CLUSTERLINE® 600
Panel processing up to 650mm
From 300x300 to 650x650 – proven panel processing capability
Panel Level Packaging
- Portfolio of Degas, Etch and PVD technologies
- Reliable deposition of low contact resistance (Rc)
Advanced IC Substrates
- Emerging technologies including glass core
- Custom tool features including substrate flip
High Performance Computing and AI
- Backside metallization processes for thermal management
- Best substrate utilisation efficiency for large package sizes
Overview
A large area cluster tool for single panel processing, Evatec's panel tool was introduced in 2017. The latest version offers capability for substrate sizes up to 650mm x 650mm. It integrates degas, etch and deposition capabilities for Advanced Packaging applications including Fan-Out Panel Level Processing (FOPLP) and advanced IC substrate manufacturing.
Choose CLUSTERLINE® 600 for:
- Flexible cluster architecture
- Processing of glass or highly outgassing substrates
- Lowest particle counts and best cooling
- Degas, etch and deposition process know-how for UBM, RDL, TGV and metallization
Interactive Element
Click on the individual sections in the circle to read all the details.
AFEM
Atmospheric Front End Module
Front End integration for manipulating the substrates from the FOUP or customer cassette through the system and back. Incl. in-situ warpage measurement and full SECS/GEM integration
- Standard 5 Loadports (LP) are possible (with extension), option for 6th
- Operator Interface ( HMI) at front for side with drawer option for rapid process development
- "Test port" with drawer enabling simple manual substrate load for process development
Many options can be integrated to AFEM including:
- Panel temperature sensor
- Electrostatic sensor (ES)
- Warpage detection
- Additional ionizers (“Top”, IMB)
- Cameras for AFEM (4) incl. recorder
- Panel ID reader from bottom (standard) or top
- Overhead Transport OHT E84
ABD
Atmospheric Batch Degasser
- Evatec proprietary atmospheric batch degasser is ideal for precise, repeatable outgassing of organic substrates.
- Ideal when processing substrates with material mix (e.g. different emissivity’s of Cu and ABF).
AFLIP
Atmospheric Flipper
- Robust atmospheric "in situ" substrate flip for dual side processing.
- Keep out zone handling (KOZ) available.
ITM, IMA, IMB
2 stage Transfer module (TM) technology for rapid substrate transfer between atmospheric front end and central vacuum transfer module
- IMA & IMB - compact,fast airlocks for high throughput
- Two step pump and venting. VTM never connected direct to airlock chamber ensures most repeatable environment
- Buffer capability e.g. for pasting panel(s)
- Only 1 VTM flange taken up to support "in" and "out" processing
VTM
Central vacuum transfer module delivering substrates in and and out of single process modules ( SPMs)
- ports for integration of up to 5 single process module ports (etch or deposition)
- Dual arm robot for maximizing substrate handling efficiency
PVE
Stable, uniform etch technology at low particle levels
- PSS600 capacitive plasma etch technology
- Dual frequency for adjusting ion-bombardment and plasma density
- Panel "stationary" during process avoids particles and ensures good chuck cooling
- Handling of thin, fragile substrates
- Maximized adhesion and minimized Rc
- Prepared for one chuckgas and up to 4 process gases
- Integrated plasma power supplies for short cabling, low losses and stable processing
PVD
Uniform large area sputter deposition at low particle levels
- SSS600 with 4 rotatable cathodes
- Largest targetlife with best target cooling
- Moveable magnet for uniformity tuning
- Panel stationary during process avoids particles and ensures good chuck cooling
- Prepared for one chuckgas and up to 4 process gases
- Integrated plasma power supplies for short cabling, low losses and stable processing
Chucks
Evatec chuck technology optimized according to process
- Selection of substrate chucks & chuck tops optimized according to application
- "Arctic" option for superb cooling in PVE
- Designs for respecting "keep out zones" (KOZ)
Supply Units
Auxiliary equipment with easy access for maintenance
- ECR rack, including power feed arc flash, control computers and power distribution system to all modules
- AFEM rack including atm. Robot controller and power distribution for all integrated components
- Water, air supply system
- Arctic chiller option for PVE
Atmospheric Front End Module (AFEM)
The Atmospheric Front End Module handles the controlled transfer of large substrates from FOUPs or customer specific cassettes into the system. It supports stable panel handling through integrated warpage measurement and full SECS/GEM connectivity, ensuring reliable automation throughout the production flow. Up to five load ports can be equipped as standard, and a sixth can be added using an extension. The operator interface is positioned for efficient process development and can be relocated to accommodate additional load ports. The AFEM can be equipped with temperature and electrostatic sensors, enhanced warpage detection, ionizers, multiple cameras for monitoring, and flexible panel ID reading from either the bottom or top side. It also offers optional mapping and RFID solutions that enhance substrate verification and tracking. These features support consistent high quality handling of panels with varying materials, thicknesses, and mechanical properties.
