CLUSTERLINE® 600
Panel processing up to 650mm
From 300x300 to 650x650 – proven panel processing capability
Panel Level Packaging
- Portfolio of Degas, Etch and PVD technologies
- Reliable deposition of low contact resistance (Rc)
Advanced IC Substrates
- Emerging technologies including glass core
- Custom tool features including substrate flip
High Performance Computing and AI
- Backside metallization processes for thermal management
- Best substrate utilisation efficiency for large package sizes
Overview
A large area cluster tool for single panel processing, Evatec's panel tool was introduced in 2017, and is already production proven for substrates up to 550x550mm. The latest version now offers capability for substrate sizes up to 650 x 650mm. It integrates degas, etch and deposition capabilities for Advanced Packaging applications including Fan-Out Panel Level Processing (FOPLP) and advanced IC substrate manufacturing.
Choose CLUSTERLINE® 600 for:
- Flexible cluster architecture
- Processing of glass or highly outgassing substrates
- Substrate static during processes for lowest particle counts
- Degas, etch and deposition process know-how
Configuration
The CLUSTERLINE® 600 open system architecture is based around a 6 sided vacuum transport module with vacuum load lock allowing easy tool configuration and future expansion for panel sizes up to 650 x 650mm.
An atmospheric frontend integrating atmospheric robot and aligner enables integration of up to four load port modules.
Panel control options include warpage detection, ionizer, electrostatic sensors, RF ID and panel temperature sensors.
CLUSTERLINE® 600 Platform
- 6 sided vacuum transport module with vacuum load lock
- Up to 5 process modules for etch or sputter processes
- Innovative new high performance Interface Transfer Module (ITM). Two load locks on one VTM flange
CLUSTERLINE® 600 Process Modules / Components
- Full process isolation
- Atmospheric Batch Degasser(s)
- Arctic etch technology for highly outgassing substrates
- Highly uniform etch and sputter technologies
- No moving panels during processing for best cooling and particle performance
Process Know-How
It all starts with atmospheric degas technology. Simultaneous degassing of 21 substrates at atmospheric pressure offers superior performance over vacuum processes with uniform degas for the best film adhesion after subsequent processing.
Dual frequency, dual electrode CCP etch source technology offers high uniformity large area etch while the panel is static for the best particle performance. RIE etch technology is also available according to customer process requirements.
Rotary cathode sputter technology offers low cost of ownership. Just like in etch, panels remain static during sputter processing for lowest particle counts.
For more information about how our customers are successfully using the tool for FOPLP production take a look at the story from our technology magazine LAYERS or contact your local sales & service organization.
Interactive Element
Click on the individual sections in the circle to read all the details.
AFEM
Handling integration for manipulating the substrates from the FOUP or customer cassette through the system and back. Incl. in-situ warpage measurement and full SECS/GEM integration
Up to 6 Loadports (LP) are possible (with extension), standard up to 5 LP
The substrates are provided in FOUPS integrated via loadports
Integrated HMI with drawer option for rapid process development
HMI mounted to side in case of pos need for LP
Many options can be integrated to AFEM:
- Panel temperature sensor
- Electrostatic sensor (ES)
- Warpage detection
- Additional ionizers (“Top”, IMB)
- Cameras for AFEM (4) incl. recorder
- Panel ID reader from bottom (standard) or top
- OHT E84
Further options to Loadports:
- InfoPad
- RFID Omron V640 standard, V680
- Camera mapping (for selected LP type)
ABD
The atmospheric batch degasser is ideal for repetitively accurate outgassing of organic substrates.
Very high benefit from it’s advantages when processing substrates with material mix (e.g. different emissivity’s of Cu and ABF).
AFLIP
Flipping substrate up side down for both side processing.
Robust design safe handling. Keep out zone handling (KOZ) available.
ITM, IMA, IMB
IMA & IMB, very compact hence fast airlocks for high throughput
Only one VTM flange for two “load locks”
Two step pump and venting. VTM never connected direct to airlock chamber
Buffer capability e.g. for pasting panel(s)
VTM
1-5 process module ports (SPM integration)
Up to 4 process gases
Integration of PVD, PVE
Modular, quick upgrades, isolated maintenance
SPM, Physical Etch, PVE
PSS600 capacitive plasma etch technology
Dual frequency for adjusting ion-bombardment and plasma density
Large area etch for low recontamination
Panel stationary during process avoids particles and top good chuck cooling
Latest design tuned for thinner, fragile substrates and highest plasma stability
Maximized adhesion and minimized Rc
Prepared for one chuckgas and up to 4 process gases
Integrated plasma power supplies for short cabling, low losses and stable condition
PVD
SSS600 with 4 rotatable cathodes
Largest targetlife with best target cooling
Moveable magnet for uniformity tuning
Panel stationary during process avoids particles and top good chuck cooling
Prepared for one chuckgas and up to 4 process gases
Integrated plasma power supplies for short cabling, low losses and stable condition
Chucks
Different chucks & chuck tops depending on requirement
Arctic for superb cooling in PVE
Designs for respecting keep out zones (KOZ)
Supply Units
ECR rack, including power feed arc flash, control computers and power distribution system to all modules
AFEM rack including atm. Robot controller and power distribution for all integrated components
Water, air supply system
Arctic chiller option for PVE
Read more about CLUSTERLINE® 600 in our LAYERS magazine
CLUSTERLINE® 600 - Perfect for next generation IC-substrates too!
