Overview

CLUSTERLINE® 300 is a Swiss-engineered modular cluster platform built for high performance, durability, and scalability. Designed to meet the demands of high-mix, high-yield fabs, it supports single wafer processing through configurable Single Process Modules (SPM) and various pre- and post-treatment capabilities.

The architecture supports integration of PVD, PVE, and High Pressure Degasing (HPD) and Cooling – all within a single vacuum environment. Its modular design ensures fast upgrades, isolated maintenance, and long-term cost efficiency.

At the center of the system there is the Vacuum Transfer Module (VTM9E) enabling:

• Up to 6 treatment units for substrate conditioning and more
• 1 to 6 process module ports for SPM or HPD integration
• Fully automatic High Volumen Manufacturing (HVM) capabilities with automatic load ports including SEMI compliance for industry 4.0
• Pre-Alignment station, Wafer flipping station for back side metallization and buffer station for up to 12 wafers.
• Evatec unique Atmospheric Batch Degassing station (ABD)
• Compatible with numerous substrates types of heavy, bowed, glass, transparent, highly reflective
• Thin wafer handling capability down to 100 μm and wafer bow up to 6mm;
• Up to 4 process gases, including UHP capability
• automatic wafer dependent tool settings
• Turnkey Solution with minimal maintenance requirements

Process Know-How

Proven process capabilities come as standard when you choose CLUSTERLINE® 300 for a range of applications in Advanced Packaging, Power Devices, and Optoelectronics.

To read more about typical application examples download the CLUSTERLINE® FAMILY brochure or visit the news section of our website. Within LAYERS you can read about applications including OLED on CMOS and Integrated Voltage Regulators assembled directly on the microprocessor package.