THE NEW HEXAGON IS HERE

The new HEXAGON is here.  Our new HEXAGON is the perfect choice for FOWLP, delivering the lowest Rc values at the best cost of ownership.

Evatec LAYERS 8 SAP Power HEXAGON D6 SP

Evatec LAYERS7 TOWARDS PERFECTION WITH HEXAGON

COMING SOON - THE NEW HEXAGON

LAYERS 7- Towards perfection with the new HEXAGON

The new HEXAGON maintains the existing strengths of proven and reliable processes, high throughput and then offers significant improvements and innovations in the areas of process capabilities, throughput, uptime, accessibility and serviceability.

HEXAGON

Process 300 or 200 mm substrates with highest throughput achieving lowest Rc in the industry. HEXAGON is the production platform that puts you ahead in UBM, RDL and Fanout.

HEXAGON

LAYERS 8 – Cross-Contamination in Multi-Chamber PVD Systems

Find out in the study of Fraunhofer and Evatec why HEXAGON PVD systems are ideal for modern WLP applications.

Evatec LAYERS 8 SAP Crosscontamination SP

Evatec LAYERS 8 SAP HEXAGON Rc SP

Wafer Level Packaging

Discover Evatec's Thin Film Solutions for Wafer-Level Packaging: Bumping (UBM), Fan-Out Wafer-Level Packaging (FO-WLP), and Back-Side Metal (BSM) Applications 

Evatec LAYERS 8 Semiadvpack Chapter

Evatec LAYERS7 CO CEO Welcome

EVATEC HEXAGON CH Edition3 July2022 WEB

Evatec wins SJ Semi award

Evatec Advanced Packaging group wins supplier award at SJ SEMICONDUCTOR CORPORATION.

PVD Technologies

Find out how Evatec's evaporation and sputter technology know-how can help you increase your yields and drive down your costs.

LAYERS 7 - REACH OUT AND GET YOUR COPY NOW

The 7th edition of our thin film technology magazine “LAYERS” has just been released. Get a taste of what’s inside and order your copy now.

Evatec LAYERS 8

Etch Technologies

From modification of sensitive coatings to high rate layer removal, read more about Evatec plasma source technology covering applications at wafer or panel level. 

Company Overview

Our technology has been shaping the world for over 70 years. Find out more about our company, our products and how Evatec thin films are everywhere in our daily lives. 

Power Devices

Benefit from Evatec's long experience in Power Device applications to increase your productivity, process stability and yield in volume production of MOSFETs, IGBTs, IGCTs, LDMOS, SiC and GaN Power Devices.

TFME

Evatec Layers 4 Ap Tfme

Evatec LAYERS 8 SAP Clusterline600 SP

Evatec LAYERS7 USA Web 4

Evatec LAYERS7 Global Web 3

AP_INSIGHTS_LAYERS6

LAYERS 6 - PACKAGING