Major system components - a quick guide

Click on the individual sections in the circle for a quick overview, and then find more information further down the page.

Atmospheric Front End Module (AFEM)

A compact atmospheric front-end module provides a clean ISO Class 1 handling environment. Integrated filtration ensures contamination‑free wafer transfer, while transparent side access points and viewports support safe observation and maintenance. Up to three FOUP‑compatible load ports can be incorporated and automated wafer loading is fully SEMI‑compliant to meet high‑volume manufacturing standards. The system supports manual loading or factory‑automation logistics such as AGV, PGV, or overhead transport systems. Precise wafer presentation is ensured through automated substrate mapping, rotational alignment, and active centering. Optional extensions, such as an atmospheric buffer or a wafer flipping unit, enable efficient handling for back‑side metallization processes. The module is designed to accommodate different substrate characteristics including heavy, transparent, reflective, or bowed wafers, and supports thin wafer handling down to 100 µm.

Atmospheric Batch Degasser (ABD)

For applications involving organic mold compounds or substrates with highly outgassing passivation layers, Evatec’s innovative atmospheric batch degasser offers a high throughput, consistent pretreatment step. The unit conditions wafers at carefully controlled temperatures that remain within polymer curing limits and uses a flow of heated dry purge gas to accelerate the removal of volatile species. Its “batch” configuration supports standard and extended cassette capacities and incorporates automated wafer mapping.

Vacuum Transfer Module (VTM)

At the heart of the CLUSTERLINE® 300 is the vacuum transfer module, which links all processing and treatment stations within a unified high‑vacuum environment. It serves up to six process module ports, enabling flexible integration of single process module (SPM) units. Integrated heaters stabilize internal temperatures, while the routing of up to four ultra‑high‑purity gases ensures controlled, contamination‑free supply to the connected modules.
A vacuum‑compatible robot handler equipped with Evatec end effectors manages wafer movement with “on‑the‑fly” alignment compensation across all stations. The module is compatible with automated load lock operation and can accommodate a pre‑alignment station, a wafer flipping station for back‑side processing, and a buffer station capable of holding up to twelve wafers. The entire transfer architecture is optimized for high‑volume operation with SEMI‑compliant automation and minimal maintenance demands.

Interface Module Treatment Units (IMs)

Located between the transfer module and the process chambers, the interface modules enable integration of optional thermal and vacuum‑conditioning steps. Depending on configuration, this can include cooling functions, lamp‑based degassing, or vacuum buffering to stabilize wafers prior to or after processing. Sight‑glass options allow process visualization while water‑cooled elements and traps help maintain stable thermal conditions and a clean vacuum environment.

Single Process Modules (SPM)

The single process modules are designed to support a wide spectrum of semiconductor manufacturing applications, including advanced CMOS, memory, power devices, packaging, MEMS, wireless technologies and optoelectronics / photonics. Each module accepts wafers from 8‑ to 12‑inch diameter, with full capability for thin wafer handling. Modular chuck designs enable fast wafer size changeovers, maximizing tool uptime and production flexibility. The high‑vacuum chamber incorporates precise upstream and downstream pressure control to maintain stable deposition and etch conditions. In PVD configuration modules integrate high‑uniformity planar magnetron sources operated in RF, DC, RF‑DC, or HIS modes, complemented by rotating magnet systems that maintain consistent target utilization and high uniformity deposition over 300mm. Directional deposition options including Evatec’s Adavnced Directional Sputtering (ADS) support coating of high‑aspect‑ratio structures such as trenches and TSVs. Multisource arrangements with up to four PVD sources and a rotating chuck enable efficient recipe versatility within a single module. For soft etch processes, the ICP‑based PVE configuration provides low‑bias operation using reactive gases such as hydrogen, nitrogen, or oxygen.

Chuck Options

A range of chuck designs supports the diverse thermal and electrical requirements of different processes and substrate types. Available technologies include electrostatic, clamped, clampless, recessed, and RF‑biased chucks. Advanced thermal management options extend cooling capability down to –30 °C through Arctic chuck or Ice Dome systems, while high‑temperature operation up to 750 °C enables demanding deposition and thermal treatment sequences.

Supply

The platform incorporates all required electrical generation and media distribution systems needed to operate the vacuum environment, process chambers, thermal control units, and gas delivery infrastructure. This integrated supply architecture ensures stable operation, predictable maintenance intervals, and a reliable foundation for continuous high‑volume manufacturing.