HEXAGON

HEXAGON

Process 300 or 200 mm organic passivated wafers at typical throughputs of 50Wph without downstream contamination. HEXAGON is the production platform that puts you ahead in UBM, RDL, TSV and Fanout.

Evatec wins SJ Semi award

Evatec Advanced Packaging group wins supplier award at SJ SEMICONDUCTOR CORPORATION.

TFME

PVD Technologies

Find out how Evatec's evaporation and sputter technology know-how can help you increase your yields and drive down your costs.

Etch Technologies

From modification of sensitive coatings to high rate layer removal, read more about Evatec plasma source technology covering applications at wafer or panel level. 

Wafer Level Packaging / OSATs

Learn about our innovative thin film solutions for wafer and panel level packaging applications such as WLCSP, FO WLP, FO PLP, 2.5D, 3D and advanced IC substrates.

Company Overview

Our technology has been shaping the world for over 70 years. Find out more about our company, our products and how Evatec thin films are everywhere in our daily lives.