CLUSTERLINE® 200
Cluster architecture for 200mm
From Etch and PVD to PECVD & PEALD – Single process module flexibility on a single 200mm platform
Wireless
- SAW & BAW technology including High Sc content AlScN for RF Filters
- Optimisation of stress, crystallinity and resistivity in electode processes
Power Devices
- Front and backside processes with over 50 years production process know how on Si
- Leading the way for new WBG processes including GaN and SiC
MEMS
- New levels of performance for piezoelectrics including PZT and AlScN
- Full process solutions across metals, oxides, TCOs and soft magnetics
A platform built for performance and flexibility
CLUSTERLINE® 200 is a modular cluster platform that can be tailored to individual customer needs for deposition of the most precise layers. Flexible and proven in daily use around the world, CLUSTERLINE® 200 configurations and process technologies are scalable from R&D to true volume production. Designed to meet the demands of high-mix, high-yield fabs, it supports both single wafer and batch processing through configurable Single Process Modules (SPM) and Batch Process Modules (BPM).
The architecture supports integration of PVD, PVE, PECVD, and PEALD for development and execution of multi step multi process technology processes all without intermediate vacuum break. Its modular design ensures fast upgrades, isolated maintenance, and long-term cost efficiency.
Find out more about individual system elements below.
Interactive Element
Click on the individual sections in the circle to learn more about the details.
VTM
At the center of the system, there are three different Vacuum Transfer Modules (VTM1E, VTM5E and VTM8E) enabling:
- Integration of up to 6 process modules
- Support for up to 6 treatment units for substrate conditioning, ID reading, and more
- SMIF-compatible load ports with automatic load lock doors
- Up to 4 process gases, including UHP capability
SPM
Optimized for Power Devices, Advanced Packaging, MEMS, and Wireless - They offer unmatched flexibility for diverse semiconductor applications. The SPM configuration delivers:
- Wafer handling from 4" to 8" (SEMI standard and customized), including thin wafers
- Modular chucks for fast wafer size changeovers and high tool utilization
- High-vacuum chambers with optional upstream or downstream pressure control
Etch & Sputter
Custom etch and sputter capability according to application:
- PVD with high-uniformity planar magnetron sources (DC, DC pulsed, RF, DCRF, DC pulsed RF, HIS, Power Modulation, Primary Secondary configuration), rotating magnet systems, and Flexicath™ for target life compensation
- Advanced directional PVD for TSVs and high aspect ratio structures
- PVE Soft Etch with ICP RF etch and reactive gas support
- Multisource modules with up to 4 PVD sources (DC, RF, DCRF) and 500°C rotating chuck, combined with Target & Substrate Shutter
- Up to four process gases in Standard Gasbox (Ar, N2, O2, Air, He, Kr, Xe), one process gas in Gasbox Hazardous Gases (H2 or NH3 or CH4)
Chuck Options
There is a wide range of chuck configurations to meet both substrate-specific and process-driven requirements. Each chuck is selected based on wafer size, backside contact needs, and mechanical constraints such as thin wafer handling.
- Substrate Interface: Supports full-face contact, or minimal contact handling to accommodate thin wafers, structured surfaces, or backside-sensitive substrates.
- Thermal Management: Cooling down to –30°C or heating up to 1000 °C for high-temperature processes
- Process Integration: Chucks can be configured with RF bias capability and adapted to specific deposition or etch requirements.
BPM
Purpose-built for volume production in MEMS, Wireless, LED, Micro Display, and Photonics, the BPM delivers outstanding layer uniformity and productivity. Synchronized rotation of target, table, and chuck ensures excellent film consistency, while optional in-situ tools like GSM and PEM enable real-time process control for the deposition of precision stacks in Photonics and Optoelectronics:
- Wafer Handling: Supporting a variety of formats (SEMI standard and customized) and weights
- Batch Capacity: Up to 32 (4"), 21 (6") or 15 (8") wafers per run
- Rotating Substrate Table: With optional individual chuck rotation for enhanced uniformity
- Flexible Source Configuration: Up to 4 sputter + 1 plasma source, or 5 sputter sources
- Co-Sputtering: Simultaneous use of up to 3 sputter sources for advanced material stacks
PEALD Module
The Plasma Enhanced Atomic Layer Deposition (PEALD) module is fully integrated into the CLUSTERLINE® 200 platform, enabling seamless combination with PVD, PVE, and other processes without breaking vacuum.
