface: Supports full-face contact, or minimal contact handling to accommodate thin wafers, structured surfaces, or backside-sensitive substrates.
- Thermal Management: Cooling down to –30 °C or heating up to 1000 °C for high-temperature processes
- Process Integration: Chucks can be configured with RF bias capability and adapted to specific deposition or etch requirements.
Batch Process Module
Purpose-built for volume production in MEMS, Wireless, LED, Micro Display, and Photonics, the BPME delivers outstanding layer uniformity and productivity. Synchronized rotation of target, table, and chuck ensures excellent film consistency, while optional in-situ tools like GSM and PEM enable real-time process control.
- Wafer Handling: Supporting a variety of formats (SEMI standard and customized) and weights
- Batch Capacity: Up to 32 (4"), 21 (6") or 15 (8") wafers per run
- Rotating Substrate Table: With optional individual chuck rotation for enhanced uniformity
- Flexible Source Configuration: Up to 4 sputter + 1 plasma source, or 5 sputter sources
- Co-Sputtering: Simultaneous use of up to 3 sputter sources for advanced material stacks
PEALD Module
The Plasma Enhanced Atomic Layer Deposition (PEALD) module is fully integrated into the CLUSTERLINE® 200 platform, enabling seamless combination with PVD, PVE, and other processes without breaking vacuum.
- High-Density ECR Plasma: Ensures highly uniform, conformal coatings while minimizing ion-induced damage – ideal for sensitive materials.
- Dual-Chamber Design: Enables fast ALD cycle times for improved throughput.
- Ultra-Fast ALD Valves: Provide precise precursor and process gas dosing for consistent film quality.
- Modular Gas Box: Optimized for low precursor and gas consumption, reducing cost of ownership
PECVD Module
The Plasma Enhanced Chemical Vapor Deposition (PECVD) module uses the PLASMABOX® concept for ultra-clean, high-purity films
Treatment Units
At the VTM5/8 up to six individually configurable Treatment Units (TUs) are available. Each TU is available in variants optimized for 4", 6", or 8" wafers, with options for SEMI-standard or customized handling. This modularity allows customers to configure the ideal combination of pre- or post-process treatment functions for their specific application and throughput needs.
- TU Degasser: Removing contaminants from substrates or annealing the substrate
- TU Cooler: Cools substrates to stabilize temperature-sensitive materials and reduce thermal drift.
- TU Reader: Reads wafer ID codes (e.g., OCR, barcode) for full traceability
- TU Aligner: Precisely aligns wafers based on flat or notch orientation to ensure consistent process positioning.
- TU RGA (Residual Gas Analyzer): Monitors vacuum chamber atmosphere for contamination control and process diagnostics.
- TU Buffer: Temporarily stores wafers to decouple process steps, optimize throughput, and support advanced scheduling strategies in combination with pasting or conditioning.
Loadlocks & Loadports
Designed for compatibility with modern fab environments, we offer flexible loadport and loadlock configurations to support a wide range of automation requirements and customer preferences.
- SMIF-Compatible Loadlocks: Automatic load lock doors ensure contamination-free wafer transfer and enable full fab automation.
- Flexible Loadport Options, either provided by customer or Evatec: Brooks or Fortrend (US Free)
- E84 Interface Ready: Optional E84 interface ensures seamless connection to factory automation systems.
System Supply
The CLUSTERLINE® 200 is engineered for rapid and reliable integration into production environments. All utility interfaces, such as power, water, and process gases, are pre-configured for plug-and-play installation at the customer site, minimizing setup time and complexity.
- Electrical Cabinet: Houses all necessary power generators and control systems for streamlined tool operation.
- Utility-Ready Design: Simplifies facility integration with clearly defined connections for all required media.
- Forepump Flexibility: Forepumps can be supplied either by Evatec or sourced directly by the customer, depending on project needs.
Read more about the CLUSTERLINE® 200 in our LAYERS magazine
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