CLUSTERLINE®

Cluster architecture 200mm, 300mm and 600mm formats

 

CLUSTERLINE® Family

CLUSTERLINE® are a family of platforms named according to their substrate size capability. All platforms share cluster architecture with cassette-to-cassette processing and fully automated handling. Production solutions on CLUSTERLINE® cross all 6 Evatec core markets.

Whatever your application, our specialists can help you configure an ideal CLUSTERLINE® platform for you. We deliver complete process solutions including highly aligned magnetic films, high performance piezoelectrics like AlScN for broadband RF filters and highly efficient energy harvesting devices, high aspect ratio TSV metallization in Advanced Packaging or precise deposition of TCOs and multilayer dielectrics for the latest micro LED and 3D filter technologies.

Read more in our brochure

CLN 200 New

CLUSTERLINE® 200

From thin wafer handling and backside metallization processes to deposition of new piezoelectric materials like AIScN or production of precise NIR bandpass filters for consumer device applications – CLUSTERLINE® 200 delivers. Its modular design supports seamless PVD, PVE, PECVD, and PEALD integration, enabling unmatched process flexibility, fab efficiency, and scalability.

CLN 300 New

CLUSTERLINE® 300

From thin wafer handling and backside metallization processes to WLCSP and FOWLP applications on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.

PNL600 E Evatec

CLUSTERLINE® 600

Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.

CLUSTERLINE® Family Brochure

CLUSTERLINE® Family Video

Read more about theCLUSTERLINE® Family in our LAYERS magazine

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Innovations & Opportunities in Panel Level Packaging

Evatec is driving the next wave of Panel Level Packaging, from 310x310 mm to 650x650 mm panels, unlocking higher bandwidth and cost efficiency for AI chiplets.

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Welcome to Advanced Directional Sputtering (ADS)

Evatec’s ADS technology tackles the limits of conventional sputtering, delivering superior coverage and reliability for complex device architectures in power, RF, and advanced packaging.
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PEALD: The new kid on the CLUSTERLINE® block

Evatec’s new PEALD module for CLUSTERLINE® 200 delivers ultra-thin, highly conformal films with atomic-level thickness control, even on complex geometries. Ideal for sensitive materials and low-temperature processes, it opens new possibilities for advanced device architectures.

Buying a new Evatec tool is just the first step in a long term partnership. From initial ramp up support to ongoing maintenance or retrofits adding new capabilities, maximise both uptime and tool working life together with Evatec’s local customer service teams.
CS Icons Spareparts
  • We can help you plan and manage your stocks
  • Use our exchange programmes to minimize downtimes
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  • Our local Field Service Engineers on hand when you need us
  • Maximizing output - From Continuous Improvement Programmes (CIP) to new process installations
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  • Add new capabilities to support your technology roadmaps
  • Helping you extend tool working life
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  • Helping you to help yourself
  • Tailored just for you - At Evatec or in your own fab

Want to know more?

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