CLUSTERLINE®
Cluster architecture 200mm, 300mm and 600mm formats
CLUSTERLINE® FAMILY
CLUSTERLINE® are a family of platforms named according to their substrate size capability. All platforms share cluster architecture with cassette-to-cassette processing and fully automated handling. Production solutions on CLUSTERLINE® cross all Evatec core markets.
Whatever your application, our specialists can help you configure an ideal CLUSTERLINE® platform for you. We deliver complete process solutions including high performance piezoelectrics like AlScN for broadband RF filters and highly efficient energy harvesting devices, high aspect ratio TSV metallization in Advanced Packaging or precise deposition of TCOs , multilayer dielectrics, Hugh reflectivity and antireflection coatings for the latest micro LED and EEL technologies .
CLUSTERLINE® 200
From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.
CLUSTERLINE® 200 BPM
Part of the CLUSTERLINE® Family, the BPM is a cassette-to-cassette dynamic batch sputter tool offering high throughput and precision in MEMS, Wireless, Optoelectronics, and Photonics applications. Choose the BPM for the best uniformities and the lowest particle levels in high volume applications.
CLUSTERLINE® 300
From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the depoistion of soft magnetics for integrated voltage regulations on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.
CLUSTERLINE® 600
Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.