- High-Density ECR Plasma: Ensures highly uniform, conformal coatings while minimizing ion-induced damage – ideal for sensitive materials
- Dual-Chamber Design: Enables fast ALD cycle times for improved throughput
- Ultra-Fast ALD Valves: Provide precise precursor and process gas dosing for consistent film quality
- Modular Gas Box: Optimized for low precursor and gas consumption, reducing cost of ownership
PECVD Module
The PECVD module uses the PLASMABOX® concept for ultra-clean, high-purity films
- Precise pinhole free dielectrics
- Insitu module cleaning for simple maintenance in production
Treatment Units
At the VTM5/8 up to six individually configurable Treatment Units (TUs) are available. Each TU is available in variants optimized for 4", 6", or 8" wafers, with options for SEMI-standard or customized handling. This modularity allows customers to configure the ideal combination of pre- or post-process treatment functions for their specific application and throughput needs.
- TU Degasser: Removing contaminants from substrates or annealing the substrate
- TU Cooler: Cools substrates to stabilize temperature-sensitive materials and reduce thermal drift
- TU Reader: Reads wafer ID codes (e.g., OCR, barcode) for full traceability
- TU Aligner: Precisely aligns wafers based on flat or notch orientation to ensure consistent process positioning
- TU RGA (Residual Gas Analyzer): Monitors vacuum chamber atmosphere for contamination control and process diagnostics
- TU Buffer: Temporarily stores wafers to decouple process steps, optimize throughput, and support advanced scheduling strategies in combination with pasting or conditioning
Loadlocks & Loadports
Designed for compatibility with modern fab environments, we offer flexible loadport and loadlock configurations to support a wide range of automation requirements and customer preferences.
- SMIF-Compatible Loadlocks: Automatic load lock doors ensure contamination-free wafer transfer and enable full fab automation
- Flexible Loadport Options, either provided by customer or Evatec: Brooks or Fortrend (US Free)
- E84 Interface Ready: Optional E84 interface ensures seamless connection to factory automation systems
System Supply
The CLUSTERLINE® 200 is engineered for rapid and reliable integration into production environments. All utility interfaces, such as power, water, and process gases, are pre-configured for plug-and-play installation at the customer site, minimizing setup time and complexity.
- Electrical Cabinet: Houses all necessary power generators and control systems for streamlined tool operation
- Utility-Ready Design: Simplifies facility integration with clearly defined connections for all required media
- Forepump Flexibility: Forepumps can be supplied either by Evatec or sourced directly by the customer, depending on project needs
Vacuum Transfer Architecture (VTM)
At the heart of the CLUSTERLINE® 200 is its vacuum based transport architecture designed for reliability, modularity, and tailored in size for R&D or high volume production. Three sizes of VTM transfer modules form the central routing platform for all wafers, enabling seamless movement between process modules while maintaining a stable vacuum environment. The smallest VTM1 is perfect for R&D or small scale production integrating a single process module, whilst the largest VTM 8, can support up to six process modules. Up to 6 “Pre and Post Treatment” units can also be integrated into the mid and large size VTM 5 and VTM 8. VTM 5 and 8 are engineered for compatibility with SMIF based factory automation and utilize automatic load lock doors to ensure contamination free substrate transfer. With support for up to four process gases — including ultra high purity lines — the CLUSTERLINE® 200 maintains stable process performance across a wide range of PVD, PVE, PECVD, and PEALD applications. Safe secure transport including thin wafer handling is a given, and its modular architecture also ensures fast upgrades and isolated maintenance, helping fabs reduce downtime and protect long term cost efficiency.
Single Process Modules (SPM)
In Single Process Module configuration CLUSTERLINE® 200 offers a flexible platform for applications spanning power devices, MEMS, wireless, and advanced packaging. Each module supports wafer diameters from 4 to 8 inches, using SEMI‑standard or customer‑specific formats. Modular chuck options enable rapid wafer‑size changes, ensuring that production capacity can be adapted quickly to evolving manufacturing needs. Every SPM operates within a high‑vacuum environment that can be managed through upstream or downstream pressure control, ensuring finely tuned deposition and etch conditions.
Etch and Sputter
The system accommodates high uniformity planar magnetron PVD sources, including DC, DC pulsed, RF, DCRF. Rotating magnet systems and Flexicath™ technology help maintain deposition stability and extend target lifetimes.
