LLS EVO II
Vertical sputter for metals, dielectrics and magnetic films
Flexible vertical batch sputter tool for metals, dielectrics and magnetics on substrates up to 230mm
Flexible Design
- Up to 5 sputter sources including co deposition
- Simple exchange between different substrate sizes
Extensive process know-how
- Degas, etch and deposition
- From metals and dielectrics to TCOs & soft magnetics
Production proven
- More than 300 tools around the world
- Customized solutions including front end automation
LLS EVO II
The LLS EVO II is a versatile batch sputtering system with a vertical, dynamic concept for up to 5 different materials and separation between load and process chamber (LC, PC). It accommodates any substrate size and shape up to 200 x 230mm. An installed base of over 300 tools worldwide has shown the tool to be reliable and robust production platform. Its flexibility, compact design and lower investment costs make it an ideal choice for smaller volume production alongside the larger single substrate processing tools in Evatec's product portfolio.
The tool can be equipped with configurable power supplies for high process flexibility. Substrate degas and etch in load chamber ensure high purity processes in the process chamber while easy conversion to various substrate sizes within 5 minutes make the LLS a flexible production tool.
Configuration
LLS EVO II features
- Up to 5 sputter sources with DC, DC pulsed, RF, RF/DC combined setup
- Co-sputtering from up to 3 cathodes
- Reactive sputtering with oxygen and nitrogen
- High vacuum system configurations with turbo pump, cryo pump and water trap
- Substrate heater for degas and increased process temperature
- Accommodation of any substrate type with size up to 200 x 230mm, or thickness up to 17mm
- Substrate tooling for full face deposition or customized edge exclusion, edge masking, shadow masking
- Automated cassette-to-cassette 6-axis robot handling as an option.
Process Know-How
Benefit from Evatec's long process experience delivering the LLS EVO II and previous generations across all standard materials used in the semiconductor and optoelectronics industries including:
- Production of aligned soft magnetic films
- Low damage film nucleation processes
- Reactive sputtering processes
Do you already have an LLS?
Then why not upgrade its capabilities to the latest standards?
- Learn about oval target technology that reduces your material costs and particles, or choose from Evatec alignment technology options for the deposition of aligned magnetic films.
- Find out about our high energy cathode technology and tailored magnet systems for increased deposition rates.
- Read about control system and other component modernization options to replace obsolete parts, improve uptime and extend system life.
- Our engineering team is ready to support you with custom engineering services like tooling design and manufacture.
Interactive Element
Click on the individual sections in the circle below to read all the details.
Handling
Whether you choose full face deposition,
shadow masking or customised edge
exclusion, LLS can be configured for either
manual load or fully automatic cassette to
cassette handling.
- Manual loading for complete or mixed
batches of substrate sizes of 2,3,4,5,6, and 8 inch. Change configuration of substrate
sizes in just a few minutes - Batch processing of substrates up to
maximum size of 200x230mm - 6 axis automated robot solution with
cassette buffer, flat/notch aligner and bar
code reade
Sputter Sources
Install up to 5 vertical cathodes in DC, RF,
mixed DC/RF or Pulsed DC mode. Parallel
operation for up to 3 sources enables higher
rates and allows mixtures or continous
phasing of different materials. Ask us about
the following source options.
- New oval cathode technology for reduced
materials cost and even lower particle
counts - “High Energy Cathode” technology
for improved throughput in high rate
metallisation processes ( Al & Al alloys) - High performance magnet systems for
extended life in sputter of both magnetic
and non magnetic materials
Etch
RF Etch and Ion Etching
RGA
Residual Gas analyzer is used to analyze atomic and molecular masses inside the vacuum chamber.
Temperature Controlling
Frontside Heating in LC and MC
Vacuum Creation
Integrated cryo-, turbo- and forepumps ensure stable high-vacuum conditions and rapid recovery times.
Additional Meissner water trap can be added to vacuum pumping systems to remove unwanted water.
Read more about LLS EVO II in our LAYERS magazine
Why wait?- Get the most out of your Evatec tool
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Buying a new Evatec tool is just the first step in a long term partnership. From initial ramp up support to ongoing maintenance or retrofits adding new capabilities, maximise both uptime and tool working life together with Evatec’s local customer service teams.
- We can help you plan and manage your stocks
- Use our exchange programmes to minimize downtimes
- Our local Field Service Engineers on hand when you need us
- Maximizing output - From Continuous Improvement Programmes (CIP) to new process installations
- Add new capabilities to support your technology roadmaps
- Helping you extend tool working life
- Helping you to help yourself
- Tailored just for you - At Evatec or in your own fab