At the center of the system there is the Vacuum Transfer Module (VTM9E) enabling:

• Up to 6 treatment units for substrate conditioning and more
• 1 to 6 process module ports for SPM or HPD integration
• Fully automatic High Volumen Manufacturing (HVM) capabilities with automatic load ports including SEMI compliance for industry 4.0
• Pre-Alignment station, Wafer flipping station for back side metallization and buffer station for up to 12 wafers.
• Evatec unique Atmospheric Batch Degassing station (ABD)
• Compatible with numerous substrates types of heavy, bowed, glass, transparent, highly reflective
• Thin wafer handling capability down to 100 μm and wafer bow up to 6mm;
• Up to 4 process gases, including UHP capability
• automatic wafer dependent tool settings
• Turnkey Solution with minimal maintenance requirements

The architecture supports integration of PVD, PVE, and High Pressure Degasing (HPD) and Cooling – all within a single vacuum environment. Its modular design ensures fast upgrades, isolated maintenance, and long-term cost efficiency.

System Highlights

Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics.

• Integration of single process modules for PVD, highly ionized PVD, and Soft Etch
• Thin wafer handling capability down to 100 μm and wafer bow up to 6mm;
• 200/300mm bridge or split tool compliant
• New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications
• Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm
• Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)
• SCARA robot options with 5-axis
• Wafer flip station for back side metallization and buffer station for up to 6 wafers
• Integration of up to six single substrate processing

Configuration

• Magnetically driven robot system with dual bi-symmetric arms
• Production-proven wafer handling and processing capability for thin wafers
• Most accurate wafer placement and automatic wafer alignment correction under vacuum
• Integration of up to six single substrate processing modules (SPMs), 2 batch drum modules (BMD) or a mixture

Process Modules / Components

• ICP soft etch module - SiO2 removal rate, 0.6 - 0.8 nm/sec
• Highly ionized PVD source for high aspect ratio TSV applications - mainly for 3D packaging
• Controlled chuck temperature from -30 up to 500°C
• Metal or ceramized chuck with mechanical wafer clamping
• ESC or clampless chuck with shadow mask
• Hot or cold ESC for best temperature control
• Clamped chuck configuration with gas conduction back side heater/cooler for precise temperature control and chuck RF Bias
• ARQ 310 DC or pulsed DC sputter source with uniformity compensation over target life
• ARQ 320 RF, RF-DC, DC or pulsed DC sputter source with improved Particle and uniformity.
• Longlife Targets with direct cooling for COO improvement
• Multisource with rotating chuck - up to 4 RF or DC sources on one module for single or co-sputter
• Optional APC with fully integrated Pyrometer and process gas monitor
• Optimized configuration for organic/mold substrates
• ICP soft etch process module with MF Plasma enhanced RF Etch enabling high etch rate and excellent uniformity at low bias voltages. Reactive processing with H2, N2, CH4 and O2 is available
• Cooled Metal Cage (Ice Dome) and arctic chuck cooling down to -30°C, enabling highest kit life in the etch module for organic wafers like PI or PBO
• Atmospheric Batch Degasser with up top 44 slots for strongly outgassing Advanced Packaging Substrates
• BMD batch module drum(s) for deposition of soft magnetic layers on 300mm

Process Know-How

Proven process capabilities come as standard when you choose CLUSTERLINE® 300 for a range of applications in Advanced Packaging, Power Devices, and Optoelectronics.

To read more about typical application examples download the CLUSTERLINE® FAMILY brochure or visit the news section of our website. Within LAYERS you can read about applications including OLED on CMOS and Integrated Voltage Regulators assembled directly on the microprocessor package.

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