For applications requiring directional deposition, such as through silicon vias or high aspect ratio features, Evatec’s ADS advanced directional PVD options are available. Soft etching is supported in a module with ICP based PVE configuration with reactive gases. Multisource variants allow up to four PVD sources to be combined with chuck rotation and temperature control, enabling fast track development of new material combinations or production of complex multilayer stacks and thermally demanding films.
Batch Process Module (BPM)
The Batch Process Module is engineered for high throughput requirements in markets including MEMS, photonics, LEDs, and wireless devices. Supporting wafer diameters from 4 to 8 inches, the BPM enables efficient “batch” processing” maintaining excellent film uniformity through the synchronized rotation of the substrate table and chuck — a coordinated movement that enhances deposition consistency across every wafer in the load. Evatec proprietary source design enables deposition without the traditional u4niformity shapers driving down particle levels in high precision optical stack deposition. Depending on the configuration, the module can incorporate up to four sputter sources alongside an additional plasma source, or up to five sputter sources to support more complex material stacks. Optional in situ process control systems such as GSM and PEM allow real time monitoring of film stoichiometry and ultraprecise layer termination.
Plasma Enhanced Atomic Layer Deposition (PEALD)
The integrated PEALD module brings conformal, low damage thin film deposition into the CLUSTERLINE® 200 environment without requiring vacuum breaks between pre or post PVE, PVD or PECVD steps. Its high density ECR plasma source ensures uniform layer growth while minimizing ion impact, making it suitable for sensitive materials and three dimensional structures. Evatec PEALD technology is characterised by high throughput, with ultra fast ALD valves ensure precise gas dosing and stable layer by layer film formation. The module’s gas delivery system is optimized to reduce precursor consumption and lower operational costs.
Plasma Enhanced Chemical Vapor Deposition (PECVD)
The PECVD module is based on Evatec’s PLASMABOX® concept, delivering high purity films with stable uniformity and minimized particle generation. This architecture supports a wide range of dielectric and functional coatings, making it ideal for micro display, optical, and passivation applications where consistent film quality is essential.
Treatment Units
Up to six modular treatment units can be attached to the VTM5E or VTM8E, each available for 4 inch, 6 inch, or 8 inch wafer formats. These units provide a configurable toolkit for substrate preparation and post processing. They include degassing stations for contamination removal and annealing, cooling stations to stabilize thermally sensitive materials, alignment units for precise notch or flat orientation, and ID reading units that support OCR or barcode formats. A residual gas analysis station enables real time characterization of vacuum conditions, and dedicated buffer positions help decouple process steps, improving scheduling and throughput stability across the production flow.
Load Locks and Load Ports
The platform supports a range of load port configurations to meet different fab automation requirements. SMIF compatible load locks ensure clean wafer transfer, while load port options from Evatec or customer specified vendors such as Brooks or Forntend can be integrated depending on fab standards. An optional E84 interface further enables seamless communication with automated transport systems.
System Supply and Facility Integration
The CLUSTERLINE® 200 is designed for fast deployment in production environments. Power distribution, water supply, process gases, and other utilities are pre configured for straightforward installation. The electrical cabinet consolidates power generators and control electronics, simplifying system operation and maintenance. Users may choose Evatec supplied forepumps or source their own, ensuring flexibility during procurement and facility integration.
XPERIENCE™ SOFTWARE
The XPERIENCE™ software suite provides comprehensive control and monitoring capabilities tailored for modern, highly automated semiconductor fabs. A fully SEMI compliant host interface ensures compatibility with factory automation systems and supports flexible integration into existing IT environments. The system uses role based access management, ensuring that each operator or engineer interacts with the tool using permissions appropriate to their responsibilities, contributing to safe and compliant operation. Real time and historical monitoring tools provide graphical analysis of process trends, enabling engineers to evaluate stability, investigate deviations, and optimize long term performance. Wafer tracking follows SEMI standards and visualizes substrate movement through intuitive dashboards, ensuring transparency across the entire process chain. Additionally, system performance indicators such as uptime, mean time between failures, and utilization metrics offer detailed insights into tool health, supporting data driven maintenance strategies and predictable production planning.
Read more about the CLUSTERLINE® 200 in our LAYERS magazine
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