Atmospheric Batch Degasser (ABD)
The Atmospheric Degasser provides uniform pre conditioning of organic and mixed material substrates before vacuum processing. “Batch” processing combines achieving the best throughput with a controlled thermal environment delivering consistent outgassing performance especially suited to panels that combine materials with different emissivity, such as copper and ABF. This stable degassing step contributes significantly to high quality adhesion, repeatable downstream etch or deposition processes.
Atmospheric Flipper (AFLIP)
For applications requiring processing on both sides of the panel, the Atmospheric Flipper rotates substrates safely and precisely. Its robust design ensures secure handling during inversion and maintains defined keep out zones to avoid contact with sensitive surface regions. Enjoy damage free dual side processing for advanced packaging workflows.
Interface Transfer Module (ITM, IMA, IMB)
The Interface Transfer Module family enables efficient transfer between the atmospheric environment and the vacuum system. The IMA and IMB configurations offer compact, fast cycling airlocks that minimize pump down time to maximize throughput. A two stage pump and vent sequence that avoids exposing the central vacuum transfer chamber directly to atmosphere, ensuring the most repeatable vacuum conditions. Integrated buffer capabilities allow temporary panel staging to balance cycle times across the cluster and support coordinated process sequences.
Vacuum Transfer Module (VTM)
The Vacuum Transfer Module houses the central robot handling system that distributes substrates between individual vacuum process modules. Supporting integration of up to five process module ports, the VTM can integrate etch and sputter technologies based on production process requirements.
Single Process Module – Physical Etch (PVE)
The Physical Etch module uses capacitive plasma technology to deliver uniform, stable etching performance across large substrates. Dual frequency control allows independent tuning of plasma density and ion bombardment energy for precise optimization of adhesion and contact resistance. Panels remains stationary during etching meaning that particle levels are minimized and the substrate chuck delivers the best cooling performance. Chamber design and substrate handling support thin and fragile substrates and is compatibility with a dedicated chuck gas supply for up to four process gases. The plasma power supplies are positioned close to the chamber to reduce electrical losses and ensure stable plasma characteristics for repeatable process conditions.
Single Process Module – Physical Vapor Deposition (PVD)
PVD modules incorporate a “four cathode sputtering architecture” with rotating targets for long lifetime and efficient cooling. A movable magnet assembly enables fine uniformity tuning across the full panel area. As with the etch module, the substrate remains stationary during deposition, minimizing particle formation and supporting high performance chuck cooling. The system is designed for operation with a single chuck gas supply and up to four process gases. Integrated plasma power supplies minimize cable length, ensuring low electrical losses and high process stability. The module supports deposition processes used in advanced packaging and IC substrate manufacturing, with consistent coating results across large areas.
Chucks
The platform supports a variety of chuck configurations tailored to process, substrate thickness, and keep out zone requirements. Specialized chuck designs ensure stable thermal management and reliable mechanical support across all module types. “Arctic” chucks are available for applications requiring superior cooling performance, particularly within PVE processes. Chuck tops can be selected to match specific substrate constraints, ensuring optimal clamping, temperature uniformity, and compatibility with sensitive panel zones.
Read more about CLUSTERLINE® 600 in our LAYERS magazine
CLUSTERLINE® 600 - Perfect for next generation IC-substrates too!
