SPM Configuration

Main elements include

Platform

• Two loadlock cassette stations-ergonomic loading, soft pump and soft vent, mapping functions to detect cross-slotted, double-loaded wafers, instant wafer slide out (protrusion) detection
• Magnetically driven robot system with dual bisymmetric arms

Process Modules / Components

• Production-proven planar magnetron sputter sources (RF & DC) with high target utilization (rotating magnetic system) or Flexicath™ for extremely high film uniformity and homogeneity requirements
• Highly ionized PVD source technology for high aspect ratio TSV applications - mainly for 3D packaging
• The PLASMABOX® design of the PECVD process module provides outstanding uniformity and avoids contamination by differential pumping and in-situ cleaning. The concept allows a very high film purity and excellent control of interfaces and doping
• PEALD process module .  Please contact us to find out more  
• ICP soft etch process module with MF Plasma enhanced RF Etch enabling high etch rate and excellent uniformity at low bias voltages. Reactive processing with H2, N2 and O2 is available
• Cooled Metal Cage (Ice Dome) and arctic chuck cooling down to -30°C, enabling highest kit life in the etch module for organic wafers like PI or PBO
• Degas module for fast wafer conditioning and repeatable process results
• Electrostatic (ESC), clampless or clamped chucks using gas conduction for active wafer cooling or heating in PVD and soft etch modules with chuck RF Bias
• Multisource with rotating chuck - up to 4 mixed DC & RF sources on one module for single target or simultaneous sputtering
• Controlled chuck temperature from -30 up to 800°C
• Magnetic alignment feature to orient magnetic films
• Optional APC with fully integrated Pyrometer and process gas monitor

BPM Configuration

Platform Overview

• 4 sided platform as standard for integration of BPM with dual load lock at front end
• Processing of up to 20pcs 6 inch substrates or 15pcs 8 inch substrates simultaneously
• Soft etch, heating and cooling capability to enhance your layer quality or protect your substrates
• Fully "Semi" standards compliant handler compatible with integration of wafer aligner
• Batch Process Module BPM integrating rotating substrate table with adjustable source to substrate distance, customized chuck and clamp designs e.g. edge grip or full face deposition and heating up to 350°C
• Upstream or downstream process gas control
• Direct substrate or carrier handling for rapid exchange between substrate formats for flexibility and maximum tool utilization.
• Flip system for double sided coating without vacuum break
• Rotating target technology for high rate and uniformity in optical interference coating

Here are just some of the “in-situ” techniques available according to the application and process

• Plasma Emission Monitoring (PEM) for correct stoichiometry in reactive oxide processes
• Broadband optical monitoring (GSM) with in-situ reoptimization for the most accurate layer end point termination and overall control of optical performance of optical stacks

Process know-how

Proven production capabilities come as standard when you choose CLUSTERLINE® 200. Evatec process and know-how covers materials including high performance piezo electrics, magnetics, metals and dielectrics.

From plasma damage free deposition of TCOs, DBRS and contacts on GaN in LED production to the highly repeatable deposition of single double sided coatings for 3D imaging and Gesture Recognition for the next generation smart phones, CLUSTERLINE® 200 platforms come with proven capability in deposition of thin film stacks with precise control over parameters such as stress, stoichiometry, refractive index.