CLUSTERLINE® 200
Cluster architecture for 200mm
From Etch and PVD to PECVD & PEALD – Single process module flexibility on a single 200mm platform
Wireless
- SAW & BAW technology including High Sc content AlScN for RF Filters
- Optimisation of stress, crystallinity and resistivity in electode processes
Power Devices
- Front and backside processes with over 50 years production process know how on Si
- Leading the way for new WBG processes including GaN and SiC
MEMS
- New levels of performance for piezoelectrics including PZT and AlScN
- Full process solutions across metals, oxides, TCOs and soft magnetics
A platform built for performance and flexibility
CLUSTERLINE® 200 is a Swiss-engineered modular cluster platform built for high performance, durability, and scalability. Designed to meet the demands of high-mix, high-yield fabs, it supports both single wafer and batch processing through configurable Single Process Modules (SPM) and Batch Process Modules (BPM).
At the center of the system are the Vacuum Transfer Modules (VTM1E, VTM5E and VTM8E) enabling:
- Up to 6 treatment units for substrate conditioning, ID reading, and more
- 1 to 6 process module ports for SPM or BPM integration
- SMIF-compatible load ports with automatic load lock doors
- Up to 4 process gases, including UHP capability
The architecture supports integration of PVD, PVE, PECVD, and PEALD — all within a single vacuum environment. Its modular design ensures fast upgrades, isolated maintenance, and long-term cost efficiency.
SPM configuration highlights
Optimized for Power Devices, Advanced Packaging, MEMS, and Wireless, the SPM configuration delivers:
- Wafer handling from 4" to 8" (SEMI standard and customization)
- Thin wafer processing
- Up to 4 process gases per module
Each SPME is tailored to specific process needs, with modular chucks enabling fast wafer size changeovers and maximum tool utilization.
BPM configuration highlights
Purpose-built for high-throughput production in MEMS, Wireless, LED, Micro Display, and Photonics, the BPM configuration supports:
- Wafer handling from 4" to 8" (SEMI standard and customization)
- Batch processing of up to 20+1 (6") or 15+1 (8") wafers
- Rotating substrate table with optional individual chuck rotation
- Up to 4 sputter sources and 1 plasma source or 5 sputter sources
- Co-Sputter of up to 3 sputter sources
- Support for heavy substrates (up to 1200g with 1-arm robot, up to 700g with 2-arm robot) and a wide range of carriers
The BPME delivers exceptional layer uniformity through synchronized rotation of target, table, and chuck. Optional in-situ process control tools like GSM and PEM ensure consistent, high-quality results.
SPM configuration
Main elements include
- High vacuum chamber: Upstream and downstream pressure control
- PVD: High-uniformity planar magnetron sources (RF, DC, RFDC, HIS, Power Modulation), rotating magnet systems, Flexicath™ for target life compensation
- Advanced Directional PVD: For TSVs and high aspect ratio structures
- PVE Soft Etch: ICP RF etch with low bias and reactive gas support (H₂, N₂, O₂)
- Thermal Management: Arctic chuck and Ice Dome cooling to -30 °C; heating up to 800 °C
- Chuck Options: ESC, clamped, clampless, recessed, RF bias, and gas conduction
- Multisource Modules: Up to 4 PVD sources per SPM and rotating chuck
- PEALD: High-density ECR plasma for conformal coatings with minimal ion damage and no vacuum break
- PECVD: PLASMABOX® for ultra-clean, high-purity films
BPM configuration
Platform Overview
- Batch Efficiency: Simultaneous processing of up to 21 × 6" or 15 × 8" wafers for high-volume throughput
- Thermal Control: Integrated heating and cooling capabilities up to 350 °C for optimal process stability
- Substrate Handling: Supports direct wafer or carrier transfer, including flip system for double-sided coating without vacuum break
- Deposition Flexibility: BPM with rotating table, adjustable source distance, and custom chuck/clamp designs for tailored process control
- Uniformity Performance: Rotating target technology ensures high-rate deposition with excellent layer uniformity
- Compact Scalability: Space-efficient footprint with modular design for future expansion and fab integration
- “in-situ” - Advanced Process Control (APC)
- PEM: Plasma Emission Monitoring for real-time stoichiometry control
- GSM: Broadband optical monitoring with in-situ reoptimization for precise layer termination
XPERIENCE™ Software
Smart Control for Smart Manufacturing
- Factory Automation Ready: SEMI-standard host interface with customizable integration options
- Role-Based Access: Ensures safe operation and compliance with fab protocols
- Real-Time Monitoring: Live and historical data logging with graphical analysis tools
- Substrate Tracking: SEMI-compliant tracking with dedicated dashboards
- System Performance Insights: Uptime, MTBF, and usage metrics at a glance
Interactive Element
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Download the brochure
Read the brochure about the hardware and process capabilities of CLUSTERLINE® 200 equipped with batch process module (BPM) technology.
Buying a new Evatec tool is just the first step in a long term partnership. From initial ramp up support to ongoing maintenance or retrofits adding new capabilities, maximise both uptime and tool working life together with Evatec’s local customer service teams.
- We can help you plan and manage your stocks
- Use our exchange programmes to minimize downtimes
- Our local Field Service Engineers on hand when you need us
- Maximizing output - From Continuous Improvement Programmes (CIP) to new process installations
- Add new capabilities to support your technology roadmaps
- Helping you extend tool working life
- Helping you to help yourself
- Tailored just for you - At Evatec or in your own fab