CLUSTERLINE Family

Benefit from the CLUSTERLINE® reputation of secure handling and precision processing on a range of platform sizes up to 650mm in applications across all Evatec core markets. 

CLUSTERLINE® Family

Benefit from the CLUSTERLINE® reputation of secure handling and precision processing on a range of platform sizes up to 650mm in applications across all Evatec core markets. 

Evatec LAYERS 8 CP Optoelectronics Sidewall SP

MEMS

Evatec supports production solutions for the metals, dielectrics and Advanced Functional Materials (Magnetics and Piezoelectrics) used in Sensors, Actuators, TFH and Quantum Computing. 

CLN 300

Evatec LAYERS7 SE Front End Integration

Evatec LAYERS 8 SAP Power HEXAGON D6 SP

Skyater 2019

CLUSTERLINE 200 BPM

CLUSTERLINE 200 BPM_Dec2021

Power Devices

Benefit from Evatec's long experience in Power Device applications to increase your productivity, process stability and yield in volume production of MOSFETs, IGBTs, IGCTs, LDMOS, SiC and GaN Power Devices.

Evatec LAYERS7 SE Power Devices

Evatec LAYERS 8 CP Photonics Metalenses SP

Company Overview

Our technology has been shaping the world for over 70 years. Find out more about our company, our products and how Evatec thin films are everywhere in our daily lives. 

Evatec LAYERS 8 SAP PCB SP

Evatec LAYERS 8 SAP PCB SP (1)

Precision Optics

Evatec thin film technology supports the economical manufacture of highly accurate optical components ensuring optimal performance in systems that rely on precise light manipulation.

CLUSTERLINE® 300

From thin wafer handling and backside metallization processes to WLCSP and FOWLP packaging applications, or the deposition of soft magnetics for integrated voltage regulators on 300mm, contact us to find out more about CLUSTERLINE® 300 configuration options and corresponding process capabilities.

PEALD Technology

With innovative features like a microwave plasma source and in-situ post-treatment capabilities, enjoy precise deposition of thin dielectric films at low temperatures.

CLUSTERLINE® 200

From thin wafer handling and backside metallization processes, to deposition of new piezoelectric materials like AlScN or production of precise NIR bandpass filters for consumer device applications, find out more about CLUSTERLINE® 200 configuration options and corresponding process capabilities.

Wireless

Evatec leads in PVD production, offering advanced processes for metals, contacts, piezoelectrics, and dielectrics. We enable RF filters, power amplifiers, HEMT on GaN, and IR devices. Our high-volume, high-performance solutions set the wireless market standard.

Evatec LAYERS 8 Compoundphotonics Chapter

CLUSTERLINE® 600

Large area cluster tool dedicated to Advanced Packaging applications at panel level integrating Evatec know-how in degas, etch and deposition.

Evatec LAYERS 8

Evatec LAYERS 8 Semiadvpack Chapter

Evatec LAYERS7 USA Web 4

Evatec LAYERS7 Global Web 3