CLUSTERLINE® 600
Panel processing up to 650mm
From 300x300 to 650x650 – proven panel processing capability
Panel Level Packaging
- Portfolio of Degas, Etch and PVD technologies
- Reliable deposition of low contact resistance (Rc)
Advanced IC Substrates
- Emerging technologies including glass core
- Custom tool features including substrate flip
High Performance Computing and AI
- Backside metallization processes for thermal management
- Best substrate utilisation efficiency for large package sizes
Overview
A large area cluster tool for single panel processing, Evatec's panel tool was introduced in 2017, and is already production proven for substrates up to 550x550mm. The latest version now offers capability for substrate sizes up to 650 x 650mm. It integrates degas, etch and deposition capabilities for Advanced Packaging applications including Fan-Out Panel Level Processing (FOPLP) and advanced IC substrate manufacturing.
Choose CLUSTERLINE® 600 for:
- Flexible cluster architecture
- Processing of glass or highly outgassing substrates
- Substrate static during processes for lowest particle counts
- Degas, etch and deposition process know-how
Interactive Element
Click on the individual sections in the circle to read all the details.
AFEM
Front End integration for manipulating the substrates from the FOUP or customer cassette through the system and back. Incl. in-situ warpage measurement and full SECS/GEM integration
- Standard 5 Loadports (LP) are possible (with extension), option for 6th
- Operator Interface ( HMI) at front for side with drawer option for rapid process development
- "Test port" with drawer enabling simple manual substrate load for process development
Many options can be integrated to AFEM including:
- Panel temperature sensor
- Electrostatic sensor (ES)
- Warpage detection
- Additional ionizers (“Top”, IMB)
- Cameras for AFEM (4) incl. recorder
- Panel ID reader from bottom (standard) or top
- Overhead Transport OHT E84
ABD
- Evatec proprietary atmospheric batch degasser is ideal for precise, repeatable outgassing of organic substrates.
- Ideal when processing substrates with material mix (e.g. different emissivity’s of Cu and ABF).
AFLIP
- Robust atmospheric "in situ" substrate flip for dual side processing.
- Keep out zone handling (KOZ) available.
ITM, IMA, IMB
2 stage Transfer module (TM) technology for rapid substrate transfer between atmospheric front end and central vacuum transfer module
- IMA & IMB - compact,fast airlocks for high throughput
- Two step pump and venting. VTM never connected direct to airlock chamber ensures most repeatable environment
- Buffer capability e.g. for pasting panel(s)
- Only 1 VTM flange taken up to support "in" and "out" processing
VTM
Central vacuum transfer module delivering substrates in and and out of single process modules ( SPMs)
- ports for integration of up to 5 single process module ports ( etch or deposition)
- Dual arm robot for maximising substrate handling efficiency
PVE
Stable, uniform etch technology at low particle levels
- PSS600 capacitive plasma etch technology
- Dual frequency for adjusting ion-bombardment and plasma density
- Panel "stationary" during process avoids particles and ensures good chuck cooling
- Handling of thin, fragile substrates
- Maximized adhesion and minimized Rc
- Prepared for one chuckgas and up to 4 process gases
- Integrated plasma power supplies for short cabling, low losses and stable processing
PVD
Uniform large area sputter deposition at low particle levels
- SSS600 with 4 rotatable cathodes
- Largest targetlife with best target cooling
- Moveable magnet for uniformity tuning
- Panel stationary during process avoids particles and ensures good chuck cooling
- Prepared for one chuckgas and up to 4 process gases
- Integrated plasma power supplies for short cabling, low losses and stable processing
Chucks
Ecatec chuck technology optimised according to process
- Selection of substrate chucks & chuck tops optimised according to application
- "Arctic" option for superb cooling in PVE
- Designs for respecting "keep out zones" (KOZ)
Supply Units
Auxiliary equipment with easy access for maintenance
- ECR rack, including power feed arc flash, control computers and power distribution system to all modules
- AFEM rack including atm. Robot controller and power distribution for all integrated components
- Water, air supply system
- Arctic chiller option for PVE
Configuration
The CLUSTERLINE® 600 open system architecture is based around a 6 sided vacuum transport module with vacuum load lock allowing easy tool configuration and future expansion for panel sizes up to 650 x 650mm.
An atmospheric frontend integrating atmospheric robot and aligner enables integration of up to four load port modules.
Panel control options include warpage detection, ionizer, electrostatic sensors, RF ID and panel temperature sensors.
CLUSTERLINE® 600 Platform
- 6 sided vacuum transport module with vacuum load lock
- Up to 5 process modules for etch or sputter processes
- Innovative new high performance Interface Transfer Module (ITM). Two load locks on one VTM flange
CLUSTERLINE® 600 Process Modules / Components
- Full process isolation
- Atmospheric Batch Degasser(s)
- Arctic etch technology for highly outgassing substrates
- Highly uniform etch and sputter technologies
- No moving panels during processing for best cooling and particle performance
Process Know-How
It all starts with atmospheric degas technology. Simultaneous degassing of 21 substrates at atmospheric pressure offers superior performance over vacuum processes with uniform degas for the best film adhesion after subsequent processing.
Dual frequency, dual electrode CCP etch source technology offers high uniformity large area etch while the panel is static for the best particle performance. RIE etch technology is also available according to customer process requirements.
Rotary cathode sputter technology offers low cost of ownership. Just like in etch, panels remain static during sputter processing for lowest particle counts.
For more information about how our customers are successfully using the tool for FOPLP production take a look at the story from our technology magazine LAYERS or contact your local sales & service organization.
Read more about CLUSTERLINE® 600 in our LAYERS magazine
CLUSTERLINE® 600 - Perfect for next generation IC-substrates too!
