Skyater 2019

CLUSTERLINE® Family

Benefit from the CLUSTERLINE® reputation of secure handling and precision processing on a range of platform sizes up to 650mm in applications across all Evatec core markets. 

CLUSTERLINE FAMILY

CLUSTERLINE® 300

From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the deposition of soft magnetics for integrated voltage regulators on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.

Wireless

At the forefront of PVD production technology, Evatec's deposition processes for metals, contracts & electrodes, piezoelectrics, and dielectrics empower device technologies such as RF Filters (SAW & BAW), HBT on GaAs, HEMT technology on GaN, and IR devices.

CLUSTERLINE® 200

From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.

Panel Level Packaging / Foundries / IDMs

Benefit from Evatec's long experience in Power Device applications to increase your productivity, process stability and yield in volume production of MOSFETs, IGBTs, IGCTs, LDMOS, SiC and GaN Power Devices.

Power Devices

Learn more about Evatec technologies for metals, dielectrics and Advanced Functional Materials (Magnetics and Piezoelectrics) used in RF-MEMS, Sensors, Actuators, TFH and Soft-Magnetics in IVRs.

CLUSTERLINE® 600

Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.

Company Overview

Our technology has been shaping the world for over 70 years. Find out more about our company, our products and how Evatec thin films are everywhere in our daily lives.